MPC8271ZQMIBA vs MPC8271ZQMIBA557 Comparaison
Comparaison détaillée côte à côte de MPC8271ZQMIBA par NXP Semiconductors et MPC8271ZQMIBA557 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC8271ZQMIBA557 - PowerQUICC II 32-Bit MPU, 266MHz | NXP | 516-PBGA
MPC8271ZQMIBA557 ObsoleteComparaison des spécifications
| Paramètre | MPC8271ZQMIBA | MPC8271ZQMIBA557 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Obsolete |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale Semiconductor) |
| Processor Type | MPC82xx PowerQUICC II, PowerPC G2_LE | — |
| Core Architecture | 32-bit Power Architecture (PowerPC) | PowerPC G2_LE |
| Core Count | 1 (plus CPM RISC engine) | — |
| Fréquence d'horloge maximale | 266 MHz | — |
| Core Voltage | 1.5 V | — |
| I/O Voltage | 3.3 V | 3.3 V |
| L1 Instruction Cache | 16 KB | — |
| L1 Data Cache | 16 KB | — |
| External Memory Bus | 32-bit 60x bus | — |
| Boîtier | 516-BBGA (TEBGA2), 27x27 mm | — |
| Process Technology | 0.13 um HiP7 CMOS | 0.13 um HiP7 CMOS |
| Ethernet MACs | 2 x 10/100 Mbit/s | — |
| Serial Communication Controllers | 2 (Fast / H.110-style SCC) | — |
| PCI Interface | 32-bit PCI 2.3 | — |
| USB / I2C / SPI | USB 1.1, I2C, SPI | — |
| Lead Free Status | Contains Lead (SnPb ball variant) | Contains Lead |
| Statut RoHS | Non-Compliant (Pb-bearing PBGA) | [DATA_NEEDED: RoHS status of MPC8271ZQMIBA557] |
| Température de fonctionnement | [DATA_NEEDED: Operating Temperature grade] | -40C to +85C (industrial) |
| Niveau MSL | [DATA_NEEDED: MSL rating] | — |
| Part Family | — | PowerQUICC II (MPC82xx) |
| Largeur du bus de données | — | 32-bit |
| Maximum Core Clock | — | 266 MHz |
| Core Voltage (Vdd) | — | 1.5 V |
| Boîtier / Format | — | 516-BBGA (27 x 27 mm) |
| Packaging | — | Tray |
| On-chip Peripherals | — | CPM (Communications Processor Module), 10/100 Ethernet MAC x2, FCC x3, PCI, UTOPIA, I2C, SPI, UART |
| External Memory Support | — | SDR/DDR SDRAM via 60x bus (up to 1 GB) |
| JTAG / Debug | — | JTAG (IEEE 1149.1) |