MPC8541EPXALF vs MPC8541ECPXALF Comparación
Comparación detallada lado a lado de MPC8541EPXALF por NXP Semiconductors y MPC8541ECPXALF por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
NXP Semiconductors
MPC8541EPXALF - PowerQUICC III e500 MPU 667MHz 783-FCPBGA | NXP
MPC8541EPXALF ⚠ Última compraNXP Semiconductors
MPC8541ECPXALF - PowerQUICC III e500 MPU 667MHz FCBGA-783 | NXP
MPC8541ECPXALF ✓ ActivoComparación de especificaciones
| Parámetro | MPC8541EPXALF | MPC8541ECPXALF |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Última compra | Activo |
| Manufacturer | NXP Semiconductors (formerly Freescale) | — |
| Series | PowerQUICC III (MPC85xx) | — |
| Core Architecture | PowerPC e500, 32-bit | PowerPC e500 (Book-E enhanced) |
| Ancho del bus de datos | 64-bit | 64-bit |
| Core Frequency | 667 MHz | — |
| Tensión de alimentación | 1.2 V (core); 2.5 V / 3.3 V (I/O) | — |
| Temperatura de funcionamiento | 0C to +105C | -40C to +105C |
| Package Type | FCBGA-783 (29 x 29 mm, 1 mm pitch, Flip-Chip) | — |
| Recuento de pines | 783 | — |
| L1 Cache | 32 KB instruction + 32 KB data | — |
| L2 Cache | 256 KB unified with ECC | 256 KB |
| Ethernet Controllers | 3 x eTSEC (10/100/1000 Mbps) | 4x eTSEC (Gigabit) + 2x 10/100 Ethernet (FCC) |
| Memory Controller | 64-bit DDR/DDR2 with ECC | DDR/DDR2 with ECC |
| Security Engine | SEC 2.0 (DES/3DES/AES/SHA) | SEC 3.0 (DES, 3DES, AES, SHA, MD5, RSA, Kasumi) |
| Tipo de montaje | Surface Mount (Flip-Chip BGA) | Surface Mount |
| Estado RoHS | Compliant | — |
| Lead Free | Yes | — |
| Maximum Core Frequency | — | 667 MHz |
| Instruction Set | — | 32-bit Power Architecture |
| L1 Instruction Cache | — | 32 KB |
| L1 Data Cache | — | 32 KB |
| Core Supply Voltage | — | 1.2 V (typical) |
| I/O Supply Voltage | — | 3.3 V |
| PCI Express | — | PCIe x1 / x2 |
| Encapsulado | — | 783-FCBGA (29 x 29 mm, 1 mm pitch, flip chip) |
| RoHS Compliance | — | Compliant (lead-free) |