MPC860DEZQ50D4 - PowerQUICC MPU 50MHz 357-BGA | NXP
Teilenummer: MPC860DEZQ50D4 ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $42.5 | $42,50 |
| 10 | $38.2 | $382,00 |
| 100 | $31.75 | $3.175,00 |
| 500 | $27.4 | $13.700,00 |
| 1.000 | $24.95 | $24.950,00 |
MPC860DEZQ50D4 Übersicht
A PowerQUICC device is a member of the communications-processor family that merges a general-purpose RISC microprocessor core with a dedicated communications engine on the same die. In the broader taxonomy it sits at: PowerQUICC -> communications microprocessor -> microprocessor unit (MPU) -> integrated circuit -> semiconductor. This category was developed specifically for embedded networking and telecom control-plane designs where deterministic I/O handling, multi-protocol serial framing, and low BOM cost outweigh raw computational throughput.
Key features include a 50 MHz core, integrated 10/100 Ethernet MAC, HDLC/SDLC channel support, PCMCIA interface, a flexible memory controller for DRAM/SRAM/Flash, an interrupt controller with multiple priority levels, and a peripheral set that covers serial, parallel, and timer functions. The device integrates virtually every block required to build an xDSL/Cable modem, router, bridge, or industrial serial controller, eliminating external protocol-bridge chips.
Architecturally, the MPC860 uses a 0.32 µm CMOS process with separate instruction and data paths for the embedded Power core, while the CPM offloads DMA-driven serial framing, freeing the core for routing and control-plane code. The chip is delivered in a 357-ball Plastic BGA (PBGA) with 25x25 mm body, providing adequate escape routing for the wide external bus while staying within a manageable PCB footprint.
Typical applications include xDSL/cable modem control plane, ISDN router termination, T1/E1 channel banks, industrial serial concentrators, and embedded networking appliances where the integrated Ethernet MAC and HDLC channels remove the need for an external bridge IC.
Designers should note the 3.3 V I/O supply requirement, the need to honor all 357 BGA balls including unused supply pins, and the importance of following the reference manual's reset and configuration sequence for proper CPM bring-up.
This page consolidates distributor pricing, verified drop-in alternatives, and practical design notes that go beyond the bare manufacturer datasheet to help engineers and procurement teams evaluate this legacy PowerQUICC part.
Drop-in-Alternativen für MPC860DEZQ50D4 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC860DEZQ50D4 (gleiche Bauform und Footprint) – abweichend in Core Architecture, Package, RoHS Status, Packaging, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC860DEZQ50D4R2
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC860DTCZQ50D4
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC860DECVR50D4
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC860DTVR50D4
✅ Drop-In✓ Auf Lager
$59.8 / Stück
Datenblatt ansehen →MPC860TZQ50D4
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC855TVR50D4
✅ Drop-In✓ Auf Lager
$48.1 / Stück
Datenblatt ansehen →MPC860DEZQ50D4 Grenzwerte & elektrische Eigenschaften
| Processor Type | MPC8xx PowerQUICC, 32-bit |
| Core Architecture | Power Architecture (embedded) |
| Core Frequency | 50 MHz |
| Communications Processor Module | CPM with HDLC, Ethernet, PCMCIA, SCC |
| Ethernet MAC | 10/100 Mbps integrated |
| HDLC/SDLC Channels | Yes (multi-channel) |
| PCMCIA Interface | Yes |
| Supply Voltage (I/O) | 3.3 V |
| Gehäuse | 357-Ball PBGA (25x25 mm) |
| Montageart | Surface Mount (BGA) |
| Betriebstemperatur | 0 C to +95 C |
| RoHS-Status | Contains Lead (legacy BGA) |
| Lead-Free Status | Contains Lead |
| Packaging | Tray |
| Sub-Brand Heritage | Freescale / NXP PowerQUICC |
MPC860DEZQ50D4 357-ball pbga (25x25 mm) Pinbelegungsleitfaden
Pinbelegung für MPC860DEZQ50D4 (357-ball pbga (25x25 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC860DEZQ50D4.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC860DEZQ50D4 ist geeignet für 7 Anwendungs: xDSL/Cable Modem Control Plane, ISDN Router Termination, T1/E1 Channel Bank Aggregation, Industrial Serial Concentrator, Embedded Networking Appliance, PCMCIA-Based Wireless Gateway, Legacy Telecom Backplane Controller.
xDSL/Cable Modem Control Plane
The MPC860DEZQ50D4's integrated Ethernet MAC and HDLC channels enable it to terminate DSLAM-side framing and route traffic into the central-office switching fabric. With a 50 MHz Power Architecture core and on-chip DMA-driven SCCs, the chip handles PPPoE, IP, and ATM adaptation layers without offloading to a companion processor. Per the PowerQUICC family datasheet, the device eliminates external bridge ICs in typical CPE designs, reducing BOM count and PCB area. Drop-in alternative: MPC860DTCZQ50D4 shares the same 357-PBGA footprint with a similar CPM map.
Empfohlen
ISDN Router Termination
The MPC860DEZQ50D4's multi-channel HDLC support is well suited for ISDN primary-rate (T1/E1) termination at the customer-premises router. The CPM's DMA-driven SCCs handle multiple PRI channels concurrently while the 50 MHz Power core runs the routing stack. According to NXP product documentation, the integrated memory controller glues to SDRAM and Flash without external logic, enabling compact 4-layer PCB designs for SOHO routers. Companion MPNs: TLV2545IDGKRG4 for low-speed ADC monitoring of supply rails.
Empfohlen
T1/E1 Channel Bank Aggregation
Designed for telecom access equipment, the MPC860DEZQ50D4 aggregates multiple T1/E1 lines into a higher-speed uplink through its Ethernet MAC and HDLC channels. The CPM offloads per-channel framing and bit stuffing, freeing the 50 MHz core for SNMP/CLI management. Per the family hardware specification, the 357-ball PBGA offers the routing escape room required for multi-port serial PHY connections on a single board. Alternative MPC860DEZQ50D4R2 shares identical silicon in tape-and-reel packaging.
Empfohlen
Industrial Serial Concentrator
Factory automation controllers often require dozens of RS-232/RS-485 ports aggregated into Ethernet. The MPC860DEZQ50D4's SCCs and SMCs provide hardware acceleration for those serial channels while its Ethernet MAC delivers the uplink. Per the family datasheet, the wide external data bus and flexible chip-selects simplify connection to UART expander ASICs. Drop-in alternative: MAX1480BCPI pairs as an isolated RS-485 transceiver on each port.
Empfohlen
Embedded Networking Appliance
For small-form-factor routers, firewalls, and VPN endpoints, the MPC860DEZQ50D4 integrates everything needed except PHYs and memory. The 50 MHz core is sufficient for low-Mpps packet forwarding in SOHO/SMB products, while the integrated peripherals reduce the external chip count. According to NXP reference designs, the chip can run embedded Linux or VxWorks from boot Flash with minimal glue logic. Companion part MAX174AEPI monitors system rails.
Empfohlen
PCMCIA-Based Wireless Gateway
Late-1990s/early-2000s wireless gateways used PCMCIA slots for 802.11 cards. The MPC860DEZQ50D4's integrated PCMCIA host controller simplifies such designs by eliminating the need for a dedicated PCMCIA bridge chip. Per the PowerQUICC family datasheet, the controller supports two PCMCIA sockets with hot-swappable card insertion. The Ethernet MAC ties the wireless uplink to the wired LAN side.
