MPC8255AVVMHBB vs MPC8255ACZUMHBB Vergleich

Detaillierter Direktvergleich von MPC8255AVVMHBB von NXP Semiconductors und MPC8255ACZUMHBB von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC8255AVVMHBB MPC8255AVVMHBB - PowerQUICC II 266MHz 32-Bit MPU | NXP

MPC8255AVVMHBB - PowerQUICC II 266MHz 32-Bit MPU | NXP

MPC8255AVVMHBB Obsolete
NXP Semiconductors
MPC8255ACZUMHBB MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP

MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP

MPC8255ACZUMHBB Obsolete

Spezifikationsvergleich

Parameter MPC8255AVVMHBB MPC8255ACZUMHBB
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $78,80 $97,50
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) NXP Semiconductors
Series PowerQUICC II (MPC82xx) PowerQUICC II HIP4
Core Architecture PowerPC G2, 32-bit PowerPC G2
Core Frequency 266 MHz —
Bus Frequency 133 MHz (core-to-memory bus) —
Number of Cores 1 1
Cache (I/D) 16 Kbyte instruction / 16 Kbyte data —
Gehäuse 480-TBGA (37.5 x 37.5 mm, 1.27 mm pitch) —
Core Supply Voltage 1.8 V 1.8 V
I/O Supply Voltage 3.3 V —
Integrated Ethernet MAC 2x 10/100 Mbit/s (MII/RMII) —
PCI Interface Yes (32-bit, 66 MHz capable) —
CPM Serial Controllers HDLC/SDLC, UART, I2C, SPI, SCC/SMC —
Betriebstemperatur -40C to +105C (extended, per 'MH' suffix) [DATA_NEEDED: operating temperature range]
Process Technology 0.18 micrometre CMOS 0.25 micron (HiP4) silicon revision
Montageart Surface Mount (BGA) Surface Mount
RoHS-Status Non-compliant (NO-PB suffix - lead-bearing) [DATA_NEEDED: RoHS compliance status]
Lifecycle No Longer Manufactured (NXP) —
Datenbusbreite — 64-Bit
Maximum Clock Speed — 266 MHz
Instruction Set — 32-Bit RISC
Core — MPC82xx
Package Type — T-BGA
Pin/Ball Count — 480
Package Size — 37.50 x 37.50 mm
Package Height — 1.55 mm
Ball Pitch — 1.27 mm
Integrated CPM — Yes (dual communications processor modules)
Ethernet MACs — Dual 10/100 MAC

Datenblätter & Ressourcen

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