MMA6263QR2 vs MMA6262QR2 Vergleich
Detaillierter Direktvergleich von MMA6263QR2 von NXP Semiconductors und MMA6262QR2 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MMA6263QR2 - ±1.5g Dual-Axis Analog Accelerometer | NXP / Freescale
MMA6263QR2 ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MMA6262QR2 - ±1.5g X/Y Dual-Axis Accelerometer | NXP
MMA6262QR2 ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MMA6263QR2 | MMA6262QR2 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Motion Sensors | Motion Sensors |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $5,45 | $5,20 |
| Sensortyp | Accelerometer, Dual Axis (X, Y) | Accelerometer, Dual-Axis (X, Y) |
| Acceleration Range | ±1.5 g (g-select to ±6 g) | ±1.5 g |
| Sensitivity | 740 mV/g to 860 mV/g (typ. 800 mV/g at 3.3 V) | 740 mV/g to 860 mV/g (at 3.3 V) |
| Versorgungsspannung | 3.3 V nominal (range per datasheet) | — |
| Ausgangstyp | Analog, ratiometric voltage | Analog, Ratiometric |
| Bandwidth | 900 Hz sensor bandwidth | — |
| Low-Pass Filter | 1-pole on-chip, ~400 Hz cutoff | — |
| Zero-g Output (Typ) | 1.65 V (mid-supply) | — |
| Temperature Compensation | On-chip factory trimmed | On-chip, factory-set |
| Self-Test | Logic-level input on each axis | — |
| Gehäuse | 16-QFN-EP (6x6 mm) with exposed pad | — |
| Montageart | Surface Mount | Surface Mount |
| Lead Status | Contains Lead (legacy package) | — |
| RoHS-Status | RoHS Compliant | RoHS3 Compliant |
| Operating Principle | Capacitive micromachined (MEMS) | — |
| Supply Voltage (VDD) | — | 3.15 V to 5.25 V (per MMA6801KW comp doc) |
| Bandwidth (Low-Pass Filter) | — | 150 Hz (1-pole factory-set) |
| Zero-g Offset | — | Factory calibrated, no external trim required |
| Betriebstemperatur | — | -40 °C to +105 °C [DATA_NEEDED: confirm upper limit from full NXP datasheet] |
| Gehäuse / Bauform | — | 16-QFN-EP (6x6 mm) |
| Supplier Device Package | — | 16-QFN-EP (6x6) |
| Lead Free Status | — | Contains Lead (per digchip snippet) |
| Sense Technology | — | Capacitive Micromachined (MEMS) |