MCF5275CVM166 - ColdFire V2 32-bit MPU, 166MHz, 256-MAPBGA | NXP
Teilenummer: MCF5275CVM166 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.65 | $346,50 |
| 100 | $30.1 | $3.010,00 |
| 500 | $26.95 | $13.475,00 |
| 1.000 | $24.2 | $24.200,00 |
MCF5275CVM166 Übersicht
An MPU (Microprocessor Unit) is a processor IC that integrates a CPU core, memory controllers, and peripheral interfaces on a single die, enabling full system design without an external microcontroller. MPU is part of the broader hierarchy: MCU/MPU -> embedded processor -> integrated circuit -> semiconductor device. ColdFire is NXP/Freescale's variable-length RISC lineage derived from the original 68000 family, simplifying software migration for legacy ColdFire and m68k code while providing higher code density than fixed-length RISC architectures.
Key features of the MCF5275CVM166 include 166 MHz CPU clock with multiply-accumulate hardware support, dual 10/100 Ethernet MAC with integrated PHY interface, hardware cryptography acceleration engine for DES/3DES/AES/SHA, four 32-bit timer modules, an SDRAM/DDR memory controller supporting up to 128 MB external memory, and a USB 1.1 device/host controller. The part is supplied in a 256-ball MAPBGA at 0.8 mm pitch and operates from a 3.3 V I/O and 1.5 V core supply. Lifecycle status is NRND (Not Recommended for New Designs), so existing designs should plan for migration to the ColdFire V2 successor families.
Architecture-wise, the ColdFire V2 core implements a 4-stage pipeline with 16-bit and 32-bit instruction mix that improves code density over MIPS/ARM Thumb counterparts. The integrated Fast Ethernet controllers, USB, and CAN peripherals collectively allow bill-of-materials reduction by eliminating external PHY and protocol chips, while the hardware encryption engine offloads AES-128, DES, and SHA-1 from the CPU.
Typical applications include industrial control and automation gateways, factory-floor protocol converters, POS and kiosk terminals, networked printer controllers, building-automation control panels, and remote monitoring/edge gateway products. The wide peripheral mix and on-chip networking make this part well suited where Linux or RTOS-based control plus deterministic Ethernet and fieldbus connectivity are required.
When designing with this part, allocate sufficient PCB area for the MAPBGA fanout and follow NXP's reference design for DDR/SDRAM trace matching, since high-speed external memory interfaces are sensitive to impedance mismatch. Also confirm supply voltage sequencing to satisfy the 1.5 V core requirement before enabling the I/O 3.3 V rail, per the manufacturer datasheet.
This page synthesizes distributor pricing, lifecycle status, drop-in alternative parts, and engineering design considerations that complement the manufacturer datasheet reference information.
Drop-in-Alternativen für MCF5275CVM166 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCF5275CVM166 (gleiche Bauform und Footprint) – abweichend in Package, RoHS Status, Ethernet, USB, Mounting Type.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCF5274CVM166
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MCF5275CVM200
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCF5275CVM133
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCF5274LCVM166
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$16.2 / Stück
Datenblatt ansehen →MCF5275LVM166
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MCF5275CVM166 Grenzwerte & elektrische Eigenschaften
| Core | ColdFire V2 (32-bit) |
| Maximale Taktfrequenz | 166 MHz |
| On-Chip SRAM | 64 KB |
| Program Memory Size | ROMless |
| Program Memory Type | External (ROMless) |
| Gehäuse | 256-MAPBGA (17x17 mm) |
| Number of I/O Lines | 69 |
| Connectivity | EBI/EMI, Ethernet, I2C, SPI (QSPI), UART/USART, USB |
| Ethernet | Dual 10/100 MAC |
| USB | USB 1.1 device/host |
| CAN | 2x CAN 2.0B |
| Peripherals | DMA, WDT, timers, hardware crypto (DES/3DES/AES/SHA) |
| Supply Voltage Core | 1.5 V |
| Supply Voltage I/O | 3.3 V |
| Betriebstemperatur | -40C to +85C (industrial) |
| Montageart | Surface Mount (BGA) |
| RoHS-Status | Compliant |
MCF5275CVM166 256-mapbga (17x17 mm) Pinbelegungsleitfaden
Pinbelegung für MCF5275CVM166 (256-mapbga (17x17 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MCF5275CVM166.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MCF5275CVM166 ist geeignet für 7 Anwendungs: Industrial Ethernet Gateway, Networked Printer Controller, POS Terminal and Kiosk Controller, Factory-Floor Protocol Converter, Building Automation Controller, Edge IoT Gateway with Secure Communication, Secure Industrial Router.
Industrial Ethernet Gateway
The MCF5275CVM166 fits industrial Ethernet gateways because it integrates dual 10/100 Mbps Ethernet MACs alongside a 166 MHz ColdFire V2 core. In a typical dual-port gateway design the part terminates both WAN and LAN Ethernet segments, runs Modbus/TCP or PROFINET protocols on RTOS or uClinux, and benefits from hardware AES-128/SHA acceleration for secure tunnel termination. Designers route both MII buses to RJ45 magnetics and an external PHY. Compared with adding an external switch ASIC, the integrated dual MAC saves 3-4 dollars in BOM cost and roughly 200 mm^2 of board area while sustaining line-rate UDP throughput.
Empfohlen
Networked Printer Controller
The MCF5275CVM166 is a strong fit for networked printer engine controllers where deterministic host networking plus DSP-like local processing are required. The 64 KB on-chip SRAM holds the engine control loop, the USB 1.1 port handles host-side command queueing, and one Ethernet MAC accepts print jobs while the other services the management VLAN. The 166 MHz ColdFire V2 core executes image rendering pipelines efficiently through DMA into external SDRAM. Engineers should verify the SDRAM controller trace impedance and ECC settings per the manufacturer hardware specification to avoid print-job corruption.
Empfohlen
POS Terminal and Kiosk Controller
For point-of-sale terminals and self-service kiosks, the MCF5275CVM166's connectivity mix - dual Ethernet, USB device, UARTs, and I2C - allows a single-chip bill acceptor, card reader, and network interface connection. The 166 MHz CPU runs secure TLS to the payment processor using hardware AES/DES engines, offloading crypto from the main thread. The 256-MAPBGA package supports compact kiosk mainboards where the 17x17 mm footprint enables card-edge or card-bottom mounting. The part's -40C to +85C industrial temperature rating survives the thermal envelope of enclosed kiosk cabinets.
Empfohlen
Factory-Floor Protocol Converter
The MCF5275CVM166 suits factory-floor protocol converters bridging CAN, RS-485, Ethernet, and USB because it integrates two CAN 2.0B controllers alongside dual Ethernet and three UARTs. A typical bridging application routes CANopen frames from a machine to an Ethernet/IP backbone while presenting USB diagnostics to technicians. The hardware encryption engine secures the Ethernet gateway without imposing CPU overhead. Critical PCB practice: keep the BGA decoupling capacitors within 1 mm of their respective supply pins to manage switching transients at 166 MHz.
Empfohlen
Building Automation Controller
The MCF5275CVM166 functions well as a building automation controller running BACnet/IP or LonWorks over its dual Ethernet ports while driving field devices via CAN or RS-485 through the UARTs. The ColdFire V2 core's deterministic interrupt response suits HVAC damper control loops, and the 64 KB on-chip SRAM keeps the control loop resident at full speed without external bus stalls. Building-automation cabinet thermal profiles often push 70C ambient, well within the -40C to +85C industrial rating. Choose the low-power MCF5275LVM166 variant when the panel includes PoE-only power budgets.
Empfohlen
Edge IoT Gateway with Secure Communication
For edge IoT gateways that aggregate sensor data from local fieldbus and forward to cloud backends, the MCF5275CVM166 provides the necessary hardware crypto engine plus dual Ethernet and USB for local diagnostics. The 166 MHz ColdFire V2 runs TLS handshakes accelerated by the integrated AES-128/DES/SHA block, and the on-chip DMA channels enable zero-copy packet handling. uClinux supports standard networking stacks, making this part a versatile bridging device between legacy RS-485 networks and modern MQTT brokers over Ethernet. Lifecycle status should be considered: migration planning to a successor ColdFire V2 or i.MX RT part is recommended for new designs.
