MPC8245LVV300D vs MPC8245LZU300D Vergleich
Detaillierter Direktvergleich von MPC8245LVV300D von NXP Semiconductors und MPC8245LZU300D von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8245LZU300D - PowerQUICC II 300MHz Integrated Host Processor | NXP
MPC8245LZU300D NrndSpezifikationsvergleich
| Parameter | MPC8245LVV300D | MPC8245LZU300D |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Aktiv | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $79,40 | $71,90 |
| Core Processor | PowerPC 603e | — |
| Number of Cores | 1 | 1 |
| Datenbusbreite | 32-bit | — |
| Core Frequency | 300 MHz | 300 MHz |
| Series | MPC82xx | — |
| Co-Processors / DSP | None | — |
| RAM Controllers | SDRAM (64-bit) | — |
| Graphics Acceleration | No | — |
| Display & Interface Controllers | None | — |
| Ethernet | [DATA_NEEDED: integrated Ethernet MAC count] | — |
| USB | [DATA_NEEDED: integrated USB] | — |
| PCI Bridge | PCI 2.2, 32-bit, up to 66 MHz | — |
| Betriebstemperatur | 0 C to 105 C | 0C to +105C |
| Gehäuse | 352-TBGA (35 x 35 mm) | 352-TBGA (35x35 mm) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| Part Status | Active | — |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Processor Type | — | MPC82xx PowerQUICC II Integrated Host Processor |
| Core Architecture | — | PowerPC 603e (Power Architecture technology) |
| Performance | — | 570 MIPS |
| Core Supply Voltage | — | 1.8 V |
| Bus Width | — | 32-bit |
| L1 Instruction Cache | — | 16 KB |
| L1 Data Cache | — | 16 KB |
| Memory Controller | — | SDRAM, up to 2 GB, up to 133 MHz |
| PCI Interface | — | 32-bit, up to 66 MHz |
| Lead Status | — | Contains Lead |
| RoHS-Status | — | [DATA_NEEDED: RoHS compliance status] |
| Packaging | — | Tray |