MPC860PCZQ50D4 vs MPC860TCVR50D4 Vergleich
Detaillierter Direktvergleich von MPC860PCZQ50D4 von NXP Semiconductors und MPC860TCVR50D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC860PCZQ50D4 - PowerQUICC MPC860 50MHz MPU | 357-PBGA | NXP
MPC860PCZQ50D4 ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MPC860PCZQ50D4 | MPC860TCVR50D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Ende des Lebenszyklus | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $58,10 | $0,00 |
| Processor Type | MPC8xx PowerQUICC 32-Bit MPU | MPC8xx PowerQUICC 32-bit microprocessor |
| Core Architecture | PowerPC 603 (32-bit, no FPU) | — |
| Core Frequency | 50 MHz | — |
| Number of Cores | 1 (CPU + CPM RISC engine) | — |
| Operating Voltage - I/O | 3.3 V | — |
| Internal Core Voltage | 2.2 V or 1.8 V (selection required) | — |
| Process Technology | 0.32 micron CMOS | 0.32 micrometer |
| Instruction Cache | 4 Kbyte | — |
| Data Cache | 4 Kbyte | — |
| MMU | Yes (32-bit virtual addressing) | — |
| On-chip Ethernet MAC | 2x 10/100 Mbps (MII interface) | — |
| Gehäuse | 357-PBGA (25x25 mm) | 357-pin PBGA, 25 x 25 mm |
| Betriebstemperaturbereich | -40C to +85C (industrial, 'PC' suffix) | — |
| Lead Status | Contains Lead | — |
| RoHS-Status | Non-Compliant (contains lead) | RoHS compliant |
| Montageart | Surface Mount (BGA) | Surface mount |
| Lebenszyklusstatus | End of Life | — |
| Core Count | — | 1 core |
| Processor Architecture | — | RISC, 32-bit |
| Operating Speed | — | 50 MHz |
| Versorgungsspannung | — | 3.3 V |
| Package Type | — | 357-BBGA |
| Packaging | — | Tray |
| Lead-Free Status | — | Lead free |
| Application Category | — | Communications and networking controllers |
| Betriebstemperatur | — | [DATA_NEEDED: operating temperature range] |
| Memory Configuration | — | [DATA_NEEDED: internal and external memory configuration] |
| I/O Interfaces | — | [DATA_NEEDED: communications and peripheral interfaces] |
| Power Consumption | — | [DATA_NEEDED: power consumption conditions] |
| Clocking and Reset | — | [DATA_NEEDED: clock and reset requirements] |
| Pinout | — | [DATA_NEEDED: complete 357-ball assignment] |