MPC859DSLVR66A vs MPC859DSLZP50A Vergleich

Detaillierter Direktvergleich von MPC859DSLVR66A von NXP Semiconductors und MPC859DSLZP50A von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC859DSLVR66A MPC859DSLVR66A - PowerQUICC MPU 66MHz 357-PBGA | NXP Semiconductors

MPC859DSLVR66A - PowerQUICC MPU 66MHz 357-PBGA | NXP Semiconductors

MPC859DSLVR66A Obsolete
NXP Semiconductors
MPC859DSLZP50A MPC859DSLZP50A - PowerQUICC 50MHz Comm Processor | NXP | BGA-357

MPC859DSLZP50A - PowerQUICC 50MHz Comm Processor | NXP | BGA-357

MPC859DSLZP50A ✗ Abgekündigt

Spezifikationsvergleich

Parameter MPC859DSLVR66A MPC859DSLZP50A
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Obsolete Ende des Lebenszyklus
Lagerstatus In Stock In Stock
Stückpreis (USD) $23,85 $52,50
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Series PowerQUICC MPC8xx —
Core Processor MPC8xx (Power Architecture) —
Number of Cores / Bus Width 1 Core, 32-Bit —
Speed (Clock Frequency) 66 MHz —
Performance 87 MIPS —
Co-Processors / DSP Communications; CPM (Communications Processor Module) —
RAM Controllers DRAM (SDRAM, EDO, FPM) —
Graphics Acceleration No —
Display & Interface Controllers None —
Ethernet 10 Mbps (1) and 10/100 Mbps (1) MAC —
USB USB 1.1 (Full Speed) —
Operating Voltage 3.3 V —
Betriebstemperaturbereich 0 °C to +95 °C (commercial / extended 'SL' grade) —
Gehäuse 357-PBGA (25 x 25 mm) —
Montageart Surface Mount Surface Mount
Process Technology 0.18 µm CMOS 0.18 micron CMOS
MSL-Level [DATA_NEEDED: MSL rating] —
RoHS-Status [DATA_NEEDED: RoHS compliance status] RoHS
Lebenszyklusstatus Obsolete (last shipped by NXP; available only from brokers / authorized stock) —
Processor Type — MPC8xx PowerQUICC Integrated Communications Controller
Core Architecture — 32-bit Power Architecture
Number of Cores — 1
Core Frequency — 50 MHz
Core Supply Voltage — 1.8 V
I/O Supply Voltage — 3.3 V
Gehäuse / Bauform — 357-PBGA (25x25 mm)
Betriebstemperatur — 0 C to +95 C
Packaging — Tray
Lead Free Status — Contains Lead
Ethernet MACs — 2 x 10/100 Mbps
Lifecycle — End of Life per NXP product page

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern