MPC8245LVV300D - PowerPC 603e MPU 300MHz PCI Host | NXP
Teilenummer: MPC8245LVV300D ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $114.8 | $114,80 |
| 10 | $109.5 | $1.095,00 |
| 100 | $98.75 | $9.875,00 |
| 500 | $87.2 | $43.600,00 |
| 1.000 | $79.4 | $79.400,00 |
MPC8245LVV300D Übersicht
An integrated host processor (IHP) is a system-on-chip (SoC) class device that merges a microprocessor core, a DRAM controller, and a peripheral bridge on a single silicon die. Within the broader taxonomy it sits as a microprocessor -> MPU -> embedded processor -> SoC, and is widely used as a glue-less host in networking, storage, and industrial-control designs where a discrete CPU plus northbridge would be too costly or power-hungry. The MPC8245 specifically targets applications that need PCI connectivity for off-the-shelf peripherals while keeping the BOM small.
Key features of the MPC8245LVV300D include a 300 MHz PowerPC 603e core with separate 16 KB instruction and 16 KB data L1 caches, an integrated 64-bit SDRAM memory controller, a 32-bit PCI 2.2-compliant bridge operating up to 66 MHz, and dual UART, I2C, and memory-mapped peripheral interfaces. The 603e core implements speculative, out-of-order execution with hardware table-walk for demand paging, enabling Linux, VxWorks, and other embedded operating systems to run on the device.
Architecturally, the device is partitioned into the 603e processor block, the internal bus (PIBUS), the memory controller, and the peripheral block including the PCI bridge. This partitioning lets designers connect industry-standard SDRAM and PCI peripherals without external glue logic. The 352-TBGA package exposes the full 64-bit memory bus and the 32-bit PCI bus, supporting both PC100 SDRAM and a wide range of PCI peripherals.
Typical applications include SOHO routers and switches, network-attached storage (NAS) controllers, industrial PC/104 single-board computers, print and imaging controllers, and point-of-sale terminals. The combination of PCI, SDRAM, and a mature PowerPC ecosystem makes it a frequent choice in designs that must boot Linux and connect to standard PCI peripherals on a compact board.
When designing with this part, pay close attention to the SDRAM trace-length matching guidelines in the MPC8245 hardware specifications document, because the 64-bit memory bus is sensitive to skew. Also confirm that the operating temperature range (0C to 105C) matches the end-equipment thermal profile, since the part is specified for commercial (not industrial) environments.
This page synthesizes NXP product information, distributor pricing, and drop-in alternatives for the MPC8245LVV300D to help engineers verify fit and select substitutes faster than they could from the manufacturer datasheet alone.
Drop-in-Alternativen für MPC8245LVV300D – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8245LVV300D (gleiche Bauform und Footprint) – abweichend in Operating Temperature, Manufacturer, Package, Memory Controller, PCI Interface.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8245LZU300D
✅ Drop-In✓ Auf Lager
$71.9 / Stück
Datenblatt ansehen →MPC8245TZU300D
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8245LVV300D Grenzwerte & elektrische Eigenschaften
| Core Processor | PowerPC 603e |
| Number of Cores | 1 |
| Datenbusbreite | 32-bit |
| Core Frequency | 300 MHz |
| Series | MPC82xx |
| Co-Processors / DSP | None |
| RAM Controllers | SDRAM (64-bit) |
| Graphics Acceleration | No |
| Display & Interface Controllers | None |
| PCI Bridge | PCI 2.2, 32-bit, up to 66 MHz |
| Betriebstemperatur | 0 C to 105 C |
| Gehäuse | 352-TBGA (35 x 35 mm) |
| Montageart | Surface Mount |
| Part Status | Active |
| Manufacturer | NXP Semiconductors (formerly Freescale) |
MPC8245LVV300D 352-tbga (35 x 35 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8245LVV300D (352-tbga (35 x 35 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8245LVV300D.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8245LVV300D ist geeignet für 6 Anwendungs: SOHO Router / Switch, Network-Attached Storage (NAS) Controller, Industrial PC/104 Single-Board Computer, Print and Imaging Controller, Point-of-Sale (POS) Terminal, Embedded Firewall / VPN Appliance.
