MPC859DSLVR66A vs MPC859DSLZP50A Comparação

Comparação detalhada lado a lado de MPC859DSLVR66A por NXP Semiconductors e MPC859DSLZP50A por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
MPC859DSLVR66A MPC859DSLVR66A - PowerQUICC MPU 66MHz 357-PBGA | NXP Semiconductors

MPC859DSLVR66A - PowerQUICC MPU 66MHz 357-PBGA | NXP Semiconductors

MPC859DSLVR66A Obsolete
NXP Semiconductors
MPC859DSLZP50A MPC859DSLZP50A - PowerQUICC 50MHz Comm Processor | NXP | BGA-357

MPC859DSLZP50A - PowerQUICC 50MHz Comm Processor | NXP | BGA-357

MPC859DSLZP50A ✗ Fim de vida

Comparação de especificações

Parâmetro MPC859DSLVR66A MPC859DSLZP50A
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Obsolete Fim de vida
Status do estoque In Stock In Stock
Preço unitário (USD) $23,85 $52,50
Manufacturer NXP Semiconductors (formerly Freescale Semiconductor) —
Series PowerQUICC MPC8xx —
Core Processor MPC8xx (Power Architecture) —
Number of Cores / Bus Width 1 Core, 32-Bit —
Speed (Clock Frequency) 66 MHz —
Performance 87 MIPS —
Co-Processors / DSP Communications; CPM (Communications Processor Module) —
RAM Controllers DRAM (SDRAM, EDO, FPM) —
Graphics Acceleration No —
Display & Interface Controllers None —
Ethernet 10 Mbps (1) and 10/100 Mbps (1) MAC —
USB USB 1.1 (Full Speed) —
Operating Voltage 3.3 V —
Faixa de temperatura de operação 0 °C to +95 °C (commercial / extended 'SL' grade) —
Encapsulamento 357-PBGA (25 x 25 mm) —
Tipo de montagem Surface Mount Surface Mount
Process Technology 0.18 µm CMOS 0.18 micron CMOS
Nível MSL [DATA_NEEDED: MSL rating] —
Status RoHS [DATA_NEEDED: RoHS compliance status] RoHS
Status do ciclo de vida Obsolete (last shipped by NXP; available only from brokers / authorized stock) —
Processor Type — MPC8xx PowerQUICC Integrated Communications Controller
Core Architecture — 32-bit Power Architecture
Number of Cores — 1
Core Frequency — 50 MHz
Core Supply Voltage — 1.8 V
I/O Supply Voltage — 3.3 V
Encapsulamento / Caixa — 357-PBGA (25x25 mm)
Temperatura de operação — 0 C to +95 C
Packaging — Tray
Lead Free Status — Contains Lead
Ethernet MACs — 2 x 10/100 Mbps
Lifecycle — End of Life per NXP product page

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