MPC561CZP40 vs MPC563MZP56 Vergleich

Detaillierter Direktvergleich von MPC561CZP40 von NXP Semiconductors und MPC563MZP56 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC561CZP40 MPC561CZP40 - 40MHz PowerPC Qorivva MCU, 388-PBGA | NXP

MPC561CZP40 - 40MHz PowerPC Qorivva MCU, 388-PBGA | NXP

MPC561CZP40 ⚠ Letzte Bestellmöglichkeit
NXP Semiconductors
MPC563MZP56 MPC563MZP56 - 32-Bit 56MHz PowerPC MCU, 512KB Flash | NXP

MPC563MZP56 - 32-Bit 56MHz PowerPC MCU, 512KB Flash | NXP

MPC563MZP56 Nrnd

Spezifikationsvergleich

Parameter MPC561CZP40 MPC563MZP56
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Letzte Kaufgelegenheit NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $51,75 $17,95
Core Architecture PowerPC (MPC5xx / Qorivva family) PowerPC MPC5xx (32-bit)
Core Count Single-core —
Datenbusbreite 32-bit —
Maximale Taktfrequenz 40 MHz —
Program Memory Type ROMless (no internal Flash) —
Package Type 388-PBGA (Plastic Ball Grid Array) —
Package Dimensions 27 x 27 mm —
Betriebstemperaturbereich -40C to +85C —
Automotive Grade AEC-Q100 Grade compliant (Automotive) —
Supply Voltage Range [DATA_NEEDED: Vcore/Vio supply range] —
On-chip SRAM Size [DATA_NEEDED: SRAM bytes] —
External Bus Interface Yes (32-bit bus, chip-selects via SIU) —
ADC Channels QADC (Queued ADC) - multi-channel —
Timer Processing Unit TPU - integrated motion-control timer —
Peripheral Pin Multiplexing Yes (SIU-controlled routing) —
Montageart Surface Mount (BGA) Surface Mount (BGA)
Lead-free / RoHS Lead-free finish; RoHS compliance varies by date code —
MSL-Level MSL3 (typical for large PBGA) [DATA_NEEDED: MSL rating]
Maximum CPU Frequency — 56 MHz
Program Memory (Flash) — 512 KB (512K x 8)
RAM Size — 36 KB
Operating Voltage — 5 V (typical)
Number of I/O Pins — [DATA_NEEDED: I/O count]
Gehäuse — 388-PBGA (27 x 27 mm)
Temperature Grade — Standard (P)
Betriebstemperatur — [DATA_NEEDED: operating temperature range]
Peripherals — Peripheral pin multiplexing, CAN, SPI, serial interfaces
Code Compression — Yes (on-chip)
Intermodule Bus — Common IMB
Debug Interface — Background Debug Mode (BDM)
RoHS-Status — Compliant (per distributor listing)
Manufacturer — NXP USA Inc. (formerly Freescale/Motorola)

Datenblätter & Ressourcen

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