MMA6263QR2 vs MMA6262QR2 Comparación
Comparación detallada lado a lado de MMA6263QR2 por NXP Semiconductors y MMA6262QR2 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MMA6263QR2 - ±1.5g Dual-Axis Analog Accelerometer | NXP / Freescale
MMA6263QR2 ⚠ Última compraComparación de especificaciones
| Parámetro | MMA6263QR2 | MMA6262QR2 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Motion Sensors | Motion Sensors |
| Estado del ciclo de vida | Última compra | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $5,45 | $5,20 |
| Tipo de sensor | Accelerometer, Dual Axis (X, Y) | Accelerometer, Dual-Axis (X, Y) |
| Acceleration Range | ±1.5 g (g-select to ±6 g) | ±1.5 g |
| Sensitivity | 740 mV/g to 860 mV/g (typ. 800 mV/g at 3.3 V) | 740 mV/g to 860 mV/g (at 3.3 V) |
| Tensión de alimentación | 3.3 V nominal (range per datasheet) | — |
| Tipo de salida | Analog, ratiometric voltage | Analog, Ratiometric |
| Bandwidth | 900 Hz sensor bandwidth | — |
| Low-Pass Filter | 1-pole on-chip, ~400 Hz cutoff | — |
| Zero-g Output (Typ) | 1.65 V (mid-supply) | — |
| Temperature Compensation | On-chip factory trimmed | On-chip, factory-set |
| Self-Test | Logic-level input on each axis | — |
| Encapsulado | 16-QFN-EP (6x6 mm) with exposed pad | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Lead Status | Contains Lead (legacy package) | — |
| Estado RoHS | RoHS Compliant | RoHS3 Compliant |
| Operating Principle | Capacitive micromachined (MEMS) | — |
| Supply Voltage (VDD) | — | 3.15 V to 5.25 V (per MMA6801KW comp doc) |
| Bandwidth (Low-Pass Filter) | — | 150 Hz (1-pole factory-set) |
| Zero-g Offset | — | Factory calibrated, no external trim required |
| Temperatura de funcionamiento | — | -40 °C to +105 °C [DATA_NEEDED: confirm upper limit from full NXP datasheet] |
| Encapsulado / Carcasa | — | 16-QFN-EP (6x6 mm) |
| Supplier Device Package | — | 16-QFN-EP (6x6) |
| Lead Free Status | — | Contains Lead (per digchip snippet) |
| Sense Technology | — | Capacitive Micromachined (MEMS) |