MPC860SRVR66D4 vs MPC860SRZQ66D4 Vergleich
Detaillierter Direktvergleich von MPC860SRVR66D4 von NXP Semiconductors und MPC860SRZQ66D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP
MPC860SRVR66D4 ⚠ Letzte BestellmöglichkeitNXP Semiconductors
MPC860SRZQ66D4 - PowerQUICC MPC8xx MPU 66MHz 357-BGA | NXP
MPC860SRZQ66D4 ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MPC860SRVR66D4 | MPC860SRZQ66D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $89,75 | $128,33 |
| Processor Type | MPC8xx PowerQUICC | MPC8xx PowerQUICC 32-Bit |
| Core Architecture | PowerPC 32-bit | — |
| Number of Cores | 1 | — |
| Clock Speed | 66 MHz | — |
| Operating Voltage | 3.3 V (5 V tolerant I/O) | 3.3 V |
| Instruction Cache | 4 Kbyte | — |
| Data Cache | 4 Kbyte | — |
| MMU | Yes | — |
| Communication Processor Module (CPM) | Yes (FCC/SCC/SMC/SPI/I2C) | — |
| Multiply-Accumulate (MAC) Unit | Yes | — |
| JTAG / Debug | IEEE 1149.1 compliant | — |
| Betriebstemperatur | -40C to +95C | — |
| Gehäuse / Bauform | 357-PBGA (25 mm x 25 mm) | 357-BBGA (PBGA 25x25 mm) |
| Montageart | Surface Mount (BGA) | Surface Mount |
| Packaging (Shipping) | Tray | — |
| Lead Free Status | Lead Free | Contains Lead |
| RoHS-Status | RoHS Compliant | RoHS |
| Core | — | PowerPC, 1 Core |
| Core Speed | — | 66 MHz |
| Datenbusbreite | — | 32-Bit |
| Packaging | — | Tray |
| Process Technology | — | 0.32 um CMOS |
| Family | — | PowerQUICC |
| Pin-Anzahl | — | 357 |
| On-chip Peripherals | — | CPM (SCC/SMC), Timers, Memory Controller |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |