MPC8270VRMIBA - PowerQUICC II 266MHz MPU | NXP | Networking
Teilenummer: MPC8270VRMIBA ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $142.5 | $142,50 |
| 10 | $128.25 | $1.282,50 |
| 100 | $115.4 | $11.540,00 |
| 500 | $103.9 | $51.950,00 |
| 1.000 | $95.75 | $95.750,00 |
MPC8270VRMIBA Übersicht
A communications processor is a specialized microprocessor that combines a general-purpose CPU core with hardware accelerators for telecom and networking protocols. The PowerQUICC II architecture belongs to the broader family of embedded microprocessors (MPU -> microprocessor -> microcontroller unit -> semiconductor device), optimized for deterministic real-time packet handling rather than pure compute.
Key features include 32 KB of on-chip cache memory, a core voltage range of 1.45 V to 1.6 V, I/O at 3.3 V, HiPerMOS7 0.13-micron silicon process technology, and an operating temperature range of 0 C to 105 C. The integrated communications engine offloads HDLC, ATM, and Ethernet framing from the host CPU, enabling line-rate throughput without software intervention.
The MPC8270VRMIBA uses a Harvard-style bus architecture with separate instruction and data paths feeding the CPM (Communications Processor Module), allowing simultaneous CPU compute and DMA-driven peripheral servicing. The 516-ball PBGA provides ample signal headroom for the 32-bit address/data bus, three Fast Ethernet MACs, USB 1.1, and a PCI 2.2 interface.
Typical applications include DSLAM line cards, wireless base station control plane, router/switch control, industrial control gateways, and T1/E1 aggregation equipment. The wide integration reduces BOM and board area compared with discrete CPU-plus-assp designs.
When designing with this part, ensure proper power sequencing of 1.5 V core and 3.3 V I/O rails and provide adequate decoupling to the PBGA's inner-row balls. The part has been flagged End of Life on NXP's product page, so design teams should validate longevity supply before committing to new programs.
This page synthesizes distributor pricing, same-family and cross-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in-Alternativen für MPC8270VRMIBA – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC8270VRMIBA (gleiche Bauform und Footprint) – abweichend in Process Technology, Package, Core Architecture, Operating Temperature, PCI Interface.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC8270CVRMIBA
✅ Drop-In✓ Auf Lager
$88.75 / Stück
Datenblatt ansehen →MPC8270CZQMIBA
✅ Drop-In✓ Auf Lager
$52.85 / Stück
Datenblatt ansehen →MPC8270VVMIBA
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MPC8250AVRIHBC
✅ Drop-In✓ Auf Lager
$21.4 / Stück
Datenblatt ansehen →MPC8250ACZQIHBC
✅ Drop-In✓ Auf Lager
$99.5 / Stück
Datenblatt ansehen →MPC8270VRMIBA Grenzwerte & elektrische Eigenschaften
| Core Architecture | PowerPC G2_LE, 32-bit |
| Core Frequency | 266 MHz |
| Series | PowerQUICC II (MPC82xx) |
| Number of Cores | 1 |
| On-Chip Cache | 32 KB |
| Core Voltage | 1.45 V to 1.6 V |
| I/O Voltage | 3.3 V |
| Process Technology | HiPerMOS7, 0.13 micron |
| Gehäuse | 516-PBGA (27 x 27 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | 0 C to 105 C |
| Integrated Peripherals | PCI, USB, HDLC, 10/100 Ethernet |
| Communications Module | CPM with multi-channel HDLC and ATM |
| PCI Interface | PCI 2.2 compliant |
| USB Interface | USB 1.1 (function or host with external PHY) |
| Ethernet MACs | Up to 3 x 10/100 Ethernet |
MPC8270VRMIBA 516-pbga (27 x 27 mm) Pinbelegungsleitfaden
Pinbelegung für MPC8270VRMIBA (516-pbga (27 x 27 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC8270VRMIBA.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC8270VRMIBA ist geeignet für 6 Anwendungs: DSLAM Line Card Aggregation, Wireless Base Station Control Plane, Enterprise Router/Switch Controller, Industrial Control Gateway, T1/E1 Aggregation Multiplexer, Network Appliance Storage Controller.
DSLAM Line Card Aggregation
The MPC8270VRMIBA is well suited for DSLAM line card aggregation because its CPM (Communications Processor Module) provides up to 128 HDLC channels and multi-channel ATM SAR in hardware. The 266 MHz PowerPC G2_LE core runs control-plane and management tasks while the CPM offloads per-channel DMA, sustaining DS3/E3 line rates. The 516-PBGA package integrates PCI 2.2 to the backplane ASIC plus three 10/100 Ethernet MACs for uplink trunking, eliminating external bridge chips.
Empfohlen
Wireless Base Station Control Plane
In wireless base station control, the MPC8270VRMIBA manages Layer 2 protocols with hardware-accelerated HDLC/ATM while running RTOS and OAM tasks on the G2_LE core. The CPM offloads framer and scheduler work that an MCU cannot sustain at 155 MHz ATM rates, freeing the 266 MHz core for call processing and timing. Its 3.3 V I/O and 1.5 V core rails integrate cleanly with standard telecom power architectures (e.g., -48 V isolated supplies), and the PBGA thermal envelope supports 0 to 105 C operation in controlled indoor cabinets.
