MPC8271CZQMIBA vs MPC8271ZQMIBA Comparación
Comparación detallada lado a lado de MPC8271CZQMIBA por NXP Semiconductors y MPC8271ZQMIBA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8271CZQMIBA - PowerQUICC II MPC82xx 266MHz 32-Bit MPU | NXP
MPC8271CZQMIBA ObsoleteComparación de especificaciones
| Parámetro | MPC8271CZQMIBA | MPC8271ZQMIBA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $56,40 | $12,85 |
| Core Architecture | PowerPC G2_LE (MPC82xx family) | 32-bit Power Architecture (PowerPC) |
| Number of Cores | 1 | — |
| Ancho del bus de datos | 32-Bit | — |
| Frecuencia de reloj máxima | 266 MHz | 266 MHz |
| Tensión de alimentación de funcionamiento | [DATA_NEEDED: Vdd core/I/O nominal] | — |
| Rango de temperatura de funcionamiento | -40C to +105C (industrial extended) | — |
| Instruction Cache | 16 Kbyte | — |
| Data Cache | 16 Kbyte | — |
| Encapsulado / Carcasa | 516-PBGA (27x27 mm) | — |
| Tipo de montaje | Surface Mount | — |
| PCI Interface | 32-bit PCI 2.2 compliant | 32-bit PCI 2.3 |
| Local Bus | 32-bit (up to 66 MHz) | — |
| Communications Processor Module | Yes (CPM with FCC, MCC, SCC, SMC) | — |
| Serial Interfaces | Fast Ethernet MAC, ATM, HDLC, TDM/UART | — |
| Memory Controller | SDRAM, ROM/Flash, glueless up to 16 chip selects | — |
| Estado RoHS | [DATA_NEEDED] | Non-Compliant (Pb-bearing PBGA) |
| Nivel MSL | [DATA_NEEDED] | [DATA_NEEDED: MSL rating] |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Processor Type | — | MPC82xx PowerQUICC II, PowerPC G2_LE |
| Core Count | — | 1 (plus CPM RISC engine) |
| Core Voltage | — | 1.5 V |
| I/O Voltage | — | 3.3 V |
| L1 Instruction Cache | — | 16 KB |
| L1 Data Cache | — | 16 KB |
| External Memory Bus | — | 32-bit 60x bus |
| Encapsulado | — | 516-BBGA (TEBGA2), 27x27 mm |
| Process Technology | — | 0.13 um HiP7 CMOS |
| Ethernet MACs | — | 2 x 10/100 Mbit/s |
| Serial Communication Controllers | — | 2 (Fast / H.110-style SCC) |
| USB / I2C / SPI | — | USB 1.1, I2C, SPI |
| Lead Free Status | — | Contains Lead (SnPb ball variant) |
| Temperatura de funcionamiento | — | [DATA_NEEDED: Operating Temperature grade] |