MC9S12XEQ384CAG vs MC9S12DT256CMPV Comparação

Comparação detalhada lado a lado de MC9S12XEQ384CAG por NXP Semiconductors e MC9S12DT256CMPV por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MC9S12XEQ384CAG MC9S12XEQ384CAG - 16-bit 50MHz MCU 384KB Flash | NXP

MC9S12XEQ384CAG - 16-bit 50MHz MCU 384KB Flash | NXP

MC9S12XEQ384CAG ✓ Ativo
NXP Semiconductors
MC9S12DT256CMPV MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP

MC9S12DT256CMPV - 16-Bit 50MHz Automotive MCU, 256KB Flash | NXP

MC9S12DT256CMPV ✓ Ativo

Comparação de especificações

Parâmetro MC9S12XEQ384CAG MC9S12DT256CMPV
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $0,00 $11,50
Core Processor HCS12X (16-bit CISC) —
Core Size 16-bit —
Bus Speed 50 MHz —
Co-processor XGATE RISC co-processor —
Flash Memory 384 KB (384K x 8) —
RAM Size 24K x 8 —
EEPROM Hardware-emulated EEPROM (programmable, flexible) 4 KB
ADC Resolution 12-bit —
ADC Conversion Time 3 us —
Timers Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI) —
Memory Protection MPU with supervisor/user modes —
I/O Ports [DATA_NEEDED: I/O Ports count] —
Temperatura de operação -40C to +85C (TA) —
Tipo de montagem Surface Mount Surface Mount (LQFP, gull-wing)
Encapsulamento 144-LQFP (20x20 mm) LQFP-112
Packaging Tray —
Tensão de alimentação [DATA_NEEDED: Supply Voltage] —
Lifecycle Stage Active —
Core Architecture — HCS12 (S12) 16-bit CISC
Bus Frequency — Up to 50 MHz
Program Flash — 256 KB
RAM — 12 KB
Contagem de pinos — 112
Operating Voltage — 5.0 V (4.5 V to 5.5 V)
Temperature Grade — Automotive (-40C to +125C)
ADC — 2 x 8-channel 10-bit
PWM Channels — 8 channels
Enhanced Capture Timer — 8-channel (ECT)
SCI (UART) Interfaces — 2
SPI Interfaces — 2
CAN Modules — 1 x msCAN (CAN 2.0A/B)
GPIO (Approx.) — 20 discrete digital I/O lines
Debug Interface — Background Debug Mode (BDM)
Status RoHS — Compliant (per NXP product page)

Fichas técnicas e recursos

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