MPC561CZP40 vs MPC563MZP56 Comparaison
Comparaison détaillée côte à côte de MPC561CZP40 par NXP Semiconductors et MPC563MZP56 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC561CZP40 - 40MHz PowerPC Qorivva MCU, 388-PBGA | NXP
MPC561CZP40 ⚠ Dernier achatComparaison des spécifications
| Paramètre | MPC561CZP40 | MPC563MZP56 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | NRND |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $51,75 | $17,95 |
| Core Architecture | PowerPC (MPC5xx / Qorivva family) | PowerPC MPC5xx (32-bit) |
| Core Count | Single-core | — |
| Largeur du bus de données | 32-bit | — |
| Fréquence d'horloge maximale | 40 MHz | — |
| Program Memory Type | ROMless (no internal Flash) | — |
| Package Type | 388-PBGA (Plastic Ball Grid Array) | — |
| Package Dimensions | 27 x 27 mm | — |
| Plage de température de fonctionnement | -40C to +85C | — |
| Automotive Grade | AEC-Q100 Grade compliant (Automotive) | — |
| Supply Voltage Range | [DATA_NEEDED: Vcore/Vio supply range] | — |
| On-chip SRAM Size | [DATA_NEEDED: SRAM bytes] | — |
| External Bus Interface | Yes (32-bit bus, chip-selects via SIU) | — |
| ADC Channels | QADC (Queued ADC) - multi-channel | — |
| Timer Processing Unit | TPU - integrated motion-control timer | — |
| Peripheral Pin Multiplexing | Yes (SIU-controlled routing) | — |
| Type de montage | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead-free / RoHS | Lead-free finish; RoHS compliance varies by date code | — |
| Niveau MSL | MSL3 (typical for large PBGA) | [DATA_NEEDED: MSL rating] |
| Maximum CPU Frequency | — | 56 MHz |
| Program Memory (Flash) | — | 512 KB (512K x 8) |
| RAM Size | — | 36 KB |
| Operating Voltage | — | 5 V (typical) |
| Number of I/O Pins | — | [DATA_NEEDED: I/O count] |
| Boîtier | — | 388-PBGA (27 x 27 mm) |
| Temperature Grade | — | Standard (P) |
| Température de fonctionnement | — | [DATA_NEEDED: operating temperature range] |
| Peripherals | — | Peripheral pin multiplexing, CAN, SPI, serial interfaces |
| Code Compression | — | Yes (on-chip) |
| Intermodule Bus | — | Common IMB |
| Debug Interface | — | Background Debug Mode (BDM) |
| Statut RoHS | — | Compliant (per distributor listing) |
| Manufacturer | — | NXP USA Inc. (formerly Freescale/Motorola) |