MPC8270CVRMIBA vs MPC8272CZQMIBA Comparación
Comparación detallada lado a lado de MPC8270CVRMIBA por NXP Semiconductors y MPC8272CZQMIBA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8270CVRMIBA - PowerQUICC II 266MHz MPU, 516-PBGA | NXP
MPC8270CVRMIBA ✗ Fin de vidaNXP Semiconductors
MPC8272CZQMIBA - PowerQUICC II 266MHz MPU, 516-PBGA | NXP
MPC8272CZQMIBA ✗ Fin de vidaComparación de especificaciones
| Parámetro | MPC8270CVRMIBA | MPC8272CZQMIBA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Fin de vida | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $88,75 | $40,05 |
| Architecture | PowerPC G2_LE | — |
| Core | 1 Core, 32-Bit | — |
| Clock Speed | 266 MHz | — |
| Ancho del bus de datos | 64-Bit | 32-bit |
| Supply Voltage (Core) | 1.5 V | — |
| I/O Voltage | 3.3 V | — |
| Package Type | 516-PBGA (27 x 27 mm, 1 mm pitch) | — |
| Series | PowerQUICC II (MPC82xx) | — |
| Temperatura de funcionamiento | -40 C to +105 C | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Integrated Peripherals | PCI (32-bit, v2.2), USB 2.0, HDLC, 3x 10/100 Ethernet MAC, I2C, UART | — |
| Process Node | 0.13 µm (HiP7) | — |
| Height (max) | 2.25 mm | — |
| Nivel MSL | [DATA_NEEDED: MSL moisture sensitivity level] | [DATA_NEEDED: MSL rating] |
| Estado RoHS | Lead-Free / Compliant (per package marking) | [DATA_NEEDED: RoHS status] |
| Ethernet Speed | 10/100 Mbps (3 ports) | — |
| USB Version | USB 2.0 | — |
| Product Status | End of Life (EOL) - Discontinuance issued | — |
| Core Architecture | — | PowerPC G2_LE |
| Core Family | — | PowerQUICC II (MPC82xx) |
| Core Frequency | — | 266 MHz |
| Instruction Set | — | Power Architecture (PowerPC) |
| Operating Supply Voltage (I/O) | — | 3.3 V |
| Internal Core Voltage | — | 1.5 V to 1.8 V |
| Encapsulado | — | 516-PBGA (TEPBGA, 27x27 mm) |
| Rango de temperatura de funcionamiento | — | -40 °C to +105 °C (industrial) |
| On-chip Connectivity | — | PCI 2.2, USB 1.1, UTOPIA-II, dual Fast Ethernet MACs (via CPM) |
| Communications Processor Module | — | Yes (CPM) |
| Hardware Security Engine (SEC) | — | Yes |
| External Bus | — | 60x bus + 32-bit local bus with SDRAM controller |
| Process Technology | — | 0.13 µm CMOS |
| Tray Standard Pack Quantity | — | [DATA_NEEDED: tray qty] |