MPC8245LZU350D vs MPC8245LZU300D Vergleich
Detaillierter Direktvergleich von MPC8245LZU350D von NXP Semiconductors und MPC8245LZU300D von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8245LZU300D - PowerQUICC II 300MHz Integrated Host Processor | NXP
MPC8245LZU300D NrndSpezifikationsvergleich
| Parameter | MPC8245LZU350D | MPC8245LZU300D |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $53,20 | $71,90 |
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) | — |
| Series | MPC82xx | — |
| Core Processor | PowerPC 603e | — |
| Core Architecture | Power Architecture (32-bit) | PowerPC 603e (Power Architecture technology) |
| Number of Cores | 1 | 1 |
| Datenbusbreite | 32 bit | — |
| Maximale Taktfrequenz | 350 MHz | — |
| Performance | 665 MIPS | 570 MIPS |
| Operating Voltage (Core/I/O) | 3.3 V | — |
| Process Technology | 0.25 um CMOS | — |
| Integrated Bridge | PCI Bridge (up to 66 MHz) | — |
| L1 Cache (I/D) | 16 KB / 16 KB | — |
| Memory Controller | SDRAM with ECC support | SDRAM, up to 2 GB, up to 133 MHz |
| Betriebstemperatur | 0C to +105C | 0C to +105C |
| Gehäuse | 352-TBGA (35x35 mm) | 352-TBGA (35x35 mm) |
| Montageart | Surface Mount | Surface Mount (BGA) |
| RoHS-Status | Non-Compliant (legacy) | [DATA_NEEDED: RoHS compliance status] |
| Processor Type | — | MPC82xx PowerQUICC II Integrated Host Processor |
| Core Frequency | — | 300 MHz |
| Core Supply Voltage | — | 1.8 V |
| Bus Width | — | 32-bit |
| L1 Instruction Cache | — | 16 KB |
| L1 Data Cache | — | 16 KB |
| PCI Interface | — | 32-bit, up to 66 MHz |
| Lead Status | — | Contains Lead |
| Packaging | — | Tray |