MPC8270CVRMIBA vs MPC8272CZQMIBA Vergleich
Detaillierter Direktvergleich von MPC8270CVRMIBA von NXP Semiconductors und MPC8272CZQMIBA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8270CVRMIBA - PowerQUICC II 266MHz MPU, 516-PBGA | NXP
MPC8270CVRMIBA ✗ AbgekündigtNXP Semiconductors
MPC8272CZQMIBA - PowerQUICC II 266MHz MPU, 516-PBGA | NXP
MPC8272CZQMIBA ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MPC8270CVRMIBA | MPC8272CZQMIBA |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $88,75 | $40,05 |
| Architecture | PowerPC G2_LE | — |
| Core | 1 Core, 32-Bit | — |
| Clock Speed | 266 MHz | — |
| Datenbusbreite | 64-Bit | 32-bit |
| Supply Voltage (Core) | 1.5 V | — |
| I/O Voltage | 3.3 V | — |
| Package Type | 516-PBGA (27 x 27 mm, 1 mm pitch) | — |
| Series | PowerQUICC II (MPC82xx) | — |
| Betriebstemperatur | -40 C to +105 C | — |
| Montageart | Surface Mount | Surface Mount |
| Integrated Peripherals | PCI (32-bit, v2.2), USB 2.0, HDLC, 3x 10/100 Ethernet MAC, I2C, UART | — |
| Process Node | 0.13 µm (HiP7) | — |
| Height (max) | 2.25 mm | — |
| MSL-Level | [DATA_NEEDED: MSL moisture sensitivity level] | [DATA_NEEDED: MSL rating] |
| RoHS-Status | Lead-Free / Compliant (per package marking) | [DATA_NEEDED: RoHS status] |
| Ethernet Speed | 10/100 Mbps (3 ports) | — |
| USB Version | USB 2.0 | — |
| Product Status | End of Life (EOL) - Discontinuance issued | — |
| Core Architecture | — | PowerPC G2_LE |
| Core Family | — | PowerQUICC II (MPC82xx) |
| Core Frequency | — | 266 MHz |
| Instruction Set | — | Power Architecture (PowerPC) |
| Operating Supply Voltage (I/O) | — | 3.3 V |
| Internal Core Voltage | — | 1.5 V to 1.8 V |
| Gehäuse | — | 516-PBGA (TEPBGA, 27x27 mm) |
| Betriebstemperaturbereich | — | -40 °C to +105 °C (industrial) |
| On-chip Connectivity | — | PCI 2.2, USB 1.1, UTOPIA-II, dual Fast Ethernet MACs (via CPM) |
| Communications Processor Module | — | Yes (CPM) |
| Hardware Security Engine (SEC) | — | Yes |
| External Bus | — | 60x bus + 32-bit local bus with SDRAM controller |
| Process Technology | — | 0.13 µm CMOS |
| Tray Standard Pack Quantity | — | [DATA_NEEDED: tray qty] |