MCF5234CVM100 vs MCF5232CVM100 Vergleich
Detaillierter Direktvergleich von MCF5234CVM100 von NXP Semiconductors und MCF5232CVM100 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | MCF5234CVM100 | MCF5232CVM100 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $12,10 | $19,20 |
| Core Architecture | ColdFire V2 (32-bit RISC, 4-stage pipeline) | ColdFire V2 (32-bit RISC) |
| Core Frequency | 100 MHz | 100 MHz |
| On-Chip SRAM | 64 KB | — |
| Flash / ROM | ROMless (external bus) | — |
| Operating Voltage | 3.0 V to 3.3 V | — |
| Gehäuse | 256-ball MAPBGA (17x17 mm) | 196-LBGA (MAP-BGA) 15x15 mm |
| Ethernet MAC | 10/100 Mbps (FEC) | 10/100 Mbps (FEC) |
| eTPU Channels | 16 | — |
| DMA Channels | 4 x 32-bit | — |
| UART / I2C / SPI / CAN | 3 UARTs / 2 I2C / 1 QSPI / 1 CAN 2.0B | — |
| External Bus | 32-bit with chip-select logic | — |
| Encryption Accelerator | Hardware (DES/3DES/AES, family-dependent) | Hardware-accelerated (integrated) |
| Betriebstemperatur | -40C to +85C (industrial) | -40C to +85C (industrial) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) | NRND (Not Recommended for New Designs) |
| MSL-Level | 3 | — |
| Performance | — | 125 Dhrystone 2.1 MIPS |
| On-chip SRAM | — | 64 KB |
| On-chip Cache | — | 8 KB I-cache / 8 KB D-cache (configurable) |
| On-chip ROM | — | ROMless |
| Enhanced Timer (eTPU) | — | 16 channels |
| DMA | — | 4-channel + external request/acknowledge |
| External Bus Interface | — | 32-bit (SRAM/ROM/Flash/DDR) |
| Versorgungsspannung | — | 1.5V core / 3.3V I/O (typical) |
| RoHS-Status | — | Compliant |