MCF5234CVM100 - 100MHz ColdFire V2 MCU, 64KB SRAM | NXP
Teilenummer: MCF5234CVM100 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.9 | $18,90 |
| 10 | $17.2 | $172,00 |
| 100 | $15.45 | $1.545,00 |
| 500 | $13.8 | $6.900,00 |
| 1.000 | $12.1 | $12.100,00 |
MCF5234CVM100 Übersicht
A ColdFire V2 microprocessor is a 32-bit RISC architecture derived from the original Motorola 68k family, optimized for embedded deterministic control with a variable-length instruction set. In the broader taxonomy it sits between 8/16-bit microcontrollers and high-performance application processors, with system positioning as: ColdFire V2 -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. The ColdFire family is purpose-built for deterministic real-time response and low interrupt latency in motor and motion control, factory automation and Ethernet-attended edge nodes.
Key features include a 100 MHz core with 1.44 Dhrystone 2.1 MIPS per MHz throughput, 64 KB on-chip SRAM, 32 KB cache/ROM configurable area, four 32-bit DMA timers, 4-channel 32-bit DMA controller, fast Ethernet MAC (FEC), three UARTs, two I2C channels, queued SPI, CAN 2.0B controller, 16-channel eTPU for timing-critical I/O, hardware encryption accelerator, and a 16-bit external bus with chip-select logic.
Architecturally the V2 core uses a 4-stage pipeline and a Variable-Length RISC encoding that keeps code density near 68k levels while raising performance to ARM7-class throughput. The FEC, eTPU, encryption engine and DMA are interconnected via an internal peripheral bus, so designers can offload motor-control loops, network packets and crypto without core intervention.
Typical applications include industrial motion and motor control, factory automation with EtherNet/IP or Modbus TCP, building automation gateways, security and access control panels, POS terminals, networked printers, and automotive body/chassis ECUs. The integrated 10/100 Ethernet MAC makes the part especially attractive for industrial protocol conversion at the edge.
Design considerations: the MAPBGA package demands careful 4-layer or 6-layer PCB stack-up with controlled-impedance Ethernet traces; supply decoupling must be placed directly under the BGA balls with via-in-pad recommended for the inner ring. Plan boot-mode strapping and JTAG/BDM access early; the device is ROMless so external boot Flash is mandatory.
This page synthesizes distributor pricing, NRND lifecycle notes, drop-in alternatives and practical design guidance not found in the manufacturer datasheet alone.
Drop-in-Alternativen für MCF5234CVM100 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCF5234CVM100 (gleiche Bauform und Footprint) – abweichend in Package, Ethernet MAC, Program Memory Type, Core Architecture, Core Processor.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCF5235CVM100
✅ Drop-In✓ Auf Lager
$25.4 / Stück
Datenblatt ansehen →MCF5234CVM150
✅ Drop-In✓ Auf Lager
$17.6 / Stück
Datenblatt ansehen →MCF5235CVM150
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MCF5234CVM100 Grenzwerte & elektrische Eigenschaften
| Core Architecture | ColdFire V2 (32-bit RISC, 4-stage pipeline) |
| Core Frequency | 100 MHz |
| On-Chip SRAM | 64 KB |
| Flash / ROM | ROMless (external bus) |
| Operating Voltage | 3.0 V to 3.3 V |
| Gehäuse | 256-ball MAPBGA (17x17 mm) |
| Ethernet MAC | 10/100 Mbps (FEC) |
| eTPU Channels | 16 |
| DMA Channels | 4 x 32-bit |
| UART / I2C / SPI / CAN | 3 UARTs / 2 I2C / 1 QSPI / 1 CAN 2.0B |
| External Bus | 32-bit with chip-select logic |
| Encryption Accelerator | Hardware (DES/3DES/AES, family-dependent) |
| Betriebstemperatur | -40C to +85C (industrial) |
| Montageart | Surface Mount (BGA) |
| Lebenszyklusstatus | NRND (Not Recommended for New Designs) |
| MSL-Level | 3 |
MCF5234CVM100 256-ball mapbga (17x17 mm) Pinbelegungsleitfaden
Pinbelegung für MCF5234CVM100 (256-ball mapbga (17x17 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MCF5234CVM100.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MCF5234CVM100 ist geeignet für 6 Anwendungs: Industrial Motor Control, Factory Automation Gateways, Building Automation Controllers, Security and Access Control Panels, Point-of-Sale Terminals, Networked Printers and Imaging.
Industrial Motor Control
The MCF5234CVM100 fits industrial motor control loops because its 100 MHz ColdFire V2 core delivers 144 MIPS with deterministic interrupt response, while the four 32-bit DMA timers and four-channel DMA offload time-critical PWM generation from the CPU. At 3.3 V single-supply and 64 KB of single-cycle SRAM the part can run a current/torque loop at typical 10-20 kHz while leaving headroom for a CANopen or Modbus RTU stack. The 256-ball MAPBGA exposes a 32-bit external bus, so designers add external Flash for log storage without disturbing deterministic timing.
Empfohlen
Factory Automation Gateways
The MCF5234CVM100 is well suited to factory automation gateways because the integrated 10/100 Ethernet MAC removes the need for an external MAC chip, and the three UARTs plus CAN 2.0B controller let a single MCU bridge Modbus TCP, Modbus RTU, EtherNet/IP and CANopen on one board. With 64 KB on-chip SRAM the part runs a TCP/IP stack and a Modbus master concurrently without external memory expansion. The 3.0-3.3 V supply matches typical industrial 24V-to-3V3 buck rails, simplifying EMC-compliant design.
