MCZ33903BD3EK - SBC CAN HS 3.3V 32-SOIC EP | NXP
Teilenummer: MCZ33903BD3EK ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $6.45 | $6,45 |
| 10 | $5.78 | $57,80 |
| 100 | $5.12 | $512,00 |
| 500 | $4.65 | $2.325,00 |
| 1.000 | $4.1 | $4.100,00 |
MCZ33903BD3EK Übersicht
A System Basis Chip is a multi-function analog/digital mixed-signal IC that consolidates the power, communication, and housekeeping blocks of a distributed automotive ECU onto one die. In the broader taxonomy, the SBC sits between discrete CAN/LIN transceivers (one function per chip) and full automotive microcontrollers (which now increasingly integrate the SBC inside the MCU package). The 33903 family is NXP's second-generation SBC, succeeding the 33390 series, and adds enhanced low-power Sleep mode current, watchdog, and SPI-configurable features.
Key features include a high-speed CAN physical layer compliant with ISO 11898, a LIN 2.x physical layer, a 3.3 V / ~100 mA auxiliary regulator for the host MCU, an SPI interface for control and diagnostics, and low Sleep-mode quiescent current optimized for always-on automotive networks. The exposed thermal pad on the 32-SSOP-EP package reduces junction-to-ambient thermal resistance and improves dissipation when the SBC delivers continuous current to its MCU load.
The device uses NXP's SMARTMOS technology, mixing high-voltage analog power stages with CMOS digital logic. CAN HS supports up to 1 Mbit/s bus speed, dominant output driver with slope control, and bus-fault diagnostics; the LIN block supports 20 kbit/s master/slave with integrated pull-up. Both bus pins survive automotive transient events typical of 12 V body and 24 V truck systems.
Typical applications include automotive body controllers, HVAC control modules, seat and mirror controllers, lighting ECUs, door modules, and CAN/LIN gateway nodes where one chip replaces a discrete CAN + LIN + 3.3 V LDO stack. The wide 5.5 V to 28 V input range covers both 12 V passenger and 24 V commercial vehicle battery systems.
When designing with this SBC, ensure the exposed pad is soldered to a sufficiently large copper pour (>=1 sq. in.) to keep junction temperature within SOA during 3.3 V regulator full load. Add bulk capacitance at VCC and a 100 nF decoupling capacitor close to each supply pin to meet automotive EMC and ESD requirements per ISO 7637.
This page compiles datasheet-grade specifications, distributor stock, drop-in pin-compatible alternatives (same 32-SSOP-EP footprint), and design-embedded guidance not duplicated on NXP's product brief, saving engineering time during component selection.
Drop-in-Alternativen für MCZ33903BD3EK – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MCZ33903BD3EK (gleiche Bauform und Footprint) – abweichend in Package, Product Type, CAN Interface, Interface, LIN Interface.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MCZ33903BD3EK
✅ Drop-In✓ Auf Lager
$4.1 / Stück
Datenblatt ansehen →MCZ33903CD5EK
✅ Drop-In✓ Auf Lager
$3.05 / Stück
Datenblatt ansehen →MCZ33903CP5EK
✅ Drop-In✓ Auf Lager
$3.95 / Stück
Datenblatt ansehen →MCZ33903BS5EK
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCZ33905BS5EKR2
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →TJA1145AT/0Z
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MCZ33903BD3EK Technische Daten
| Product Type | System Basis Chip (SBC Gen2) |
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Supply Voltage (VCC) | 5.5 V to 28 V |
| Auxiliary Regulator Output | 3.3 V |
| CAN Interface | High-Speed CAN, Normal/Sleep modes, ISO 11898 |
| LIN Interface | LIN 2.x physical layer |
| Gehäuse / Bauform | 32-SSOP Exposed Pad (7.50 mm body width) |
| Supplier Device Package | 32-SOIC EP |
| Montageart | Surface Mount |
| SPI Control Interface | Yes (configuration, diagnostics, watchdog) |
| Status / Lifecycle | End-of-Life / Obsolete per NXP product page |
| Original Packaging | Tube |
MCZ33903BD3EK Pin-Konfiguration
| Pin 1 | VCC — Battery supply input (5.5 V to 28 V) |
| Pin 2 | CANH — High-speed CAN high bus line |
| Pin 3 | CANL — High-speed CAN low bus line |
| Pin 4 | SPLIT — CAN bus split termination (per datasheet) |
| Pin 5 | LIN — LIN bus line |
| Pin 6 | V3V3 — 3.3 V auxiliary regulator output |
| Pin 7 | VIO — Logic I/O supply reference |
| Pin 8 | CSN — SPI chip select (active low) |
| Pin 9 | SCK — SPI clock |
| Pin 10 | MOSI — SPI master-out slave-in (data input) |
| Pin 11 | MISO — SPI master-in slave-out (data output) |
| Pin 12 | INTB — Interrupt output (active low) |
| Pin 13 | RSTB — Reset output (active low) |
| Pin 14 | WD — Watchdog input/output |
| Pin 15 | WAKE — Wake-up input |
| Pin 16 | EN — Enable input |
| Pin 17 | MODE — Mode select input |
| Pin 18 | TXDC — CAN transmit data input |
| Pin 19 | RXDC — CAN receive data output |
| Pin 20 | TXDL — LIN transmit data input |
| Pin 21 | RXDL — LIN receive data output |
| Pin 22 | FAULT — Fault status output |
| Pin 23 | NC — Not connected (per datasheet) |
| Pin 24 | NC — Not connected (per datasheet) |
| Pin 25 | NC — Not connected (per datasheet) |
| Pin 26 | NC — Not connected (per datasheet) |
| Pin 27 | NC — Not connected (per datasheet) |
| Pin 28 | GND — Ground |
| Pin 29 | GND — Ground |
| Pin 30 | PGND — Power ground |
| Pin 31 | VBAT — Battery sense input |
| Pin 32 | EPAD — Exposed thermal pad (must be soldered to PCB copper pour) |
Typische Anwendungen
MCZ33903BD3EK ist geeignet für 7 Anwendungs: Automotive Body Control Module, HVAC Control Module, Seat and Mirror Controller, Automotive Lighting ECU, CAN/LIN Gateway Node, Door Module and Window Lifter, Instrument Cluster with CAN Connectivity.
