MPC8245LZU300D - PowerQUICC II 300MHz Integrated Host Processor | NXP
Teilenummer: MPC8245LZU300D ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $114.38 | $114,38 |
| 10 | $108.5 | $1.085,00 |
| 100 | $95.2 | $9.520,00 |
| 500 | $82.4 | $41.200,00 |
| 1.000 | $71.9 | $71.900,00 |
MPC8245LZU300D Übersicht
An integrated host processor (IHP) of this class is a system-on-chip that merges a general-purpose CPU core, a memory controller, and a peripheral bridge into one package. The PowerQUICC II family sits within the broader Power Architecture taxonomy (CPU -> PowerPC -> PowerQUICC -> integrated host processor -> embedded SoC). By integrating the PCI bridge on-die, the MPC8245LZU300D eliminates an external PCI chip, simplifying board layout and reducing BOM count in router, switch, and RAID controller designs.
Key features include a 32-bit PCI interface operating up to 66 MHz, an SDRAM memory controller supporting up to 2 GB of memory at 133 MHz operation, two I2C interfaces, dual UART, and general-purpose I/O. The 352-TBGA package provides a high pin count needed for the external memory and PCI buses while maintaining manageable board area. Operating temperature range is 0C to 105C (the trailing D in the MPN indicates the industrial commercial temperature grade).
Architecturally, the MPC8245LZU300D implements the PowerPC 603e core with separate 16 KB instruction and 16 KB data level-1 caches, integrated memory management, and a 64-bit memory data bus. The integrated peripheral logic block handles DMA, interrupts, and the PCI bridge, offloading these tasks from the CPU. This integration yields a typical power dissipation figure around 2.0 W at 300 MHz, suitable for fanless embedded enclosures.
Typical applications include router and switch control planes, network-attached storage (NAS) controllers, RAID controllers, image-display controllers, and industrial embedded controllers. The 570 MIPS performance and PCI bus make it well suited for systems that aggregate peripheral I/O through a single host processor without a northbridge/southbridge chipset pair.
When designing with the MPC8245LZU300D, pay careful attention to the 352-TBGA PCB land pattern and ensure that the SDRAM routing supports 133 MHz operation with proper impedance control. Decoupling must follow the NXP reference design to prevent PLL noise from coupling into the SDRAM clock, which can otherwise introduce bit errors at high bus utilization.
This page synthesizes distributor pricing, drop-in same-package alternatives within the MPC8245 family, and practical design notes that go beyond what is printed in the manufacturer's datasheet.
Drop-in-Alternativen für MPC8245LZU300D – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8245LZU300D (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Package, Manufacturer, Core Architecture, Memory Controller.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8245LZU350D
✅ Drop-In✓ Auf Lager
$53.2 / Stück
Datenblatt ansehen →MPC8245LVV300D
✅ Drop-In✓ Auf Lager
$79.4 / Stück
Datenblatt ansehen →MPC8245LZU266D
✅ Drop-In✓ Auf Lager
$52.4 / Stück
Datenblatt ansehen →MPC8245TZU300D
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8245LZU300D Grenzwerte & elektrische Eigenschaften
| Processor Type | MPC82xx PowerQUICC II Integrated Host Processor |
| Core Architecture | PowerPC 603e (Power Architecture technology) |
| Core Frequency | 300 MHz |
| Performance | 570 MIPS |
| Core Supply Voltage | 1.8 V |
| Number of Cores | 1 |
| Bus Width | 32-bit |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| Memory Controller | SDRAM, up to 2 GB, up to 133 MHz |
| PCI Interface | 32-bit, up to 66 MHz |
| Gehäuse | 352-TBGA (35x35 mm) |
| Betriebstemperatur | 0C to +105C |
| Montageart | Surface Mount (BGA) |
| Lead Status | Contains Lead |
| Packaging | Tray |
MPC8245LZU300D 352-tbga (35x35 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8245LZU300D (352-tbga (35x35 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8245LZU300D.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8245LZU300D ist geeignet für 6 Anwendungs: Router and Switch Control Plane, Network-Attached Storage Controller, RAID Storage Controller, Industrial Embedded Controller, Image Display Controller, Legacy PCI-Based Embedded Platform.
Router and Switch Control Plane
The MPC8245LZU300D is a textbook fit for control-plane processing in routers and switches where its 570 MIPS PowerPC 603e core handles forwarding-table updates, routing-protocol state machines, and management-plane I/O aggregation. The integrated 32-bit PCI bridge at 66 MHz connects directly to line-card controllers or fabric ASICs without an external bridge chip, reducing board area in space-constrained chassis designs. The SDRAM controller supports up to 2 GB at 133 MHz, which is more than enough for route-table memory in mid-range enterprise routers. Compared with discrete CPU-plus-PCI-bridge designs, this part eliminates a chip and roughly USD 8-12 of BOM, while its 1.8 V core keeps power dissipation near 2 W for fanless edge devices.
Empfohlen
Network-Attached Storage Controller
In NAS controllers the MPC8245LZU300D acts as the system-on-chip that owns the file-system layer, RAID metadata, and the network-facing TCP/IP stack. The 570 MIPS core is sufficient for gigabit Ethernet throughput on small-to-medium NAS enclosures, and the 32-bit PCI bridge can host SATA or SCSI controller ASICs for the disk side. The SDRAM controller's 2 GB ceiling supports read-ahead buffers and metadata caching for typical home and SMB workloads. Designers pair this processor with an external Ethernet MAC and PHY on the PCI bus, which lets the same MPC8245LZU300D reference design serve multiple NAS SKU variants by swapping the I/O card.