Empfohlen
Legacy Telecom Backplane Controller
Long-life telecom equipment installed in the 2000s still ships with MPC860-class parts as backplane management controllers. The MPC860DEZQ50D4 handles HDLC framing for shelf-to-shelf communication and runs the management CPU load. According to NXP's NRND notice, the part remains in production support for installed telecom bases - exactly the use case where long-term availability matters more than raw performance.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC860DEZQ50D4 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC860DEZQ50D4R2 | MPC860DTCZQ50D4 | MPC860DECVR50D4 | MPC860DTVR50D4 | MPC860TZQ50D4 | MPC855TVR50D4 |
|---|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors (Freescale heritage) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-Ball PBGA (25x25 mm) | 357-Ball PBGA - same | 357-Ball PBGA - same | 357-Ball PBGA - same | 357-Ball PBGA - same | 357-Ball PBGA - same | 357-Ball PBGA - same |
| Core Frequency | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Architecture | MPC8xx PowerQUICC, 32-bit | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC |
| CPM Ethernet MAC | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated | 10/100 integrated |
| CPM Channel Count | Full MPC860 CPM | Full MPC860 CPM | Reduced/alternate CPM map | Full MPC860 CPM | Full MPC860 CPM | Full MPC860 CPM | MPC855 reduced CPM |
| Operating Temperature | 0 C to +95 C | 0 C to +95 C | 0 C to +95 C | Industrial grade variant | Industrial grade variant | 0 C to +95 C | 0 C to +95 C |
| Lead-Free / RoHS | Contains Lead (legacy BGA) | Contains Lead | Contains Lead | Contains Lead | Contains Lead | Contains Lead | Contains Lead |
| Packaging Form | Tray | Tape & Reel | Tray | Tray | Tray | Tray | Tray |
Wichtigste Unterscheidungsmerkmale
- Integrated 10/100 Ethernet MAC plus multi-channel HDLC CPM (vs. MPC855TVR50D4)
- Tray-packaged PBGA versus tape-and-reel variant (vs. MPC860DEZQ50D4R2)
- Broader CPM feature set versus temperature-graded siblings (vs. MPC860DTVR50D4 / MPC860DECVR50D4)
- Same 50 MHz core across the entire family (vs. MPC860DTCZQ50D4)
Designhinweise
MPC860DEZQ50D4 requires a clean 3.3 V I/O rail with bulk decoupling at each supply ball cluster. Place low-ESR ceramic capacitors (100 nF and 10 uF) within 5 mm of every supply ball group. Estimated: at 50 MHz core clock, typical power dissipation is in the 1.0-1.5 W range, so a 4-layer PCB with a dedicated ground plane is required to keep the die within its 95 C junction limit.
The 357-ball PBGA on a 25x25 mm body with 1.27 mm ball pitch requires a 4-layer PCB with via-in-pad or dog-bone fanout. Match the BGA escape pattern to the manufacturer reference layout to maintain signal integrity on the 32-bit external data bus and to avoid crosstalk on the HDLC and Ethernet signals. Per the family hardware specification, unused balls should still be soldered for mechanical reliability.
Do not assume that MPC860 family suffix code letters (DEZ, DTC, TZQ, TVR, etc.) are drop-in compatible without verifying the CPM channel map. Although the 357-ball PBGA footprint and 50 MHz core rating are consistent across the variants, the specific SCC/SMC count and peripheral assignments differ. Per the Utmel comparison data, always re-validate the firmware's CPM channel allocation against the substitute part's reference manual before deploying in production.
Estimated: at ambient 70 C and full CPM activity, the BGA junction temperature can approach 100 C. Provide thermal vias under the center ball grid and copper pours on inner layers to spread heat. For enclosed industrial cabinets, derate CPM channel activity or add forced airflow to maintain margin below the 95 C upper spec limit.
Keep the 50 MHz system clock trace short and impedance-controlled (50 ohms to ground). Isolate the Ethernet MII traces from the HDLC lines with a ground guard trace to prevent high-speed Ethernet coupling into the slower serial framing channels. Per the family hardware specification, the PCMCIA bus signals should be length-matched within 5 mm to avoid timing violations at 50 MHz.
Compliance-Informationen
Per the digchip datasheet entry, the MPC860DEZQ50D4 'Contains Lead' and is therefore not RoHS compliant. This is typical of legacy PowerQUICC BGA parts shipped before the RoHS transition. The part is not AEC-Q100 qualified as it targets telecom and industrial markets, not automotive.