Empfohlen
Building Automation Controllers
The MCF5234CVM100 targets building automation controllers (BACnet, LonWorks gateways, HVAC controllers) thanks to its deterministic ColdFire V2 core, integrated Ethernet MAC and rich serial peripheral set (3 UARTs, 2 I2C, 1 QSPI, 1 CAN). 64 KB SRAM handles BACnet/IP stacks comfortably and the ROMless external bus supports large firmware updates over the air. Industrial temperature range -40C to +85C covers unconditioned mechanical rooms and rooftop installations.
Empfohlen
Security and Access Control Panels
The MCF5234CVM100 is a strong fit for networked security/access-control panels because its Ethernet MAC enables IP-based panel reporting, the CAN bus interfaces with door/window sensor networks, and the UARTs drive card readers and alarm keypads. ColdFire V2 deterministic interrupt handling ensures no missed door-trigger events under heavy network traffic, while 64 KB SRAM runs the panel logic plus an embedded TLS stack. The hardware encryption on the pin-compatible MCF5235 variant secures credential storage.
Empfohlen
Point-of-Sale Terminals
The MCF5234CVM100 suits POS terminals because the integrated 10/100 Ethernet MAC connects to IP-based payment gateways, the LCD/QSPI bus drives a graphical display, and the I2C/UARTs interface to magnetic-stripe readers, printers and PIN pads. 100 MHz ColdFire V2 with 64 KB SRAM is sufficient for payment application stacks with secure TLS handshakes. The industrial temperature range and the 256-ball MAPBGA PCB-friendly footprint ease thermal design in compact terminal enclosures.
Empfohlen
Networked Printers and Imaging
The MCF5234CVM100 fits networked printers and imaging MFPs because the 100 MHz ColdFire V2 core processes PDL rendering, the integrated 10/100 Ethernet MAC provides Gigabit-class print-server connectivity, and the DMA controller plus external 32-bit bus move image data with minimal CPU overhead. The three UARTs support multi-protocol fax/modem options while the eTPU on the pin-compatible MCF5235 can drive stepper and DC motors for paper transport with sub-microsecond accuracy.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCF5234CVM100 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCF5235CVM100 | MCF5234CVM150 | MCF5235CVM150 |
|---|---|---|---|---|
| Package | 256-ball MAPBGA (17x17 mm) | 256-ball MAPBGA (17x17 mm) - same | 256-ball MAPBGA (17x17 mm) - same | 256-ball MAPBGA (17x17 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors - same | NXP Semiconductors - same | NXP Semiconductors - same |
| Core Frequency | 100 MHz | 100 MHz | 150 MHz | 150 MHz |
| Core Architecture | ColdFire V2 | ColdFire V2 | ColdFire V2 | ColdFire V2 |
| On-chip SRAM | 64 KB | 64 KB | 64 KB | 64 KB |
| eTPU Channels | 0 | 16 | 0 | 16 |
| Hardware Encryption | No | Yes | No | Yes |
| Ethernet MAC | 10/100 Mbps (FEC) | 10/100 Mbps (FEC) | 10/100 Mbps (FEC) | 10/100 Mbps (FEC) |
| Lifecycle Status | NRND | NRND/Active | NRND | NRND/Active |
Wichtigste Unterscheidungsmerkmale
- Highest compatibility - drop-in pinout with the active MCF5235 family (vs. MCF5235CVM100)
- ColdFire V2 deterministic real-time performance (vs. MPC852TCVR50A (PowerQUICC I))
- Integrated 10/100 Ethernet MAC, eTPU and encryption in one chip (vs. Discrete MCU + external MAC + timer ASIC)
Designhinweise
The 256-ball MAPBGA at 1 mm pitch requires 4-layer PCB minimum with via-in-pad for the inner power/ground ring. Per NXP hardware specification, place 100 nF decoupling caps directly under the balls with via-in-pad to short ground loops; add 4.7 uF bulk tantalum per supply rail. Maintain continuous ground plane under the BGA and route high-speed Ethernet MII traces as 50 ohm controlled impedance with length matching within 50 mils.
Route the FEC MII/RMII signals first with matched impedance, then place the external PHY within 50 mm of the MCF5234CVM100 to keep the 25 MHz reference clock clean. The 32-bit external data bus should be routed with matched lengths within +/-200 mils and series-stitched at every two signal lines; avoid splitting the power plane under the bus area. Place the external boot Flash within 25 mm of the bus pins.
Estimated: at 100 MHz with 3.3 V VDD and typical 250 mA core current (from NXP hardware specification power tables), the BGA dissipates ~0.825 W. With the 256-ball MAPBGA theta_JA of approximately 25 C/W on a 4-layer JEDEC board, junction-to-ambient rise is ~20 C above ambient. For sealed enclosures, derate clock to 80 MHz or add thermal vias under the central ball array.
Do not confuse the CVM100 suffix with the CVM150 speed grade - they share pinout but require different PLL configuration in firmware. Ensure boot-mode strapping resistors on the mode pins are correctly set before POR; an incorrect value causes silent boot failure with no JTAG/BDM access. Plan external reset supervisor IC since the internal POR may not meet all industrial brown-out requirements.
Compliance-Informationen
RoHS and REACH compliance per NXP product page. Not AEC-Q100 qualified; for automotive ECUs use AEC-Q100-qualified variants or migrate to NXP automotive MCU families. Halogen-free status: confirm with lot-specific declaration from distributor.
