MC9S12XDT512VPV vs MC9S12XDT512MAA Comparaison
Comparaison détaillée côte à côte de MC9S12XDT512VPV par NXP Semiconductors et MC9S12XDT512MAA par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MC9S12XDT512VPV - HCS12X 512KB Flash MCU | NXP Semiconductors
MC9S12XDT512VPV ✓ Actif
Comparaison des spécifications
| Paramètre | MC9S12XDT512VPV | MC9S12XDT512MAA |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $11,25 | $0,00 |
| Core Architecture | HCS12X (CPU12X + XGATE co-processor) | — |
| Flash Memory | 512 KB | — |
| RAM | 32 KB | — |
| EEPROM | 4 KB | — |
| Maximum CPU Frequency | 40 MHz | — |
| Operating Voltage | 3.15 V to 5.5 V | — |
| Boîtier | LQFP-112 (20x20 mm, gull-wing) | 80-QFP (14x14 mm), Square, Gull Wing |
| Number of Terminals | 112 | — |
| Terminal Form | GULL WING | — |
| Package Shape | SQUARE | — |
| Temperature Grade | INDUSTRIAL | — |
| CAN Controllers | 2 (MSCAN, CAN 2.0 A/B) | — |
| ADC | 10-bit, up to 24 channels | — |
| PWM Channels | 4 (with hardware fault input) | — |
| XGATE Channels | Up to 32 interrupt sources | — |
| Moisture Sensitivity Level | 3 (per JEDEC J-STD-020) | — |
| Core Processor | — | HCS12X |
| Core Size | — | 16-Bit |
| Maximum Clock Speed | — | 80 MHz |
| Program Memory Size | — | 512KB (512K x 8) |
| Program Memory Type | — | FLASH |
| RAM Size | — | 20KB |
| EEPROM Size | — | 4KB |
| Connectivity | — | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| Peripherals | — | LVD, POR, PWM, WDT |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| Tension d'alimentation | — | [DATA_NEEDED: supply voltage range] |
| Température de fonctionnement | — | -40C to +125C (TA) |
| Type de montage | — | Surface Mount |
| Packaging Method | — | Tray |
| Sans halogène | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |