MPC8270VRMIBA vs MPC8250AVRIHBC Vergleich
Detaillierter Direktvergleich von MPC8270VRMIBA von NXP Semiconductors und MPC8250AVRIHBC von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8270VRMIBA - PowerQUICC II 266MHz MPU | NXP | Networking
MPC8270VRMIBA ✗ AbgekündigtNXP Semiconductors
MPC8250AVRIHBC - PowerQUICC II MPC82xx 200MHz MPU BGA-516 | NXP
MPC8250AVRIHBC ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC8270VRMIBA | MPC8250AVRIHBC |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Letzte Kaufgelegenheit |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $95,75 | $21,40 |
| Core Architecture | PowerPC G2_LE, 32-bit | — |
| Core Frequency | 266 MHz | — |
| Series | PowerQUICC II (MPC82xx) | — |
| Number of Cores | 1 | — |
| On-Chip Cache | 32 KB | — |
| Core Voltage | 1.45 V to 1.6 V | — |
| I/O Voltage | 3.3 V | — |
| Process Technology | HiPerMOS7, 0.13 micron | — |
| Gehäuse | 516-PBGA (27 x 27 mm) | — |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | 0 C to 105 C | — |
| Integrated Peripherals | PCI, USB, HDLC, 10/100 Ethernet | — |
| Communications Module | CPM with multi-channel HDLC and ATM | — |
| PCI Interface | PCI 2.2 compliant | — |
| USB Interface | USB 1.1 (function or host with external PHY) | — |
| Ethernet MACs | Up to 3 x 10/100 Ethernet | — |
| MSL-Level | [DATA_NEEDED: MSL level] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant (Lead-Free PBGA) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Architecture | — | PowerPC G2 (PowerQUICC II) |
| Core | — | PowerPC 32-bit, 1 core |
| Datenbusbreite | — | 64-bit |
| Instruction Set | — | RISC |
| Core Clock Speed | — | 200 MHz |
| Supply Voltage (Core) | — | 1.8 V |
| Supply Voltage (I/O) | — | 3.3 V |
| Package Type | — | BGA (Plastic, Lead-Free) |
| Package Code | — | 516-PBGA |
| Package Dimensions | — | 27 x 27 mm, 2.25 mm height |
| Ball Pitch | — | 1.0 mm |
| Pin-Anzahl | — | 516 |
| Betriebstemperaturbereich | — | -40C to +105C (Industrial) |
| Family | — | MPC82xx (PowerQUICC II) |
| Communications Peripherals | — | FCC, MCC, SCC, SMC controllers (CPM) |