MPC8360EVVAGDGA vs MPC8360ZUAJDGA Vergleich
Detaillierter Direktvergleich von MPC8360EVVAGDGA von NXP Semiconductors und MPC8360ZUAJDGA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MPC8360ZUAJDGA - PowerQUICC II Pro MPU, 533MHz e300, 740-TBGA | NXP
MPC8360ZUAJDGA ⚠ Letzte BestellmöglichkeitSpezifikationsvergleich
| Parameter | MPC8360EVVAGDGA | MPC8360ZUAJDGA |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Letzte Kaufgelegenheit |
| Core | Power Architecture e300 (enhanced MPC603e) | — |
| Number of Cores | 1 | 1 |
| Datenbusbreite | 32-bit | — |
| Maximale Taktfrequenz | 400 MHz | — |
| Operating Core Voltage | 1.2 V | — |
| I/O Voltage | 3.3 V | — |
| Memory Controller | DDR1/DDR2 SDRAM with ECC | DDR1 / DDR2 with ECC |
| PCI Interface | PCI 2.2 (32-bit, 66 MHz) / PCI-X | PCI 2.2 (32-bit, 66 MHz) |
| Ethernet | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) | 10/100/1 GbE (GMII/RGMII) |
| Security Engine | SEC (IPSEC/SSL/SRNG) | — |
| USB | USB 2.0 | — |
| TDM / H.110 | Yes | — |
| ATM Support | Yes (ATM SAR, AAL) | — |
| Betriebstemperaturbereich | 0C to +105C (TA) | — |
| Gehäuse | 740-TBGA (37.5 x 37.5 mm) | 740-TBGA (37.5 x 37.5 mm) |
| RoHS-Status | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes (per distributor listing, Mouser 'NO-PB' coding) | — |
| Series | PowerQUICC II Pro (MPC8360E family) | PowerQUICC II Pro, MPC83xx |
| Revision | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced | — |
| Montageart | Surface Mount (TBGA ball grid) | Surface Mount (T-BGA) |
| Packaging | Tray | — |
| ECCN | 5A002.a.1 | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Core Processor | — | PowerPC e300 |
| Core Architecture | — | Power Architecture, 32-bit |
| Core Clock Speed | — | 533 MHz |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Process Technology | — | 0.13 micron CMOS |
| USB Interface | — | USB 2.0 (host/device) |
| Serial Interfaces | — | TDM, ATM, HDLC (QUICC Engine) |
| Supply Voltage Rails | — | 1.8 V / 2.5 V / 3.3 V |
| Betriebstemperatur | — | 0 C to +105 C |
| Encryption | — | Non-encryption (no SEC) |
| MSL-Level | — | [DATA_NEEDED: MSL level] |