MCIMX353CJQ5C vs MCIMX351AJQ5C Vergleich
Detaillierter Direktvergleich von MCIMX353CJQ5C von NXP Semiconductors und MCIMX351AJQ5C von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MCIMX353CJQ5C - i.MX35 ARM1136 MPU, 532 MHz, 400-LFBGA | NXP
MCIMX353CJQ5C ✗ AbgekündigtNXP Semiconductors
MCIMX351AJQ5C - i.MX35 ARM1136 MPU, 532MHz, 400-LFBGA | NXP
MCIMX351AJQ5C ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MCIMX353CJQ5C | MCIMX351AJQ5C |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $23,10 | $31,75 |
| Core Architecture | ARM1136JF-S (ARM11) | ARM1136JF-S (ARM11) |
| Number of Cores | 1 | 1 |
| Datenbusbreite | 32-bit | 32-bit |
| Maximum CPU Clock | 532 MHz | — |
| Instruction Set | ARMv6 with SIMD and Jazelle | — |
| Internal SRAM | 128 KB | — |
| Program Memory Type | ROMless | ROMless (external) |
| Number of User I/Os | 96 | — |
| Gehäuse | 400-LFBGA (MAPBGA) 17x17 mm | — |
| Ball Pitch | 0.8 mm | — |
| Oscillator Type | External | External |
| External Memory Interface | DDR2, NAND flash, NOR flash | — |
| Packaging | Tray | Tray |
| Montageart | Surface Mount | Surface Mount, MAPBGA |
| Betriebstemperatur | [DATA_NEEDED: operating temperature range] | — |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS compliance status] |
| Product Family | — | i.MX35 |
| Maximum Core Frequency | — | 532 MHz |
| L2 Cache Size | — | 128 KB (128K x 8 per distributor listing) |
| Number of I/O Lines | — | 96 |
| Betriebsversorgungsspannung | — | [DATA_NEEDED: core/IO supply voltages] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: automotive grade temperature range] |
| Gehäuse / Bauform | — | 400-LFBGA (17 mm x 17 mm, 0.8 mm pitch) |
| Process Technology | — | 90 nm CMOS |
| Market | — | Automotive |
| Lifecycle | — | End of Life / Last Time Buy (per NXP product page) |