MPC8360EVVAGDGA vs MPC8360ZUAJDGA Comparación
Comparación detallada lado a lado de MPC8360EVVAGDGA por NXP Semiconductors y MPC8360ZUAJDGA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8360EVVAGDGA - PowerQUICC II Pro SoC, 400MHz, 740-TBGA | NXP
MPC8360EVVAGDGA ⚠ Última compraNXP Semiconductors
MPC8360ZUAJDGA - PowerQUICC II Pro MPU, 533MHz e300, 740-TBGA | NXP
MPC8360ZUAJDGA ⚠ Última compraComparación de especificaciones
| Parámetro | MPC8360EVVAGDGA | MPC8360ZUAJDGA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Última compra |
| Core | Power Architecture e300 (enhanced MPC603e) | — |
| Number of Cores | 1 | 1 |
| Ancho del bus de datos | 32-bit | — |
| Frecuencia de reloj máxima | 400 MHz | — |
| Operating Core Voltage | 1.2 V | — |
| I/O Voltage | 3.3 V | — |
| Memory Controller | DDR1/DDR2 SDRAM with ECC | DDR1 / DDR2 with ECC |
| PCI Interface | PCI 2.2 (32-bit, 66 MHz) / PCI-X | PCI 2.2 (32-bit, 66 MHz) |
| Ethernet | 1x 10/100/1000 Mb/s MAC (GMII/TBI/RGMII) | 10/100/1 GbE (GMII/RGMII) |
| Security Engine | SEC (IPSEC/SSL/SRNG) | — |
| USB | USB 2.0 | — |
| TDM / H.110 | Yes | — |
| ATM Support | Yes (ATM SAR, AAL) | — |
| Rango de temperatura de funcionamiento | 0C to +105C (TA) | — |
| Encapsulado | 740-TBGA (37.5 x 37.5 mm) | 740-TBGA (37.5 x 37.5 mm) |
| Estado RoHS | Lead Free / Compliant [DATA_NEEDED: specific RoHS certification status from manufacturer page] | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes (per distributor listing, Mouser 'NO-PB' coding) | — |
| Series | PowerQUICC II Pro (MPC8360E family) | PowerQUICC II Pro, MPC83xx |
| Revision | Silicon Rev 1 (per distributor datasheet summary); Rev 2.x hardware specification referenced | — |
| Tipo de montaje | Surface Mount (TBGA ball grid) | Surface Mount (T-BGA) |
| Packaging | Tray | — |
| ECCN | 5A002.a.1 | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale) |
| Core Processor | — | PowerPC e300 |
| Core Architecture | — | Power Architecture, 32-bit |
| Core Clock Speed | — | 533 MHz |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Process Technology | — | 0.13 micron CMOS |
| USB Interface | — | USB 2.0 (host/device) |
| Serial Interfaces | — | TDM, ATM, HDLC (QUICC Engine) |
| Supply Voltage Rails | — | 1.8 V / 2.5 V / 3.3 V |
| Temperatura de funcionamiento | — | 0 C to +105 C |
| Encryption | — | Non-encryption (no SEC) |
| Nivel MSL | — | [DATA_NEEDED: MSL level] |