MPC852TVR50A-FR vs MPC859TVR133A Vergleich

Detaillierter Direktvergleich von MPC852TVR50A-FR von NXP Semiconductors und MPC859TVR133A von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC852TVR50A-FR MPC852TVR50A-FR - 50MHz PowerQUICC MPU | NXP | Networking

MPC852TVR50A-FR - 50MHz PowerQUICC MPU | NXP | Networking

MPC852TVR50A-FR ⚠ Letzte Bestellmöglichkeit
NXP Semiconductors
MPC859TVR133A MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA

MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA

MPC859TVR133A ✗ Abgekündigt

Spezifikationsvergleich

Parameter MPC852TVR50A-FR MPC859TVR133A
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Letzte Kaufgelegenheit Ende des Lebenszyklus
Lagerstatus In Stock In Stock
Stückpreis (USD) $22,80 $54,10
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) NXP Semiconductors (formerly Freescale Semiconductor)
Processor Series PowerQUICC MPC852T —
Core Architecture Power Architecture (MPC8xx) 32-bit Power Architecture (32-bit)
Core Frequency 50 MHz —
Number of Cores 1 (host) + 2 CPM RISC engines 1
Datenbusbreite 32-bit 32 bit
Integrated Ethernet MAC 10/100 Mbps (Fast Ethernet) —
Communication Engines 2x RISC CPM (HDLC/SDLC, UART, SPI, I2C) —
Memory Controller SDRAM/SRAM/Flash (external bus, 32-bit) —
Betriebstemperatur 0C to +95C 0C to +95C (commercial/industrial grade)
Gehäuse 256-PBGA (23x23 mm, 1.0 mm pitch) —
Montageart Surface Mount (BGA) Surface Mount (BGA)
Supply Voltage (Core) 3.3 V —
Compliance RoHS (per -FR suffix packaging code, status [DATA_NEEDED: detailed RoHS test report]) —
Part Suffix -FR (NXP tray / lead-free packaging variant) —
Mouser Product Category Microprocessors - MPU Ethernet 50 MHz —
Series — PowerQUICC, MPC8xx family
Core / Series Name — MPC8xx
Maximale Taktfrequenz — 133 MHz
Package Type — 357-PBGA (Plastic Ball Grid Array)
Package Dimensions — 25 x 25 mm
On-Chip Cache — 8 KB instruction / 8 KB data (per datasheet family)
Communication Channels — 4 SCC, 2 SMC, 1 FCC (typical MPC859T configuration)
Peripheral Interfaces — SPI, I2C, PCMCIA, IDMA, UART
RoHS-Status — See manufacturer PCN (legacy status)
Lifecycle — End-of-Life per NXP product page

Datenblätter & Ressourcen

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