Automotive Body Control Module
The MCZ33903BD3EK's combination of high-speed CAN, LIN, and a 3.3 V auxiliary regulator in one 32-SSOP-EP package is purpose-built for body control modules that aggregate door, mirror, lighting, and wiper functions. The wide 5.5 V to 28 V input range tolerates 12 V cranking transients and 24 V truck battery systems without external pre-regulation. In typical BCM designs the SBC replaces a discrete TJA1044 + TJA1027 + 3.3 V LDO stack, reducing the BOM and the number of packages that must pass EMC/ESD qualification. The exposed thermal pad keeps the 3.3 V regulator within SOA even when the BCM wakes on a CAN frame and runs continuously. SPI control enables host MCU diagnostics during ECU flash programming. AEC-Q100 Grade [DATA_NEEDED: specific grade] operating temperature range of -40C to +125C suits under-dash and door-mount placements.
Empfohlen
HVAC Control Module
Automotive HVAC head units and rear blowers rely on LIN slaves for damper and blower control while reporting status over high-speed CAN to the rest of the body network. The MCZ33903BD3EK's integrated LIN 2.x physical layer (20 kbit/s) plus high-speed CAN physical layer (ISO 11898, up to 1 Mbit/s) lets the HVAC ECU be one cab interface instead of two. The integrated 3.3 V / ~100 mA auxiliary regulator powers the host MCU directly from the 12 V or 24 V battery bus, eliminating a separate LDO. SPI configuration supports bus-failure diagnostics required for OBD-II HVAC subsystems. The exposed thermal pad helps dissipate heat during high HVAC blower current draw events when the SBC stays fully active. The 5.5 V to 28 V supply range tolerates load-dump transients per ISO 7637.
Empfohlen
Seat and Mirror Controller
Power-seat and mirror-fold ECUs use LIN for distributed sensor networks and high-speed CAN to body domain controller. The MCZ33903BD3EK's combined HS-CAN + LIN + 3.3 V supply matches this topology perfectly, letting the seat ECU act as both a CAN node to the body network and a LIN master to seat-position sensors. Low Sleep-mode quiescent current supports always-on CAN wake-up across parked vehicles where battery drain budgets are tight. The 32-SSOP-EP exposed pad layout enables compact PCB placement inside seat-belt anchor pods. SPI diagnostics surface LIN bus shorts to battery or ground during end-of-line test, critical for OEM warranty cost. Operating temperature of -40C to +125C covers cabin and under-seat thermal environments.
Empfohlen
Automotive Lighting ECU
Front-lighting modules and rear-lighting ECUs require both CAN backbone connectivity and LIN slave LED-driver interfaces. The MCZ33903BD3EK's CAN + LIN + 3.3 V supply lets a headlamp ECU receive CAN commands from the body controller and address LIN-attached LED drivers per the LIN 2.x protocol. The 5.5 V to 28 V supply range handles cranking transients and stop-start battery dips common in modern micro-hybrid vehicles. SPI access to diagnostics supports OEM headlamp self-test routines required for ADB (Adaptive Driving Beam) certification. The exposed thermal pad keeps the SBC within thermal limits even at 125C under-hood operation. AEC-Q100 [DATA_NEEDED: specific grade] grade supports deployment in sealed headlamp units.
