MPC8245LZU350D - PowerPC 603e 350MHz Host Processor | NXP
Teilenummer: MPC8245LZU350D ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $78.5 | $78,50 |
| 10 | $72 | $720,00 |
| 100 | $64.5 | $6.450,00 |
| 500 | $58.75 | $29.375,00 |
| 1.000 | $53.2 | $53.200,00 |
MPC8245LZU350D Übersicht
What is an integrated host processor? An integrated host processor is a system-on-chip that merges a general-purpose CPU core with peripheral controllers (PCI, memory, I/O) onto a single die, eliminating the need for a discrete north bridge. Within the taxonomy, the MPC8245LZU350D sits at: integrated host processor -> embedded microprocessor -> MPU -> semiconductor. It belongs to NXP's MPC82xx family, designed to bridge PowerPC performance with peripheral integration for networking and storage.
Key features of the MPC8245LZU350D include a 350 MHz PowerPC 603e core, integrated PCI bridge supporting up to 66 MHz PCI operation, SDRAM memory controller, 32-bit data bus architecture, and 0.25 um CMOS process technology. Operating voltage is centered at 3.3V with multiple power rails. The integrated design reduces board complexity, BOM cost, and power consumption compared to discrete CPU-plus-chipset solutions.
Technically, the device uses a superscalar PowerPC 603e core with separate 16 KB instruction and 16 KB data L1 caches, hardware table-walk for MMU translations, and dedicated SDRAM controller with ECC support. The internal PCI bridge arbitrates transactions between the processor core and PCI peripherals, simplifying PCB routing and reducing latency for I/O-bound workloads.
Typical applications include networking infrastructure (routers, switches, access controllers), storage controllers (RAID, NAS), printer/imaging controllers, industrial automation controllers, and embedded telecom equipment. Its balance of compute throughput with peripheral integration makes it ideal for mid-range systems previously requiring separate host bridges.
When designing with this part, ensure the 3.3V core and I/O rails are properly decoupled, the JTAG boundary-scan chain is correctly terminated, and the TBGA substrate thermal vias provide adequate heat removal. Designers should verify that boot ROM and reset configuration straps are correctly pulled to select CPU-to-memory ratio and boot source.
This page synthesizes distributor pricing, datasheet specifications, drop-in compatible same-package alternatives, and practical design considerations not found in the manufacturer datasheet alone, giving procurement and design engineers a single source for evaluating the MPC8245LZU350D in long-lifecycle embedded designs.
Drop-in-Alternativen für MPC8245LZU350D – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8245LZU350D (gleiche Bauform und Footprint) – abweichend in Performance, Mounting Type, Operating Temperature, Package, Core Architecture.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8245TZU350D
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC8245LZU266D
✅ Drop-In✓ Auf Lager
$52.4 / Stück
Datenblatt ansehen →MPC8245LZU300D
✅ Drop-In✓ Auf Lager
$71.9 / Stück
Datenblatt ansehen →MPC8245LZU350D Grenzwerte & elektrische Eigenschaften
| Manufacturer | NXP USA Inc. (formerly Freescale Semiconductor) |
| Series | MPC82xx |
| Core Processor | PowerPC 603e |
| Core Architecture | Power Architecture (32-bit) |
| Number of Cores | 1 |
| Datenbusbreite | 32 bit |
| Maximale Taktfrequenz | 350 MHz |
| Performance | 665 MIPS |
| Operating Voltage (Core/I/O) | 3.3 V |
| Process Technology | 0.25 um CMOS |
| Integrated Bridge | PCI Bridge (up to 66 MHz) |
| L1 Cache (I/D) | 16 KB / 16 KB |
| Memory Controller | SDRAM with ECC support |
| Betriebstemperatur | 0C to +105C |
| Gehäuse | 352-TBGA (35x35 mm) |
| Montageart | Surface Mount |
| RoHS-Status | Non-Compliant (legacy) |
MPC8245LZU350D 352-tbga (35x35 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8245LZU350D (352-tbga (35x35 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8245LZU350D.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8245LZU350D ist geeignet für 6 Anwendungs: Networking Infrastructure Routers, Storage RAID/NAS Controllers, Printer and Imaging Controllers, Industrial Automation Controllers, Embedded Telecom Equipment, Medical Imaging and Diagnostic Devices.
Networking Infrastructure Routers
The MPC8245LZU350D's 350 MHz PowerPC 603e core and integrated PCI bridge make it ideal for mid-range networking routers. With 665 MIPS throughput, it handles routing table updates, packet classification, and forwarding at line-rate for Fast Ethernet and early Gigabit designs. The on-chip PCI bus connects directly to network interface controllers and switch fabrics, eliminating a discrete north bridge. Designers place the MPC8245LZU350D on a 4-layer PCB with SDRAM and PHY peripherals; the integrated design reduces BOM cost by 20% versus discrete CPU-plus-chipset solutions.
