MPC8270CVRMIBA vs MPC8272CZQMIBA Comparaison
Comparaison détaillée côte à côte de MPC8270CVRMIBA par NXP Semiconductors et MPC8272CZQMIBA par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8270CVRMIBA - PowerQUICC II 266MHz MPU, 516-PBGA | NXP
MPC8270CVRMIBA ✗ Fin de vieNXP Semiconductors
MPC8272CZQMIBA - PowerQUICC II 266MHz MPU, 516-PBGA | NXP
MPC8272CZQMIBA ✗ Fin de vieComparaison des spécifications
| Paramètre | MPC8270CVRMIBA | MPC8272CZQMIBA |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $88,75 | $40,05 |
| Architecture | PowerPC G2_LE | — |
| Core | 1 Core, 32-Bit | — |
| Clock Speed | 266 MHz | — |
| Largeur du bus de données | 64-Bit | 32-bit |
| Supply Voltage (Core) | 1.5 V | — |
| I/O Voltage | 3.3 V | — |
| Package Type | 516-PBGA (27 x 27 mm, 1 mm pitch) | — |
| Series | PowerQUICC II (MPC82xx) | — |
| Température de fonctionnement | -40 C to +105 C | — |
| Type de montage | Surface Mount | Surface Mount |
| Integrated Peripherals | PCI (32-bit, v2.2), USB 2.0, HDLC, 3x 10/100 Ethernet MAC, I2C, UART | — |
| Process Node | 0.13 µm (HiP7) | — |
| Height (max) | 2.25 mm | — |
| Niveau MSL | [DATA_NEEDED: MSL moisture sensitivity level] | [DATA_NEEDED: MSL rating] |
| Statut RoHS | Lead-Free / Compliant (per package marking) | [DATA_NEEDED: RoHS status] |
| Ethernet Speed | 10/100 Mbps (3 ports) | — |
| USB Version | USB 2.0 | — |
| Product Status | End of Life (EOL) - Discontinuance issued | — |
| Core Architecture | — | PowerPC G2_LE |
| Core Family | — | PowerQUICC II (MPC82xx) |
| Core Frequency | — | 266 MHz |
| Instruction Set | — | Power Architecture (PowerPC) |
| Operating Supply Voltage (I/O) | — | 3.3 V |
| Internal Core Voltage | — | 1.5 V to 1.8 V |
| Boîtier | — | 516-PBGA (TEPBGA, 27x27 mm) |
| Plage de température de fonctionnement | — | -40 °C to +105 °C (industrial) |
| On-chip Connectivity | — | PCI 2.2, USB 1.1, UTOPIA-II, dual Fast Ethernet MACs (via CPM) |
| Communications Processor Module | — | Yes (CPM) |
| Hardware Security Engine (SEC) | — | Yes |
| External Bus | — | 60x bus + 32-bit local bus with SDRAM controller |
| Process Technology | — | 0.13 µm CMOS |
| Tray Standard Pack Quantity | — | [DATA_NEEDED: tray qty] |