MPC860PCZQ50D4 vs MPC860TCVR50D4 对比

详细并排对比 MPC860PCZQ50D4 出自 NXP Semiconductors 和 MPC860TCVR50D4 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC860PCZQ50D4 MPC860PCZQ50D4 - PowerQUICC MPC860 50MHz MPU | 357-PBGA | NXP

MPC860PCZQ50D4 - PowerQUICC MPC860 50MHz MPU | 357-PBGA | NXP

MPC860PCZQ50D4 ✗ 停产
NXP Semiconductors
MPC860TCVR50D4 MPC860TCVR50D4 - 50MHz 32-Bit PowerQUICC MPU | NXP

MPC860TCVR50D4 - 50MHz 32-Bit PowerQUICC MPU | NXP

MPC860TCVR50D4 ✗ 停产

规格对比

参数 MPC860PCZQ50D4 MPC860TCVR50D4
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 停产 停产
库存状态 有库存 有库存
单价(USD) $58.10 $0.00
Processor Type MPC8xx PowerQUICC 32-Bit MPU MPC8xx PowerQUICC 32-bit microprocessor
Core Architecture PowerPC 603 (32-bit, no FPU) —
Core Frequency 50 MHz —
Number of Cores 1 (CPU + CPM RISC engine) —
Operating Voltage - I/O 3.3 V —
Internal Core Voltage 2.2 V or 1.8 V (selection required) —
Process Technology 0.32 micron CMOS 0.32 micrometer
Instruction Cache 4 Kbyte —
Data Cache 4 Kbyte —
MMU Yes (32-bit virtual addressing) —
On-chip Ethernet MAC 2x 10/100 Mbps (MII interface) —
封装 357-PBGA (25x25 mm) 357-pin PBGA, 25 x 25 mm
工作温度范围 -40C to +85C (industrial, 'PC' suffix) —
Lead Status Contains Lead —
RoHS 状态 Non-Compliant (contains lead) RoHS compliant
安装类型 Surface Mount (BGA) Surface mount
生命周期状态 End of Life —
Core Count — 1 core
Processor Architecture — RISC, 32-bit
Operating Speed — 50 MHz
电源电压 — 3.3 V
Package Type — 357-BBGA
Packaging — Tray
Lead-Free Status — Lead free
Application Category — Communications and networking controllers
工作温度 — [DATA_NEEDED: operating temperature range]
Memory Configuration — [DATA_NEEDED: internal and external memory configuration]
I/O Interfaces — [DATA_NEEDED: communications and peripheral interfaces]
Power Consumption — [DATA_NEEDED: power consumption conditions]
Clocking and Reset — [DATA_NEEDED: clock and reset requirements]
Pinout — [DATA_NEEDED: complete 357-ball assignment]

数据手册与资源

浏览全部产品 创建 BOM 获取报价