Empfohlen
Enterprise Router/Switch Controller
For branch-office routers, the MPC8270VRMIBA provides routing control plus PCI-to-PCI bridging using its 32-bit PowerPC core, three Fast Ethernet MACs, and PCI 2.2 host bridge. The 266 MHz frequency sustains Cisco-style IOS-XE or Linux-based routing stacks with routing-table lookup offloaded to TCAM ASICs over the PCI bus. The integrated USB 1.1 host enables local diagnostics and configuration and the CPM HDLC handles legacy serial WAN uplinks.
Empfohlen
Industrial Control Gateway
In factory automation gateways, the MPC8270VRMIBA bridges industrial fieldbuses to Ethernet using its trio of 10/100 MACs and HDLC channels for serial protocols (Modbus, Profibus over RS-485). The 516-PBGA industrial temperature variants support factory ambient, and the deterministic CPM latency handles real-time control messaging. Software stacks run on a hosted RTOS with Ethernet/IP and Profinet compatibility.
Empfohlen
T1/E1 Aggregation Multiplexer
The MPC8270VRMIBA shines in T1/E1 multiplexers because its CPM provides per-channel HDLC with hardware AAL1/AAL2 segmentation, freeing the host CPU from bit-banging 24/32-channel TDM streams. The PowerPC G2_LE at 266 MHz runs management plane OAM and SNMP stacks while the CPM handles 256+ HDLC channels. Its 3.3 V I/O connects directly to standard line-interface units and T1/E1 framer ASICs over the 32-bit local bus.
Empfohlen
Network Appliance Storage Controller
For small NAS appliances and iSCSI targets, the MPC8270VRMIBA runs the storage stack over its integrated PCI bus and three Ethernet MACs, while the CPM handles TCP/IP checksum offload and HDLC for replication links. The 32 KB on-chip cache sustains sequential read/write streams when paired with DDR-like SDRAM via external bridge, and the 516-PBGA package simplifies multi-layer PCB layout for fanless enclosures.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC8270VRMIBA – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC8270CVRMIBA | MPC8270CZQMIBA | MPC8270VVMIBA | MPC8250AVRIHBC | MPC8250ACZQIHBC |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 516-PBGA (27x27) | 516-PBGA (27x27) | 516-PBGA (27x27) | 516-PBGA (27x27) | PBGA (different size) | PBGA (different size) |
| Core | PowerPC G2_LE 266 MHz | PowerPC G2_LE 266 MHz | PowerPC G2_LE 266 MHz | PowerPC G2_LE 266 MHz | PowerPC G2_LE 200 MHz | PowerPC G2_LE 200 MHz |
| Core Voltage | 1.45 V to 1.6 V | 1.45 V to 1.6 V | 1.45 V to 1.6 V | 1.45 V to 1.6 V | 1.45 V to 1.6 V | 1.45 V to 1.6 V |
| Integrated Peripherals | PCI, USB, HDLC, 3x 10/100 MAC | Same | Same | Same | Subset | Subset |
| Operating Temperature | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C | -40 C to 105 C (extended) | 0 C to 105 C | 0 C to 105 C |
| Lead-Free Designator | No (leaded R suffix) | No | Yes (Z designator) | No (extended temp) | No | Yes (Z designator) |
| Lifecycle Status | End of Life | End of Life | End of Life | End of Life | End of Life | End of Life |
Wichtigste Unterscheidungsmerkmale
- True 266 MHz G2_LE core with hardware CPM offload (vs. MPC8250AVRIHBC)
- 516-PBGA (27 x 27) maximum I/O density for this family (vs. MPC8270CVRMIBA)
- Drop-in compatible with industrial temperature MPC8270VVMIBA (vs. MPC8270VVMIBA)
Designhinweise
The MPC8270VRMIBA requires separate 1.5 V core (1.45 V to 1.6 V range) and 3.3 V I/O rails with sequencing: power the core before I/O to avoid latch-up. Place low-ESR ceramic decoupling (e.g., 22 uF bulk plus 0.1 uF high-frequency bypass) within 5 mm of every supply pin pair. According to the NXP hardware design guide for PowerQUICC II, a soft-start ramp of 1 ms prevents inrush on the host supply.
The 516-PBGA (27x27) has high thermal mass; follow JEDEC JESD51 test methodology and use the package's exposed thermal balls for a thermal via array into inner planes. Estimated: at ambient 70 C and 1.0 W dissipation (typical for 266 MHz active), junction-to-ambient theta_JA around 18 C/W results in roughly 18 C rise; verify against the silicon-specific thermal model in the datasheet before deployment in sealed enclosures.
Use a minimum 6-layer stack-up with continuous reference planes for the 32-bit local bus and DDR SDRAM connections. Place micro-vias-in-pad (8 mil laser vias) under the inner-row signal balls to break out the dense BGA pitch without dog-bone fanout. Per IPC-7093 BGA guidelines, return all high-speed signals within 2 layers of their reference plane to avoid crosstalk on the 100 MHz+ bus.
Do not assume the RMIBA suffix indicates lead-free - that 'C' (or 'Z') prefix is the lead-free/RoHS marker in the MPC8270 family. Mixing leaded and lead-free BGA balls on a single board violates JEDEC J-STD-020 reflow profiles. Always match the JTAG BSDL against the silicon revision before boundary-scan test during production bring-up.
Compliance-Informationen
Compliance statuses not in verified distributor data; the VRMIBA suffix denotes a leaded (non-RoHS) variant historically. For RoHS-only programs use the MPC8270CVRMIBA (no Z) or MPC8270CZQMIBA (lead-free Z designator) sibling parts.
