MC9S12XDT512VPV vs MC9S12XDT512MAA Comparación
Comparación detallada lado a lado de MC9S12XDT512VPV por NXP Semiconductors y MC9S12XDT512MAA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MC9S12XDT512VPV - HCS12X 512KB Flash MCU | NXP Semiconductors
MC9S12XDT512VPV ✓ Activo
Comparación de especificaciones
| Parámetro | MC9S12XDT512VPV | MC9S12XDT512MAA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $11,25 | $0,00 |
| Core Architecture | HCS12X (CPU12X + XGATE co-processor) | — |
| Flash Memory | 512 KB | — |
| RAM | 32 KB | — |
| EEPROM | 4 KB | — |
| Maximum CPU Frequency | 40 MHz | — |
| Operating Voltage | 3.15 V to 5.5 V | — |
| Encapsulado | LQFP-112 (20x20 mm, gull-wing) | 80-QFP (14x14 mm), Square, Gull Wing |
| Number of Terminals | 112 | — |
| Terminal Form | GULL WING | — |
| Package Shape | SQUARE | — |
| Temperature Grade | INDUSTRIAL | — |
| CAN Controllers | 2 (MSCAN, CAN 2.0 A/B) | — |
| ADC | 10-bit, up to 24 channels | — |
| PWM Channels | 4 (with hardware fault input) | — |
| XGATE Channels | Up to 32 interrupt sources | — |
| Moisture Sensitivity Level | 3 (per JEDEC J-STD-020) | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| Tensión de alimentación | — | [DATA_NEEDED: supply voltage range] |
| Temperatura de funcionamiento | — | -40C to +125C (TA) |
| Tipo de montaje | — | Surface Mount |
| Packaging Method | — | Tray |
| Sin halógenos | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |