MPC8541EPXALF vs MPC8541ECPXALF Vergleich
Detaillierter Direktvergleich von MPC8541EPXALF von NXP Semiconductors und MPC8541ECPXALF von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC8541EPXALF - PowerQUICC III e500 MPU 667MHz 783-FCPBGA | NXP
MPC8541EPXALF ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MPC8541ECPXALF - PowerQUICC III e500 MPU 667MHz FCBGA-783 | NXP
MPC8541ECPXALF ✓ AktivSpezifikationsvergleich
| Parameter | MPC8541EPXALF | MPC8541ECPXALF |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | PowerQUICC III (MPC85xx) | — |
| Core Architecture | PowerPC e500, 32-bit | PowerPC e500 (Book-E enhanced) |
| Datenbusbreite | 64-bit | 64-bit |
| Core Frequency | 667 MHz | — |
| Versorgungsspannung | 1.2 V (core); 2.5 V / 3.3 V (I/O) | — |
| Betriebstemperatur | 0C to +105C | -40C to +105C |
| Package Type | FCBGA-783 (29 x 29 mm, 1 mm pitch, Flip-Chip) | — |
| Pin-Anzahl | 783 | — |
| L1 Cache | 32 KB instruction + 32 KB data | — |
| L2 Cache | 256 KB unified with ECC | 256 KB |
| Ethernet Controllers | 3 x eTSEC (10/100/1000 Mbps) | 4x eTSEC (Gigabit) + 2x 10/100 Ethernet (FCC) |
| Memory Controller | 64-bit DDR/DDR2 with ECC | DDR/DDR2 with ECC |
| Security Engine | SEC 2.0 (DES/3DES/AES/SHA) | SEC 3.0 (DES, 3DES, AES, SHA, MD5, RSA, Kasumi) |
| Montageart | Surface Mount (Flip-Chip BGA) | Surface Mount |
| RoHS-Status | Compliant | — |
| Lead Free | Yes | — |
| Maximum Core Frequency | — | 667 MHz |
| Instruction Set | — | 32-bit Power Architecture |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Core Supply Voltage | — | 1.2 V (typical) |
| I/O Supply Voltage | — | 3.3 V |
| PCI Express | — | PCIe x1 / x2 |
| Gehäuse | — | 783-FCBGA (29 x 29 mm, 1 mm pitch, flip chip) |
| RoHS Compliance | — | Compliant (lead-free) |