Empfohlen
RAID Storage Controller
RAID controllers benefit from the MPC8245LZU300D's 32-bit PCI bridge at 66 MHz, which is the host interface for connecting to a host system or backplane, plus its 570 MIPS performance for parity computation and rebuild processing. The SDRAM controller's 2 GB ceiling accommodates write-back cache memory, which dramatically improves RAID-5 and RAID-6 write performance. The integrated peripheral block reduces host-CPU loading by handling DMA for disk transfers. Operating temperature of 0C to 105C covers the thermal envelope of typical storage chassis with modest airflow.
Empfohlen
Industrial Embedded Controller
For industrial embedded applications the MPC8245LZU300D offers a stable Power Architecture computing platform with PCI expansion for measurement and motion-control cards. The 0C to 105C operating temperature grade supports factory-floor enclosures without active cooling, and the BGA package withstands industrial vibration profiles when properly socketed or soldered. The dual UART and I2C interfaces connect directly to industrial sensors and HMIs, reducing external logic. Compared to microcontrollers, this 300 MHz host processor with PCI brings desktop-class I/O scalability to factory automation designs.
Empfohlen
Image Display Controller
Image-display systems such as medical imaging consoles and digital signage controllers use the MPC8245LZU300D to drive LCD panels and capture video streams over PCI. The 570 MIPS performance is more than sufficient for real-time color-space conversion and overlay composition at standard-definition and HD video rates. The 32-bit PCI bridge at 66 MHz accommodates video-input frame grabbers and graphics accelerators. The SDRAM controller holds frame buffers up to 2 GB, which supports multi-buffered rendering pipelines at 1080p resolutions.
Empfohlen
Legacy PCI-Based Embedded Platform
The MPC8245LZU300D serves as a host CPU in legacy PCI-based embedded platforms where a complete northbridge/southbridge chipset is undesirable. The integrated PCI bridge provides direct attachment for multiple PCI peripherals, including networking cards, disk controllers, and DSP modules. With 570 MIPS and 2 GB SDRAM support, the design can host a real-time operating system such as VxWorks or Linux with full networking and storage stacks. This is a well-proven design pattern in industrial PCs and test equipment.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8245LZU300D – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8245LZU350D | MPC8245LVV300D | MPC8245LZU266D | MPC8245TZU300D |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 352-TBGA (35x35) | 352-TBGA (35x35) - same | 352-LBGA (35x35) - same ball count | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same |
| Core Frequency | 300 MHz | 350 MHz | 300 MHz | 266 MHz | 300 MHz |
| Core Architecture | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| PCI Interface | 32-bit, 66 MHz | 32-bit, 66 MHz | 32-bit, 66 MHz | 32-bit, 66 MHz | 32-bit, 66 MHz |
| Operating Temperature | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C | 0C to +105C (T grade) |
Wichtigste Unterscheidungsmerkmale
- Mid-tier speed grade with drop-in upgrade path to 350 MHz (vs. MPC8245LZU266D)
- TBGA substrate for better thermal performance than LBGA (vs. MPC8245LVV300D)
- Single-chip integration eliminates external PCI bridge (vs. Discrete CPU + external PCI bridge designs)
Designhinweise
Estimated: at 1.8 V core supply and 300 MHz operation, typical power dissipation for the MPC8245LZU300D is in the 2.0 W range. With a 352-TBGA package on a standard 4-layer PCB, expect theta_JA near 20-25 C/W, which yields a junction-to-ambient rise of approximately 40-50 C above ambient at full CPU utilization. For fanless enclosures, ensure the PCB thermal relief pattern connects to inner ground planes with thermal vias under the die area. Active cooling is generally not required at this power level.
BGA land-pattern design must follow the NXP-recommended 1.0 mm pitch pad geometry for the 352-TBGA. Use NSMD (non-solder-mask-defined) pads to improve joint reliability, and route signals on inner layers with microvia escape patterns. The SDRAM bus runs at 133 MHz, so length-match the data, address, and clock traces within tight skew budgets (typically +/-25 ps for the byte lanes). A solid reference plane beneath the BGA is essential for signal-integrity margins on the PCI bus at 66 MHz.
Place the 1.8 V core decoupling capacitors as close as possible to the BGA power balls, with a mix of bulk (10 uF), mid-range (0.1 uF), and high-frequency (1 nF) values to cover the full noise spectrum of the PowerPC 603e core. The PLL supply pin requires an isolated filter network (typically an LC pi-section) to prevent jitter on the SDRAM clock. For the PCI bus at 66 MHz, maintain 50 ohm single-ended impedance with 60 ohm differential for the PCI clock pair.
Do not assume cross-package compatibility between the TBGA and LBGA versions without verifying the ball metallurgy matches your assembly process. The MPC8245LZU300D contains lead in the solder balls - confirm your manufacturing line can handle lead-bearing reflow, or transition to a lead-free equivalent. JTAG debugging requires a TAP controller connected to the dedicated JTAG balls; missing this on the schematic is a common board respin cause.
Compliance-Informationen
Per the digchip datasheet listing, MPC8245LZU300D carries a 'Contains Lead' status. RoHS and REACH compliance status was not confirmed in the verified web data and is marked as unknown.