Empfohlen
Storage RAID/NAS Controllers
The MPC8245LZU350D suits entry-level RAID and NAS controllers because its PCI bridge natively interfaces to SATA or SCSI host adapters while the 603e core runs filesystem and RAID-management firmware. The 32-bit data path and SDRAM controller with ECC protect data integrity critical for storage workloads. The 3.3V core supply and TBGA package deliver compact integration, enabling 1U rack form factors. Engineers benefit from the integrated host bridge topology that reduces board area by approximately 30% versus non-integrated designs.
Empfohlen
Printer and Imaging Controllers
The MPC8245LZU350D delivers 665 MIPS compute suitable for high-end printer controllers that process PDL (Page Description Language) rendering and image pipelines. Its PCI bridge connects to imaging ASICs and high-speed scanner interfaces, eliminating the need for external glue logic. The 16 KB/16 KB L1 cache accelerates pixel manipulation, and the SDRAM controller supports the large frame buffers required for 1200 dpi printing. Operating from 0C to +105C, it tolerates the elevated temperatures inside printer enclosures.
Empfohlen
Industrial Automation Controllers
The MPC8245LZU350D's deterministic PowerPC core and integrated peripheral mix make it well-suited for factory-floor PLCs, motion controllers, and HMI stations. Its PCI bus interfaces to fieldbus cards (Profibus, DeviceNet), while the 3.3V supply and TBGA package fit compact DIN-rail enclosures. The 0C to +105C operating range covers most industrial cabinet environments. Engineers value the long-term software stability of the PowerPC toolchain, which protects multi-year industrial product lifecycles.
Empfohlen
Embedded Telecom Equipment
The MPC8245LZU350D targets embedded telecom systems including VoIP gateways, media converters, and protocol converters. Its PCI bridge interfaces to T1/E1 framer ASICs and DSP cards, while the 603e core handles signaling stacks and management interfaces. The integrated host topology reduces BOM cost for price-sensitive carrier-grade equipment. The legacy NXP architecture provides mature, stable firmware ecosystems that telecom vendors have qualified over decades of deployment.
Empfohlen
Medical Imaging and Diagnostic Devices
The MPC8245LZU350D's reliability and processing capability suit regulated medical devices such as ultrasound carts, patient monitors, and diagnostic analyzers. The 350 MHz PowerPC core runs image processing and UI logic, while the PCI bridge interfaces to capture ASICs and display controllers. Long-term availability through distributors like Rochester Electronics supports the 7-15 year product lifecycles typical of medical equipment. The 32-bit deterministic core simplifies FDA 510(k) software validation by providing predictable real-time behavior.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8245LZU350D – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8245TZU350D | MPC8245LZU266D | MPC8245LZU300D |
|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 352-TBGA (35x35) | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same | 352-TBGA (35x35) - same |
| Core Frequency | 350 MHz | 350 MHz | 266 MHz (-24%) | 300 MHz (-14%) |
| Performance | 665 MIPS | 665 MIPS | 505 MIPS | 570 MIPS |
| Core Architecture | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC 603e |
| Temperature Grade | 0C to +105C (L) | Extended (T) | 0C to +105C (L) | 0C to +105C (L) |
| Operating Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Pin/Ball Count | 352 | 352 | 352 | 352 |
Wichtigste Unterscheidungsmerkmale
- Higher compute performance at same package (vs. MPC8245LZU266D)
- Identical clock and performance with extended temperature (vs. MPC8245TZU350D)
- Same-package upgrade path from 300 MHz step (vs. MPC8245LZU300D)
Designhinweise
The 352-TBGA package requires thermal vias under the die and adequate copper pours on inner PCB layers to dissipate the 3-5W typical power dissipation. At maximum ambient of 105C, designers must verify junction temperature stays below the rated maximum using the package theta_JA from the datasheet. Add a heatsink only if natural convection is insufficient for the enclosure.
Route the 32-bit data bus with matched impedance (50 ohm typical) and keep trace lengths matched within +/- 100 mils to avoid setup/hold violations on the SDRAM interface. Place SDRAM chips adjacent to the MPC8245LZU350D with short traces; add series termination resistors near the driver if reflections appear on the SDRAM clock. The PCI bus also requires 50-65 ohm impedance and length matching for 66 MHz operation.
Do not confuse the 'ZU' (TBGA 35x35) suffix with other MPC8245 package codes such as 'TZU' or 'ZU' from related families. Verify boot configuration resistor strapping against the datasheet's reset configuration chapter, as incorrect settings can cause silent boot failures. Confirm JTAG chain integrity during prototype bring-up because BGA rework is expensive if boundary-scan is broken.
Use separate decoupling capacitor banks for the core (3.3V), SDRAM interface, and PCI I/O rails. Place 0.1 uF ceramic capacitors within 50 mils of each supply pin and add bulk tantalum or polymer capacitors (10-100 uF) near the package. Power sequencing between rails may be required per the datasheet; check the power-up chapter before finalizing the regulator topology.
Compliance-Informationen
Legacy Freescale/NXP part predates full RoHS transition; lead-free reflow profiles may not be supported per datasheet. REACH compliance assumed from NXP legacy product documentation.