MPC561CZP40 vs MPC563MZP56 Comparación
Comparación detallada lado a lado de MPC561CZP40 por NXP Semiconductors y MPC563MZP56 por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC561CZP40 - 40MHz PowerPC Qorivva MCU, 388-PBGA | NXP
MPC561CZP40 ⚠ Última compraComparación de especificaciones
| Parámetro | MPC561CZP40 | MPC563MZP56 |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $51,75 | $17,95 |
| Core Architecture | PowerPC (MPC5xx / Qorivva family) | PowerPC MPC5xx (32-bit) |
| Core Count | Single-core | — |
| Ancho del bus de datos | 32-bit | — |
| Frecuencia de reloj máxima | 40 MHz | — |
| Program Memory Type | ROMless (no internal Flash) | — |
| Package Type | 388-PBGA (Plastic Ball Grid Array) | — |
| Package Dimensions | 27 x 27 mm | — |
| Rango de temperatura de funcionamiento | -40C to +85C | — |
| Automotive Grade | AEC-Q100 Grade compliant (Automotive) | — |
| Supply Voltage Range | [DATA_NEEDED: Vcore/Vio supply range] | — |
| On-chip SRAM Size | [DATA_NEEDED: SRAM bytes] | — |
| External Bus Interface | Yes (32-bit bus, chip-selects via SIU) | — |
| ADC Channels | QADC (Queued ADC) - multi-channel | — |
| Timer Processing Unit | TPU - integrated motion-control timer | — |
| Peripheral Pin Multiplexing | Yes (SIU-controlled routing) | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Lead-free / RoHS | Lead-free finish; RoHS compliance varies by date code | — |
| Nivel MSL | MSL3 (typical for large PBGA) | [DATA_NEEDED: MSL rating] |
| Maximum CPU Frequency | — | 56 MHz |
| Program Memory (Flash) | — | 512 KB (512K x 8) |
| RAM Size | — | 36 KB |
| Operating Voltage | — | 5 V (typical) |
| Number of I/O Pins | — | [DATA_NEEDED: I/O count] |
| Encapsulado | — | 388-PBGA (27 x 27 mm) |
| Temperature Grade | — | Standard (P) |
| Temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Peripherals | — | Peripheral pin multiplexing, CAN, SPI, serial interfaces |
| Code Compression | — | Yes (on-chip) |
| Intermodule Bus | — | Common IMB |
| Debug Interface | — | Background Debug Mode (BDM) |
| Estado RoHS | — | Compliant (per distributor listing) |
| Manufacturer | — | NXP USA Inc. (formerly Freescale/Motorola) |