SOHO Router / Switch
The MPC8245LVV300D's 300 MHz PowerPC 603e core, integrated PCI 2.2 bridge, and 64-bit SDRAM controller are well-matched to small-office routers and Layer-2/3 switches that need a CPU host to run a routing stack plus PCI-attached Ethernet or WAN PHYs. Designers place the device on a compact carrier with PC100 SDRAM and one or more PCI Ethernet controllers, leveraging the host's mature Linux BSP to ship firmware fast. Trade-off: at 300 MHz the device limits packet-processing throughput versus modern ARM SoCs, so it is best suited to <200 Mbps aggregate throughput, where its compact footprint and PowerPC software reuse outweigh raw CPU speed.
Empfohlen
Network-Attached Storage (NAS) Controller
The MPC8245LVV300D is used as the main CPU in entry-level NAS controllers, where its 64-bit SDRAM controller drives up to 512 MB of PC100 SDRAM and the PCI bridge hosts SATA or IDE controller cards. The 603e core's hardware MMU lets engineers run embedded Linux with SMB/CIFS, NFS, and iSCSI stacks without external glue logic. Concrete advantage over a discrete CPU-plus-chipset design: a single 35 x 35 mm TBGA replaces the CPU, northbridge, and a side-band glue ASIC, cutting BOM cost and board area by roughly 30 percent. Designers must follow the NXP SDRAM routing guidelines for the 64-bit bus to keep signal integrity within spec.
Empfohlen
Industrial PC/104 Single-Board Computer
The MPC8245LVV300D's compact 352-TBGA package suits PC/104-plus single-board computers where board real estate is at a premium and PCI-104 expansion is required. Engineers leverage the integrated PCI bridge to expose a PC/104-Plus (PCI) stack for off-the-shelf data-acquisition and motion-control cards, while the 603e core runs a deterministic real-time OS such as VxWorks or QNX. The 0 C to 105 C commercial temperature grade fits cabinet-mounted industrial PCs in factory environments; for harsher deployments a wider-grade part or external thermal management is required. The part's long product life cycle also matches industrial program durations measured in decades.
Empfohlen
Print and Imaging Controller
The MPC8245LVV300D fits mid-volume multifunction printer (MFP) controllers, where the 300 MHz 603e runs the print/image pipeline and the PCI bridge attaches scan engines and network interface cards. Designers pair the host with 64 to 128 MB of SDRAM and a JPEG/MJPEG accelerator over PCI for A4-class scan-to-file throughput. The compact 35 x 35 mm TBGA footprint drops onto a printer main board with room left for high-voltage circuitry, and the PowerPC toolchain is well-supported by Green Hills and Wind River compilers for production code. Compared with newer ARM SoCs the 603e offers longer software stability, which printer OEMs value for multi-year product runs.
Empfohlen
Point-of-Sale (POS) Terminal
The MPC8245LVV300D is deployed in compact POS terminals where its PCI bus supports magnetic-stripe readers, thermal printers, and customer-display cards while the SDRAM controller drives the LCD frame buffer. The 0 C to 105 C commercial temperature range suits retail back-office environments, and the PowerPC core runs embedded Linux with the OpenSSL and EMV libraries needed for payment processing. Power consumption stays manageable because the 603e core scales clock and voltage under software control, and the integrated bridge removes an external ASIC that older designs needed. Trade-off: the 300 MHz core is not fast enough for high-end video-promotion POS, so design teams reserve it for standard retail SKUs.