Empfohlen
Secure Industrial Router
The MCF5275CVM166 fits a secure industrial router because hardware AES-128/3DES/SHA acceleration offloads VPN tunnel ciphering from the CPU, while the dual 10/100 Ethernet ports form the WAN/LAN routing boundary. The ColdFire V2 core sustains roughly 80 Mbps encrypted throughput using the integrated engine. Most routers use the part in fanless enclosures, so the -40C to +85C industrial range matters. Drop-in upgrade to the 200 MHz MCF5275CVM200 variant produces higher tunnel throughput without any PCB change.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCF5275CVM166 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCF5274CVM166 | MCF5275CVM200 | MCF5275CVM133 | MCF5274LCVM166 | MCF5275LVM166 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 256-MAPBGA (17x17 mm) | 256-MAPBGA - same | 256-MAPBGA - same | 256-MAPBGA - same | 256-MAPBGA - same | 256-MAPBGA - same |
| Core | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) | ColdFire V2 (32-bit) LP | ColdFire V2 (32-bit) LP |
| Maximum Frequency | 166 MHz | 150 MHz | 200 MHz | 133 MHz | 150 MHz (LP) | 166 MHz (LP) |
| On-Chip SRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Ethernet MACs | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 | 2x 10/100 |
| USB | USB 1.1 device/host | USB 1.1 device/host | USB 1.1 device/host | USB 1.1 device/host | USB 1.1 device/host | USB 1.1 device/host |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
| Hardware Crypto Engine | AES / DES / SHA | AES / DES / SHA | AES / DES / SHA | AES / DES / SHA | AES / DES / SHA | AES / DES / SHA |
Wichtigste Unterscheidungsmerkmale
- Dual integrated 10/100 Ethernet MACs (vs. MCF5281CVM80)
- Hardware AES/DES/SHA encryption engine (vs. MCF5235CVM150)
- Higher CPU clock at 166 MHz (vs. MCF5281CVM80)
- USB 1.1 device/host onboard (vs. MCF5274CVM166 (same family but lower clock))
Designhinweise
The 256-MAPBGA package at 0.8 mm pitch requires a 4-layer (or more) PCB with fine-pitch fanout. Allow at least 8 mil traces and 4 mil spaces on inner signal layers; stacked vias are acceptable but check manufacturer microvia tolerance. Per the manufacturer hardware specification, match DDR/SDRAM trace lengths within 50 mil across the byte lanes to avoid timing violations at 166 MHz. The exposed die-attach pad beneath the BGA must be soldered to the PCB thermal pad for electrical grounding and thermal dissipation.
The MCF5275CVM166 requires a 1.5 V core supply and a 3.3 V I/O supply. Power-up sequencing is critical: the 1.5 V core rail must come up first, or at the same time as the 3.3 V rail, with the 3.3 V never exceeding the 1.5 V core by more than 0.3 V. Use a controller with proper sequence tracking (e.g., a 3-pin power supervisor) and bulk-plus-decoupling capacitance of at least 100 uF plus 0.1 uF per supply pin.
Estimated thermal analysis assuming VDD_CORE 1.5 V at full 166 MHz, full DMA activity, dual Ethernet active: assume core current around 200 mA, so total core dissipation is roughly 0.30 W. With proper BGA ground-pad soldering, theta_JA is approximately 25 C/W, allowing industrial -40C to +85C operation without a dedicated heatsink. Validate by measuring the die temperature under sustained CPU+networking load. Decoupling capacitors placed within 1 mm of the package balls materially reduce ground-bounce and internal junction temperature.
Per the manufacturer hardware specification, both Ethernet MII/ RMII buses must be length-matched within 200 mil of each other to keep PHY-to-MAC skew below the 25 ns MII timing margin. Keep MII traces away from switching DC-DC converters to avoid injecting common-mode noise into the PHY. The SDRAM clock must have a series 33 ohm termination resistor placed within 0.5 inch of the pin. USB DP/DM traces should be 90 ohm differential and 50 mil or longer max to avoid impedance discontinuities.
A common pitfall is omitting the JTAG reset pull-up resistor on the JTAG pin, which prevents boundary-scan debug from working when the board is first powered. Another is failing to initialize SDRAM mode registers at boot, leading to sporadic bus errors. Confirm you programmed the SDRAM controller with the correct CAS latency from the SDRAM vendor datasheet; for 166 MHz the standard CAS latency is 2 or 3 depending on the SDRAM grade. Verify unused Ethernet PHY strapping pins to their default states via 4.7 kohm pull-ups or pull-downs, per the manufacturer reference design.
Compliance-Informationen
RoHS compliance per NXP product page. Lead-free BGA balls. Halogen-free status not explicitly listed in retrieved web data. AEC-Q100 not applicable - this is a general industrial MPU, not an automotive-qualified part.
