MCF5275CVM166 vs MCF5275LCVM166 Vergleich
Detaillierter Direktvergleich von MCF5275CVM166 von NXP Semiconductors und MCF5275LCVM166 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MCF5275CVM166 - ColdFire V2 32-bit MPU, 166MHz, 256-MAPBGA | NXP
MCF5275CVM166 Nrnd
Spezifikationsvergleich
| Parameter | MCF5275CVM166 | MCF5275LCVM166 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $24,20 | $19,55 |
| Core | ColdFire V2 (32-bit) | — |
| Maximale Taktfrequenz | 166 MHz | — |
| On-Chip SRAM | 64 KB | — |
| Program Memory Size | ROMless | — |
| Program Memory Type | External (ROMless) | — |
| Gehäuse | 256-MAPBGA (17x17 mm) | 196-LBGA (15x15 mm) |
| Number of I/O Lines | 69 | — |
| Connectivity | EBI/EMI, Ethernet, I2C, SPI (QSPI), UART/USART, USB | — |
| Ethernet | Dual 10/100 MAC | 10/100 MAC with MII/RMII |
| USB | USB 1.1 device/host | USB 2.0 full-speed device/host |
| CAN | 2x CAN 2.0B | — |
| Peripherals | DMA, WDT, timers, hardware crypto (DES/3DES/AES/SHA) | — |
| Supply Voltage Core | 1.5 V | — |
| Supply Voltage I/O | 3.3 V | — |
| Betriebstemperatur | -40C to +85C (industrial) | [DATA_NEEDED: operating temperature range] |
| Montageart | Surface Mount (BGA) | Surface Mount |
| RoHS-Status | Compliant | Compliant |
| Core Architecture | — | ColdFire V2 (32-bit, variable-length RISC) |
| Maximum Core Clock | — | 166 MHz |
| On-chip SRAM | — | 64 KB |
| Program Memory | — | ROMless (external memory required) |
| Versorgungsspannung | — | 3.3 V I/O, internal core rail generated on-chip |
| UART | — | 2 |
| I2C | — | 2 |
| DMA Channels | — | 16 (eDMA) |
| Timers | — | 4 x 32-bit |
| External Bus | — | 16-bit EBI (SDRAM/SRAM/ROM) |