Empfohlen
Embedded Firewall / VPN Appliance
The MPC8245LVV300D runs embedded Linux in small-business firewall and VPN appliances, with the PCI bridge hosting crypto accelerator cards and the SDRAM controller feeding packet buffers. The 603e's hardware MMU supports secure memory partitioning required for IPSec and TLS stacks, while the 64-bit memory bus sustains line-rate filtering on Fast Ethernet uplinks. Compared with a discrete x86 solution, the integrated host reduces board area and power to a level that fits a fanless appliance enclosure. Designers must still budget CPU cycles: at 300 MHz the device tops out around 50 Mbps of IPSec throughput, so it is positioned for SOHO rather than enterprise edge.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8245LVV300D – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8245LZU300D | MPC8245TZU300D |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 352-TBGA (35 x 35 mm) | 352-TBGA (same) | 352-TBGA (same) |
| Core Architecture | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| Core Frequency | 300 MHz | 300 MHz | 300 MHz |
| Number of Cores | 1 | 1 | 1 |
| Bus Width | 32-bit | 32-bit | 32-bit |
| RAM Controller | SDRAM 64-bit | SDRAM 64-bit | SDRAM 64-bit |
| PCI Bridge | PCI 2.2, 32-bit | PCI 2.2, 32-bit | PCI 2.2, 32-bit |
Wichtigste Unterscheidungsmerkmale
- Integrated PCI 2.2 bridge on-die (vs. MPC8245LZU300D)
- 300 MHz speed grade at 0-105C commercial range (vs. MPC8245TZU300D)
- Mature PowerPC ecosystem with Linux and VxWorks BSPs (vs. Generic ARM SoC alternatives)
Designhinweise
The 64-bit SDRAM memory bus on the MPC8245LVV300D is sensitive to trace-length skew; route all data, address, and clock nets to within the limits specified in the NXP hardware specifications document (typically +/- 50 ps for the byte clocks). Place SDRAM chips on the same layer as the 352-TBGA and keep the bus as short as possible to avoid reflections. Estimated: a 4-layer FR-4 stack-up with 8 mil dielectric and matched 50 ohm traces is the minimum recommended starting point for prototypes.
At 300 MHz the MPC8245LVV300D dissipates approximately 2 W to 3 W under typical workload, so the 352-TBGA package must be paired with adequate copper thermal vias under the die flag and, if needed, a small heat spreader. Use the junction-to-ambient thermal resistance figure from the datasheet to size the cooling solution; for a sealed enclosure target theta_JA below 20 C/W to keep Tj under 105 C at 70 C ambient. Always validate with a thermocouple on the package top during worst-case workload (e.g., PCI streaming + memory test).
Decouple the MPC8245LVV300D with bulk and high-frequency capacitors placed as close as possible to each power pin: a 10 uF bulk cap per rail plus a 0.1 uF X7R cap per pin pair is the typical starting pattern. The 603e core voltage and the PCI/I/O voltage must power up in the sequence documented in the datasheet to avoid latch-up; use a power-sequencer IC if the rest of the board cannot enforce ordering. Confirm hold-up time on the core rail with an oscilloscope at first prototype bring-up.
Do not assume all 352-TBGA variants of the MPC8245 share identical ball maps; the LVV, LZU, and TZU suffixes denote different package pin assignments per the FindIC and Utmel comparison records. Always cross-check the package drawing against your PCB footprint before substituting. Also verify the operating temperature grade (commercial vs industrial) for each suffix, since the part is qualified 0 C to 105 C in this SKU but other speed grades may differ.
The PCI bus on the MPC8245LVV300D supports up to 66 MHz; at that speed, source termination is recommended on the PCI clock and signal traces should be length-matched to within +/- 0.5 inch. Series resistors or PCI-specific termination networks may be required for >4 inch PCI trace lengths to dampen ringing. Run a signal-integrity simulation with the actual stack-up and connector model before committing to layout.
Compliance-Informationen
RoHS, REACH, lead-free, halogen-free, and conflict-mineral status were not stated in the Verified Web Data provided; refer to NXP material declaration documents for confirmation. AEC-Q100 is not applicable because this is a commercial-grade MPU, not an automotive-qualified part.
