MPC8271CZQMIBA vs MPC8271ZQMIBA Vergleich

Detaillierter Direktvergleich von MPC8271CZQMIBA von NXP Semiconductors und MPC8271ZQMIBA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC8271CZQMIBA MPC8271CZQMIBA - PowerQUICC II MPC82xx 266MHz 32-Bit MPU | NXP

MPC8271CZQMIBA - PowerQUICC II MPC82xx 266MHz 32-Bit MPU | NXP

MPC8271CZQMIBA Obsolete
NXP Semiconductors
MPC8271ZQMIBA MPC8271ZQMIBA - PowerQUICC II MPU, 266MHz, 516-PBGA | NXP

MPC8271ZQMIBA - PowerQUICC II MPU, 266MHz, 516-PBGA | NXP

MPC8271ZQMIBA ✓ Aktiv

Spezifikationsvergleich

Parameter MPC8271CZQMIBA MPC8271ZQMIBA
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Obsolete Aktiv
Lagerstatus In Stock In Stock
Stückpreis (USD) $56,40 $12,85
Core Architecture PowerPC G2_LE (MPC82xx family) 32-bit Power Architecture (PowerPC)
Number of Cores 1 —
Datenbusbreite 32-Bit —
Maximale Taktfrequenz 266 MHz 266 MHz
Betriebsversorgungsspannung [DATA_NEEDED: Vdd core/I/O nominal] —
Betriebstemperaturbereich -40C to +105C (industrial extended) —
Instruction Cache 16 Kbyte —
Data Cache 16 Kbyte —
Gehäuse / Bauform 516-PBGA (27x27 mm) —
Montageart Surface Mount —
PCI Interface 32-bit PCI 2.2 compliant 32-bit PCI 2.3
Local Bus 32-bit (up to 66 MHz) —
Communications Processor Module Yes (CPM with FCC, MCC, SCC, SMC) —
Serial Interfaces Fast Ethernet MAC, ATM, HDLC, TDM/UART —
Memory Controller SDRAM, ROM/Flash, glueless up to 16 chip selects —
RoHS-Status [DATA_NEEDED] Non-Compliant (Pb-bearing PBGA)
MSL-Level [DATA_NEEDED] [DATA_NEEDED: MSL rating]
Manufacturer — NXP Semiconductors (formerly Freescale)
Processor Type — MPC82xx PowerQUICC II, PowerPC G2_LE
Core Count — 1 (plus CPM RISC engine)
Core Voltage — 1.5 V
I/O Voltage — 3.3 V
L1 Instruction Cache — 16 KB
L1 Data Cache — 16 KB
External Memory Bus — 32-bit 60x bus
Gehäuse — 516-BBGA (TEBGA2), 27x27 mm
Process Technology — 0.13 um HiP7 CMOS
Ethernet MACs — 2 x 10/100 Mbit/s
Serial Communication Controllers — 2 (Fast / H.110-style SCC)
USB / I2C / SPI — USB 1.1, I2C, SPI
Lead Free Status — Contains Lead (SnPb ball variant)
Betriebstemperatur — [DATA_NEEDED: Operating Temperature grade]

Datenblätter & Ressourcen

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