MPC8271ZQMIBA vs MPC8271ZQMIBA557 Vergleich

Detaillierter Direktvergleich von MPC8271ZQMIBA von NXP Semiconductors und MPC8271ZQMIBA557 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC8271ZQMIBA MPC8271ZQMIBA - PowerQUICC II MPU, 266MHz, 516-PBGA | NXP

MPC8271ZQMIBA - PowerQUICC II MPU, 266MHz, 516-PBGA | NXP

MPC8271ZQMIBA ✓ Aktiv
NXP Semiconductors
MPC8271ZQMIBA557 MPC8271ZQMIBA557 - PowerQUICC II 32-Bit MPU, 266MHz | NXP | 516-PBGA

MPC8271ZQMIBA557 - PowerQUICC II 32-Bit MPU, 266MHz | NXP | 516-PBGA

MPC8271ZQMIBA557 Obsolete

Spezifikationsvergleich

Parameter MPC8271ZQMIBA MPC8271ZQMIBA557
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv Obsolete
Manufacturer NXP Semiconductors (formerly Freescale) NXP Semiconductors (formerly Freescale Semiconductor)
Processor Type MPC82xx PowerQUICC II, PowerPC G2_LE —
Core Architecture 32-bit Power Architecture (PowerPC) PowerPC G2_LE
Core Count 1 (plus CPM RISC engine) —
Maximale Taktfrequenz 266 MHz —
Core Voltage 1.5 V —
I/O Voltage 3.3 V 3.3 V
L1 Instruction Cache 16 KB —
L1 Data Cache 16 KB —
External Memory Bus 32-bit 60x bus —
Gehäuse 516-BBGA (TEBGA2), 27x27 mm —
Process Technology 0.13 um HiP7 CMOS 0.13 um HiP7 CMOS
Ethernet MACs 2 x 10/100 Mbit/s —
Serial Communication Controllers 2 (Fast / H.110-style SCC) —
PCI Interface 32-bit PCI 2.3 —
USB / I2C / SPI USB 1.1, I2C, SPI —
Lead Free Status Contains Lead (SnPb ball variant) Contains Lead
RoHS-Status Non-Compliant (Pb-bearing PBGA) [DATA_NEEDED: RoHS status of MPC8271ZQMIBA557]
Betriebstemperatur [DATA_NEEDED: Operating Temperature grade] -40C to +85C (industrial)
MSL-Level [DATA_NEEDED: MSL rating] —
Part Family — PowerQUICC II (MPC82xx)
Datenbusbreite — 32-bit
Maximum Core Clock — 266 MHz
Core Voltage (Vdd) — 1.5 V
Gehäuse / Bauform — 516-BBGA (27 x 27 mm)
Packaging — Tray
On-chip Peripherals — CPM (Communications Processor Module), 10/100 Ethernet MAC x2, FCC x3, PCI, UTOPIA, I2C, SPI, UART
External Memory Support — SDR/DDR SDRAM via 60x bus (up to 1 GB)
JTAG / Debug — JTAG (IEEE 1149.1)

Datenblätter & Ressourcen

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