MPC860PCZQ50D4 vs MPC860TCVR50D4 Comparaison
Comparaison détaillée côte à côte de MPC860PCZQ50D4 par NXP Semiconductors et MPC860TCVR50D4 par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
MPC860PCZQ50D4 - PowerQUICC MPC860 50MHz MPU | 357-PBGA | NXP
MPC860PCZQ50D4 ✗ Fin de vieComparaison des spécifications
| Paramètre | MPC860PCZQ50D4 | MPC860TCVR50D4 |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Fin de vie | Fin de vie |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $58,10 | $0,00 |
| Processor Type | MPC8xx PowerQUICC 32-Bit MPU | MPC8xx PowerQUICC 32-bit microprocessor |
| Core Architecture | PowerPC 603 (32-bit, no FPU) | — |
| Core Frequency | 50 MHz | — |
| Number of Cores | 1 (CPU + CPM RISC engine) | — |
| Operating Voltage - I/O | 3.3 V | — |
| Internal Core Voltage | 2.2 V or 1.8 V (selection required) | — |
| Process Technology | 0.32 micron CMOS | 0.32 micrometer |
| Instruction Cache | 4 Kbyte | — |
| Data Cache | 4 Kbyte | — |
| MMU | Yes (32-bit virtual addressing) | — |
| On-chip Ethernet MAC | 2x 10/100 Mbps (MII interface) | — |
| Boîtier | 357-PBGA (25x25 mm) | 357-pin PBGA, 25 x 25 mm |
| Plage de température de fonctionnement | -40C to +85C (industrial, 'PC' suffix) | — |
| Lead Status | Contains Lead | — |
| Statut RoHS | Non-Compliant (contains lead) | RoHS compliant |
| Type de montage | Surface Mount (BGA) | Surface mount |
| Statut du cycle de vie | End of Life | — |
| Core Count | — | 1 core |
| Processor Architecture | — | RISC, 32-bit |
| Operating Speed | — | 50 MHz |
| Tension d'alimentation | — | 3.3 V |
| Package Type | — | 357-BBGA |
| Packaging | — | Tray |
| Lead-Free Status | — | Lead free |
| Application Category | — | Communications and networking controllers |
| Température de fonctionnement | — | [DATA_NEEDED: operating temperature range] |
| Memory Configuration | — | [DATA_NEEDED: internal and external memory configuration] |
| I/O Interfaces | — | [DATA_NEEDED: communications and peripheral interfaces] |
| Power Consumption | — | [DATA_NEEDED: power consumption conditions] |
| Clocking and Reset | — | [DATA_NEEDED: clock and reset requirements] |
| Pinout | — | [DATA_NEEDED: complete 357-ball assignment] |