MPC860DEZQ50D4 vs MPC855TVR50D4 Vergleich

Detaillierter Direktvergleich von MPC860DEZQ50D4 von NXP Semiconductors und MPC855TVR50D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
MPC860DEZQ50D4 MPC860DEZQ50D4 - PowerQUICC MPU 50MHz 357-BGA | NXP

MPC860DEZQ50D4 - PowerQUICC MPU 50MHz 357-BGA | NXP

MPC860DEZQ50D4 Nrnd
NXP Semiconductors
MPC855TVR50D4 MPC855TVR50D4 - PowerQUICC I 50MHz SoC | NXP | 357-PBGA

MPC855TVR50D4 - PowerQUICC I 50MHz SoC | NXP | 357-PBGA

MPC855TVR50D4 Nrnd

Spezifikationsvergleich

Parameter MPC860DEZQ50D4 MPC855TVR50D4
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus NRND NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $24,95 $48,10
Processor Type MPC8xx PowerQUICC, 32-bit —
Core Architecture Power Architecture (embedded) Power Architecture (PowerPC) 32-bit, 1 core
Core Frequency 50 MHz 50 MHz
Communications Processor Module CPM with HDLC, Ethernet, PCMCIA, SCC —
Ethernet MAC 10/100 Mbps integrated —
HDLC/SDLC Channels Yes (multi-channel) —
PCMCIA Interface Yes —
Supply Voltage (I/O) 3.3 V —
Gehäuse 357-Ball PBGA (25x25 mm) 357-Ball PBGA (25x25 mm)
Montageart Surface Mount (BGA) Surface Mount (BGA)
Betriebstemperatur 0 C to +95 C 0 C to +95 C (commercial)
RoHS-Status Contains Lead (legacy BGA) [DATA_NEEDED: RoHS compliance status]
Lead-Free Status Contains Lead —
Packaging Tray —
Sub-Brand Heritage Freescale / NXP PowerQUICC —
Series — PowerQUICC I (MPC8xx)
Integrated Peripherals — CPM, ENET, ATM, HDLC, PCMCIA
Cache Size — 8 KB unified instruction/data
Versorgungsspannung — 2.0 V to 3.6 V
Ethernet — 10/100 Mbps (FCC/FEC)
Memory Controller — SDRAM, ROM, Flash, PCMCIA
Core Marking Family — MPC85xx
MSL-Level — 3
Lead-Free — [DATA_NEEDED: lead-free status]

Datenblätter & Ressourcen

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