MPC566AZP56 - 32-bit PowerPC MCU 1MB Flash 56MHz | NXP
Teilenummer: MPC566AZP56 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $297.01 | $297,01 |
| 10 | $267.31 | $2.673,10 |
| 100 | $237.61 | $23.761,00 |
| 500 | $210.65 | $105.325,00 |
| 1.000 | $189.95 | $189.950,00 |
| 3.000 | $169.59 | $508.770,00 |
MPC566AZP56 Übersicht
A microcontroller (MCU) is a single-chip computer containing a processor core, embedded non-volatile memory (Flash), RAM, and a rich set of peripherals. The MPC566 belongs to the microcontrollers -> embedded processors -> integrated circuits taxonomy, and within NXP's portfolio it sits in the Qorivva (formerly MPC5xx) family of automotive powertrain MCUs.
Key features include a 56 MHz PowerPC core with a Burst Cold Cache (BCC) and a Floating-Point Unit (FPU) supporting single-precision arithmetic at hardware speed. The flash subsystem uses a Code Compression scheme optimized for non-cached automotive code, increasing effective bandwidth by approximately 40 percent versus the prior MPC565. The part is offered in a 388-PBGA package suitable for high-density powertrain ECUs where many interfaces are required.
Typical applications include automotive engine management ECUs, transmission control units, body controllers, and chassis controllers where deterministic real-time response, floating-point computation for control algorithms, and high-temperature tolerance are required. Use the part when an existing MPC566 design is being maintained, when long-lifecycle automotive-grade silicon is needed for service stock, and when production tooling cannot be reworked to a different footprint.
When designing with this BGA, allocate all PCB layers for the 388-ball escape, follow NXP's BGA layout rules for power/ground balls, and observe the thermal performance at high ambient. A heatsink is unnecessary, but the PCB copper stackup must dissipate the typical 1 to 3 W internal dissipation.
This page synthesizes distributor pricing, parametric and packagelevel comparison, and a curated list of drop-in alternatives that share the MPC5xx family pedigree, information not found on the manufacturer datasheet alone.
Drop-in-Alternativen für MPC566AZP56 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC566AZP56 (gleiche Bauform und Footprint) – abweichend in RAM Size, Core Architecture, Code Compression, Package, Program Memory Size.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC565MZP56
✅ Drop-In✓ Auf Lager
$39.8 / Stück
Datenblatt ansehen →MPC555LFMZP40
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MPC564MZP56
✅ Drop-In✓ Auf Lager
$78.1 / Stück
Datenblatt ansehen →MPC563MZP56
✅ Drop-In✓ Auf Lager
$17.95 / Stück
Datenblatt ansehen →MPC555LFAVR40
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MPCZ565MVR56
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$52.75 / Stück
Datenblatt ansehen →MPC566AZP56 Grenzwerte & elektrische Eigenschaften
| Family | Qorivva (MPC5xx) |
| Core | PowerPC Power Architecture with FPU + BCC |
| Datenbusbreite | 32-bit |
| Program Memory Size | 1 MB (1M x 8) FLASH |
| RAM Size | 36 KB |
| Maximale Taktfrequenz | 56 MHz |
| Betriebstemperaturbereich | -55 C to +125 C (Automotive Grade) |
| Package Type | 388-PBGA (27x27 mm) |
| Montageart | Surface Mount |
| Automotive Grade | Yes |
| Code Compression | Yes (Code compression, optimized for non-cached automotive code) |
| FPU | Dual precision floating-point unit |
MPC566AZP56 388-pbga (27x27 mm) Pinbelegungsleitfaden
Pinbelegung für MPC566AZP56 (388-pbga (27x27 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC566AZP56.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC566AZP56 ist geeignet für 6 Anwendungs: Automotive Engine Management ECU, Automatic Transmission Control Unit (TCU), Hybrid and Electric Vehicle Powertrain Controller, Body and Chassis Domain Controller, Industrial Diesel Engine Controller, Servo Drive and Robotics Motion Controller.
Automotive Engine Management ECU
The MPC566AZP56's 56 MHz PowerPC core with dual-precision FPU executes complex torque, fuel, and emissions control loops in real time at under-hood temperatures (per NXP datasheet -55 C to +125 C operation). Code Compression accelerates flash access for typical non-cached powertrain C code by approximately 40 percent, keeping ISR latency tight even when accessing the 1 MB flash image. The 388-PBGA exposes the CAN, SCI, and timer count required for injector, crank, and cam signal conditioning. AEC-Q100/automotive-grade qualification eases homologation for production programs.
Empfohlen
Automatic Transmission Control Unit (TCU)
The MPC566AZP56 fits automatic transmission ECUs because the FPU accelerates gear-shift and torque-vectoring math that would otherwise burden the CPU, while 1 MB flash holds lookup tables for shift maps across vehicle variants. The 36 KB RAM is sufficient for real-time scheduling of gearbox solenoids. The 388-PBGA gives automotive-grade manufacturers the rugged mechanical envelope required for transmission-module vibration and thermal stress per the manufacturer operating-temperature rating. Code Compression indirectly speeds up table lookups critical for shift quality.
