MPC7410VS500LE vs MPC7410VS400LE Comparaison
Comparaison détaillée côte à côte de MPC7410VS500LE par NXP Semiconductors et MPC7410VS400LE par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC7410VS500LE - PowerPC G4 MPU, 500MHz, 360-FCCLGA | NXP
MPC7410VS500LE ⚠ Dernier achatComparaison des spécifications
| Paramètre | MPC7410VS500LE | MPC7410VS400LE |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Dernier achat | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $162,00 | $21,00 |
| Manufacturer | NXP USA Inc. (formerly Freescale, originally Motorola) | NXP Semiconductors (formerly Freescale) |
| Product Type | 32-bit Embedded Microprocessor (MPU) | — |
| Series | MPC74xx (NITRO) | MPC74xx PowerPC G4 |
| Core | PowerPC G4, 1 Core | — |
| Architecture | Power Architecture with AltiVec SIMD | — |
| Largeur du bus de données | 32-bit | 32-bit (64-bit external per parametric records) |
| Fréquence d'horloge maximale | 500 MHz | 400 MHz |
| Silicon Revision | R1.4 | — |
| Température de fonctionnement | 0 °C to 105 °C (NITRO industrial) | -40C to +105C (industrial "LE" grade per Mouser listing) |
| Process Technology | 0.13 µm CMOS | 0.18 um CMOS |
| Core / I/O Voltage | 1.8 V core / 2.5 V I/O (typical) | — |
| L1 Cache | 32 KB instruction + 32 KB data | — |
| SIMD Engine | AltiVec 128-bit vector unit | — |
| FPU | Hardware double-precision floating-point | — |
| MMU | Yes (BookE-enhanced PowerPC) | — |
| System Bus | MPX high-bandwidth bus | — |
| Boîtier | 360-FCCLGA, 25 x 25 mm, flip-chip ceramic BGA | — |
| Lead-Free (Pb-Free) | Yes (LE suffix) | — |
| Statut RoHS | Compliant | [DATA_NEEDED: lead-free / RoHS confirmation per datasheet label] |
| Type de montage | Surface Mount | Surface Mount (LGA socket or solder) |
| Core Architecture | — | PowerPC G4 RISC |
| Core Count | — | 1 |
| Tension d'alimentation | — | 1.8 V / 2.5 V / 3.3 V |
| Boîtier / Format | — | 360-FCCLGA (Flip-Chip Ceramic LGA), 25 x 25 mm |
| Pin / Ball Count | — | 360 |
| Tray Packaging | — | Tray (per FindIC parametric record) |
| Lead-Free / PB-Free | — | Yes (per Mouser description: "PB FREE") |
| Instruction Set | — | PowerPC RISC |
| On-Chip Cache | — | L1 (instruction + data); L2 (per family datasheet) |