MPC8255AVVMHBB vs MPC8255ACZUMHBB Comparação

Comparação detalhada lado a lado de MPC8255AVVMHBB por NXP Semiconductors e MPC8255ACZUMHBB por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC8255AVVMHBB MPC8255AVVMHBB - PowerQUICC II 266MHz 32-Bit MPU | NXP

MPC8255AVVMHBB - PowerQUICC II 266MHz 32-Bit MPU | NXP

MPC8255AVVMHBB Obsolete
NXP Semiconductors
MPC8255ACZUMHBB MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP

MPC8255ACZUMHBB - PowerQUICC II HIP4, 266MHz, 480-TBGA | NXP

MPC8255ACZUMHBB Obsolete

Comparação de especificações

Parâmetro MPC8255AVVMHBB MPC8255ACZUMHBB
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Obsolete Obsolete
Status do estoque In Stock In Stock
Preço unitário (USD) $78,80 $97,50
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) NXP Semiconductors
Series PowerQUICC II (MPC82xx) PowerQUICC II HIP4
Core Architecture PowerPC G2, 32-bit PowerPC G2
Core Frequency 266 MHz —
Bus Frequency 133 MHz (core-to-memory bus) —
Number of Cores 1 1
Cache (I/D) 16 Kbyte instruction / 16 Kbyte data —
Encapsulamento 480-TBGA (37.5 x 37.5 mm, 1.27 mm pitch) —
Core Supply Voltage 1.8 V 1.8 V
I/O Supply Voltage 3.3 V —
Integrated Ethernet MAC 2x 10/100 Mbit/s (MII/RMII) —
PCI Interface Yes (32-bit, 66 MHz capable) —
CPM Serial Controllers HDLC/SDLC, UART, I2C, SPI, SCC/SMC —
Temperatura de operação -40C to +105C (extended, per 'MH' suffix) [DATA_NEEDED: operating temperature range]
Process Technology 0.18 micrometre CMOS 0.25 micron (HiP4) silicon revision
Tipo de montagem Surface Mount (BGA) Surface Mount
Status RoHS Non-compliant (NO-PB suffix - lead-bearing) [DATA_NEEDED: RoHS compliance status]
Lifecycle No Longer Manufactured (NXP) —
Largura do barramento de dados — 64-Bit
Maximum Clock Speed — 266 MHz
Instruction Set — 32-Bit RISC
Core — MPC82xx
Package Type — T-BGA
Pin/Ball Count — 480
Package Size — 37.50 x 37.50 mm
Package Height — 1.55 mm
Ball Pitch — 1.27 mm
Integrated CPM — Yes (dual communications processor modules)
Ethernet MACs — Dual 10/100 MAC

Fichas técnicas e recursos

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