MPC7410VS500LE vs MPC7410VS400LE Vergleich
Detaillierter Direktvergleich von MPC7410VS500LE von NXP Semiconductors und MPC7410VS400LE von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC7410VS500LE - PowerPC G4 MPU, 500MHz, 360-FCCLGA | NXP
MPC7410VS500LE ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC7410VS500LE | MPC7410VS400LE |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $162,00 | $21,00 |
| Manufacturer | NXP USA Inc. (formerly Freescale, originally Motorola) | NXP Semiconductors (formerly Freescale) |
| Product Type | 32-bit Embedded Microprocessor (MPU) | — |
| Series | MPC74xx (NITRO) | MPC74xx PowerPC G4 |
| Core | PowerPC G4, 1 Core | — |
| Architecture | Power Architecture with AltiVec SIMD | — |
| Datenbusbreite | 32-bit | 32-bit (64-bit external per parametric records) |
| Maximale Taktfrequenz | 500 MHz | 400 MHz |
| Silicon Revision | R1.4 | — |
| Betriebstemperatur | 0 °C to 105 °C (NITRO industrial) | -40C to +105C (industrial "LE" grade per Mouser listing) |
| Process Technology | 0.13 µm CMOS | 0.18 um CMOS |
| Core / I/O Voltage | 1.8 V core / 2.5 V I/O (typical) | — |
| L1 Cache | 32 KB instruction + 32 KB data | — |
| SIMD Engine | AltiVec 128-bit vector unit | — |
| FPU | Hardware double-precision floating-point | — |
| MMU | Yes (BookE-enhanced PowerPC) | — |
| System Bus | MPX high-bandwidth bus | — |
| Gehäuse | 360-FCCLGA, 25 x 25 mm, flip-chip ceramic BGA | — |
| Lead-Free (Pb-Free) | Yes (LE suffix) | — |
| RoHS-Status | Compliant | [DATA_NEEDED: lead-free / RoHS confirmation per datasheet label] |
| Montageart | Surface Mount | Surface Mount (LGA socket or solder) |
| Core Architecture | — | PowerPC G4 RISC |
| Core Count | — | 1 |
| Versorgungsspannung | — | 1.8 V / 2.5 V / 3.3 V |
| Gehäuse / Bauform | — | 360-FCCLGA (Flip-Chip Ceramic LGA), 25 x 25 mm |
| Pin / Ball Count | — | 360 |
| Tray Packaging | — | Tray (per FindIC parametric record) |
| Lead-Free / PB-Free | — | Yes (per Mouser description: "PB FREE") |
| Instruction Set | — | PowerPC RISC |
| On-Chip Cache | — | L1 (instruction + data); L2 (per family datasheet) |