MC9S12XEQ384CAG vs MC9S12DT256CMPV Vergleich
Detaillierter Direktvergleich von MC9S12XEQ384CAG von NXP Semiconductors und MC9S12DT256CMPV von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP
MC9S12DT256CMPV ✓ AktivSpezifikationsvergleich
| Parameter | MC9S12XEQ384CAG | MC9S12DT256CMPV |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $0,00 | $11,50 |
| Core Processor | HCS12X (16-bit CISC) | — |
| Core Size | 16-bit | — |
| Bus Speed | 50 MHz | — |
| Co-processor | XGATE RISC co-processor | — |
| Flash Memory | 384 KB (384K x 8) | — |
| RAM Size | 24K x 8 | — |
| EEPROM | Hardware-emulated EEPROM (programmable, flexible) | 4 KB |
| ADC Resolution | 12-bit | — |
| ADC Conversion Time | 3 us | — |
| Timers | Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI) | — |
| Memory Protection | MPU with supervisor/user modes | — |
| I/O Ports | [DATA_NEEDED: I/O Ports count] | — |
| Betriebstemperatur | -40C to +85C (TA) | — |
| Montageart | Surface Mount | Surface Mount (LQFP, gull-wing) |
| Gehäuse | 144-LQFP (20x20 mm) | LQFP-112 |
| Packaging | Tray | — |
| Versorgungsspannung | [DATA_NEEDED: Supply Voltage] | — |
| Lifecycle Stage | Active | — |
| Core Architecture | — | HCS12 (S12) 16-bit CISC |
| Bus Frequency | — | Up to 50 MHz |
| Program Flash | — | 256 KB |
| RAM | — | 12 KB |
| Pin-Anzahl | — | 112 |
| Operating Voltage | — | 5.0 V (4.5 V to 5.5 V) |
| Temperature Grade | — | Automotive (-40C to +125C) |
| ADC | — | 2 x 8-channel 10-bit |
| PWM Channels | — | 8 channels |
| Enhanced Capture Timer | — | 8-channel (ECT) |
| SCI (UART) Interfaces | — | 2 |
| SPI Interfaces | — | 2 |
| CAN Modules | — | 1 x msCAN (CAN 2.0A/B) |
| GPIO (Approx.) | — | 20 discrete digital I/O lines |
| Debug Interface | — | Background Debug Mode (BDM) |
| RoHS-Status | — | Compliant (per NXP product page) |