Empfohlen
Hybrid and Electric Vehicle Powertrain Controller
Hybrid and battery-electric powertrains use the MPC566AZP56 as the supervisory MCU for inverter drivers, battery interface, and DC-DC converter control due to its deterministic real-time core and floating-point capability. Per NXP datasheet the Code Compression feature lets the 1 MB flash hold both powertrain firmware and calibration data sets without external memory. The -55 C to +125 C junction tolerance supports the underhood thermal envelope of hybrid architectures where ECUs sit next to inverters. The automotive-grade peripheral set covers CAN, SPI, and PWM for inverter handshaking.
Empfohlen
Body and Chassis Domain Controller
The MPC566AZP56 can serve as a body/chassis controller managing lighting, doors, and simple suspension drivers via its CAN and SCI peripherals in a 388-PBGA footprint. The PowerPC core handles multiple CAN message streams with low jitter; the 1 MB flash comfortably fits a body-control firmware plus bootloader stack. The automotive-grade operating range supports underhood and cabin deployment per the manufacturer temperature rating.
Empfohlen
Industrial Diesel Engine Controller
Outside passenger vehicles the MPC566AZP56 fits heavy-duty diesel and off-road engine controllers thanks to its -55 C to +125 C operating range, 56 MHz PowerPC core, and floating-point engine-knock and emissions math. The Code Compression feature conserves flash space for the large calibration maps that diesel controllers require. The 388-PBGA package is rugged enough for the vibration and thermal stress of off-road machinery per the manufacturer mechanical outline.
Empfohlen
Servo Drive and Robotics Motion Controller
The MPC566AZP56's FPU accelerates the PID + feedforward loops of industrial servo drives and six-axis robot controllers, while 36 KB RAM is enough to buffer multi-axis trajectory data. The automotive-grade temperature envelope accommodates factory-floor drive cabinets. The 388-PBGA supplies ample I/O for pulse-train, quadrature encoder, and CANopen peripherals when paired with external drivers.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC566AZP56 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC565MZP56 | MPC555LFMZP40 | MPC564MZP56 | MPC563MZP56 | MPC555LFAVR40 | MPCZ565MVR56 |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 388-PBGA (27x27 mm) | 388-PBGA - same | 388-PBGA - same | 388-PBGA - same | 388-PBGA - same | 388-PBGA - same | 388-PBGA - same |
| CPU Core | PowerPC with FPU + BCC | PowerPC with FPU (no BCC compression) | PowerPC with FPU | PowerPC with FPU | PowerPC with FPU | PowerPC with FPU | PowerPC with FPU |
| Max Clock Frequency | 56 MHz | 56 MHz | 40 MHz | 56 MHz | 56 MHz | 40 MHz | 56 MHz |
| Code Compression | Yes (approx. 40% flash perf uplift) | No | No | No | No | No | No |
| Automotive Grade | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Wichtigste Unterscheidungsmerkmale
- Code Compression boosting effective flash bandwidth by approximately 40% (vs. MPC565MZP56)
- Higher CPU frequency at 56 MHz vs older MPC555 at 40 MHz (vs. MPC555LFMZP40)
- Larger flash memory than the MPC563 predecessor (vs. MPC563MZP56)
Designhinweise
The 388-PBGA mechanical drawing must be on hand before starting layout. Provide at least 4 PCB layers with dedicated power and ground planes per NXP BGA design rules. Use microvias or dog-bone fanout under the ball grid; provide 50 ohm controlled impedance for high-speed peripheral traces (CAN, SPI). Decouple every Vcc ball with a 0.1 uF X7R capacitor placed within 1 ball-pitch distance and add 10 uF bulk caps for transient current. Reference the NXP BGA layout application note for via-in-pad instructions.
Estimated: at internal power dissipation of 1 to 3 W the 388-PBGA junction-to-ambient thermal path is dominated by the PCB copper area and airflow. Provide at least 10 cm^2 of unbroken ground copper on the top and bottom layers directly under the package to keep the die within the -55 C to +125 C operating window. Forced airflow above 1 m/s is recommended in sealed enclosures. There is no integrated heat slug on a PBGA so the PCB stackup is the primary thermal path.
Do not assume MPC565 -> MPC566 is a pure pin-to-pin replacement even though both use 388-PBGA - the Code Compression block changes boot behavior and the BCC register map must be re-initialized in firmware. Per NXP product page, the MPC566 is the upgraded version of the MPC565 - reusable on the same board but firmware update is required. Also verify Vcc tolerances against the latest datasheet revision before locking BOM.
Compliance-Informationen
Automotive grade per manufacturer description. RoHS, lead-free, halogen-free, and REACH status not confirmed in the provided web data. AEC-Q100 mentioned by NXP product page in connection with automotive qualification.