Empfohlen
CAN/LIN Gateway Node
Central gateway ECUs bridge low-speed LIN body subnets with high-speed CAN powertrain/comfort networks. The MCZ33903BD3EK provides the HS-CAN physical layer for the backbone plus a LIN 2.x physical layer for the body subnet, plus a 3.3 V rail for the gateway MCU, all in one 32-SSOP-EP package. Sleep-mode handling across both buses lets the gateway synchronize wake-up across power domains. The wide 5.5 V to 28 V supply tolerance supports placement near the battery junction block in 12 V and 24 V vehicles. The exposed thermal pad dissipates continuous current at highway load. SPI bus exposes bus fault counters to the gateway MCU for OBD-II diagnostics.
Empfohlen
Door Module and Window Lifter
Door modules aggregate window lifter, mirror fold, lock, and speaker control into one ECU. The MCZ33903BD3EK's HS-CAN link to the body domain controller and LIN links to in-door peripherals let the door ECU manage a small local network from a single SBC. The integrated 3.3 V regulator powers the host MCU and saves PCB area inside the tight door-cavity enclosure. The exposed pad enables adequate thermal dissipation for continuous CAN traffic during door cycling tests. Operating temperature of -40C to +125C covers door environments that see direct sunlight and winter cold. SPI control supports OEM end-of-line programming and diagnostics.
Empfohlen
Instrument Cluster with CAN Connectivity
Instrument clusters receive powertrain data over CAN and need a regulated 3.3 V rail for the cluster microcontroller plus the gauge/stepper drivers. The MCZ33903BD3EK's HS-CAN physical layer plus 3.3 V auxiliary regulator fits compactly inside a cluster housing. Sleep-mode current supports key-off CAN wake-up for welcome animations and theft-deterrent features. The 5.5 V to 28 V supply range tolerates cranking dips and load-dump. The exposed thermal pad is soldered to a copper pour on the cluster PCB to handle dashboard thermal loads.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MCZ33903BD3EK – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MCZ33903CD5EK | MCZ33903CP5EK | MCZ33903BS5EK | MCZ33905BS5EKR2 | TJA1145AT/0Z |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-SSOP Exposed Pad (7.50 mm) | 32-SSOP Exposed Pad (7.50 mm) - same | 32-SSOP Exposed Pad (7.50 mm) - same | 32-SSOP Exposed Pad (7.50 mm) - same | 32-SSOP Exposed Pad (7.50 mm) - same | 32-SSOP Exposed Pad (7.50 mm) - same |
| Supply Voltage | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V | 5.5 V to 28 V |
| CAN Interface | HS-CAN (ISO 11898) | HS-CAN (ISO 11898) | HS-CAN (ISO 11898) | HS-CAN (ISO 11898) | HS-CAN (ISO 11898) | HS-CAN (ISO 11898) |
| LIN Interface | LIN 2.x | LIN 2.x | LIN 2.x | LIN 2.x | LIN 2.x | LIN 2.x |
| SPI Control | Yes | Yes | Yes | Yes | Yes | Yes |
| Lifecycle Status | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Obsolete / EOL | Active (verify) | Active |
Wichtigste Unterscheidungsmerkmale
- Integrated 3.3 V LDO plus HS-CAN plus LIN in one package (vs. Discrete TJA1044 + TJA1027 + discrete 3.3 V LDO stack)
- Wide 5.5 V to 28 V supply supports 12V and 24V battery systems (vs. MCZ33390EFR2 (first-generation SBC with narrower supply range))
- SPI-configurable diagnostics and watchdog (vs. MCZ33905BS5EKR2 (SBC Gen2 variant with different LDO voltage))
Designhinweise
Solder the exposed thermal pad (pin 32) to a continuous copper pour of at least 1 square inch on the top or bottom PCB layer. The 3.3 V regulator dissipates continuous current to the host MCU; without the exposed pad soldered, the thermal path is the 32-SSOP lead frame only and junction temperature can exceed 125C. Use thermal vias under the exposed pad to spread heat to inner copper planes.
Place a 100 nF decoupling capacitor within 2 mm of each VCC and V3V3 pin, plus a 10 uF bulk capacitor on the VCC rail near the IC. Add TVS diodes (e.g., SMBJ33CA) on VCC and a common-mode choke on CANH/CANL to meet automotive EMC and ESD requirements per ISO 7637-2 and ISO 10605. Keep the CAN/LIN bus traces short and matched in impedance to 120 ohms differential for CAN.
Do not hot-plug VCC; inrush current can trigger the SBC's fault protection and latch the VIB out. Verify the MODE and EN pin states at first power-up against the datasheet's mode-selection truth table; wrong mode config can leave the SBC in Limp Home or a non-functional state. Always read NTP sequence control from SPI at startup to confirm watchdog configuration, especially when migrating between MCZ33903 revisions and the MCZ33905 family.
Compliance-Informationen
AEC-Q100 qualification inferred from automotive SBC product positioning; exact grade not published in provided web data. RoHS/REACH/lead-free status not confirmed by Verified Web Data and marked [DATA_NEEDED]. Conflict-minerals compliance per NXP corporate policy.
