MPC860SRVR66D4 - 66MHz PowerQUICC MPU, 357-BGA | NXP
Teilenummer: MPC860SRVR66D4 ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $118.41 | $118,41 |
| 10 | $112.1 | $1.121,00 |
| 100 | $104.5 | $10.450,00 |
| 500 | $96.2 | $48.100,00 |
| 1.000 | $89.75 | $89.750,00 |
MPC860SRVR66D4 Übersicht
An MPU (Microprocessor Unit) in the PowerQUICC family combines a general-purpose processor core with dedicated communication peripherals on a single die, eliminating the need for a companion ASIC or coprocessor. The MPC8xx sits in the broader taxonomy as a 32-bit embedded microprocessor -> embedded MPU -> PowerPC architecture -> communication-centric SoC. By co-integrating fast communication controllers (FCC, SCC, SMC, SPI, I2C), the MPC860 enables designs such as ISDN modems, routers, and protocol converters at lower system cost than discrete-ASIC solutions.
Key features include 4 Kbytes of instruction cache, 4 Kbytes of data cache, a multiply-accumulate (MAC) unit for DSP-like operations, a memory management unit (MMU), and a system integration module (SIU). The CPM provides independent RISC-driven serial channels, supporting HDLC, transparent, and UART modes. An IEEE 1149.1 JTAG interface and on-chip debug port simplify boundary-scan test and in-system software development. Industrial-grade temperature range (-40C to +95C ambient) and a 0.32-micron CMOS process suit thermally constrained enclosures.
Typical applications include ISDN terminal adapters, T1/E1 framer/mux boards, industrial Ethernet gateways, and legacy serial-protocol converters. The 3.3 V core with 5 V tolerant bus simplifies drop-in replacement of older 5 V designs that have already migrated I/O to 3.3 V. Designers should consult the MPC860 PowerQUICC User's Manual and AN-2125 for CPM buffer descriptor table allocation and BD ring sizing for full-duplex HDLC links.
Packaging is supplied in JEDEC-level tray (not tape-and-reel) because the 357-PBGA package is too heavy and large for standard 7-inch or 13-inch reels. For thermal PCB layout, the 25 mm BGA exposes the die through the center balls and demands a thermal via array under the package for heat extraction.
Per the NXP product page, the part is flagged as End of Life (EOL). Long-term replenishment is available through authorized distributors holding obsolete-stock licenses or through component re-sellers who have inventoried the original NXP wafer releases. This page synthesizes live distributor pricing, drop-in alternatives from the same MPC8xx family, and design notes on BGA re-balling not found in the manufacturer datasheet.
Drop-in-Alternativen für MPC860SRVR66D4 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MPC860SRVR66D4 (gleiche Bauform und Footprint) – abweichend in Package / Case, Processor Type, RoHS Status, Mounting Type, Process Technology.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MPC860ENVR66D4
✅ Drop-In✓ Auf Lager
$48.85 / Stück
Datenblatt ansehen →MPC860SRZQ66D4
✅ Drop-In✓ Auf Lager
$128.33 / Stück
Datenblatt ansehen →MPC860DTCZQ66D4
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC860DEZQ66D4
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MPC855TVR66D4
✅ Drop-In✓ Auf Lager
$55.4 / Stück
Datenblatt ansehen →MPC860SRVR66D4 Grenzwerte & elektrische Eigenschaften
| Processor Type | MPC8xx PowerQUICC |
| Core Architecture | PowerPC 32-bit |
| Number of Cores | 1 |
| Clock Speed | 66 MHz |
| Operating Voltage | 3.3 V (5 V tolerant I/O) |
| Instruction Cache | 4 Kbyte |
| Data Cache | 4 Kbyte |
| MMU | Yes |
| Communication Processor Module (CPM) | Yes (FCC/SCC/SMC/SPI/I2C) |
| Multiply-Accumulate (MAC) Unit | Yes |
| JTAG / Debug | IEEE 1149.1 compliant |
| Betriebstemperatur | -40C to +95C |
| Gehäuse / Bauform | 357-PBGA (25 mm x 25 mm) |
| Montageart | Surface Mount (BGA) |
| Packaging (Shipping) | Tray |
| Lead Free Status | Lead Free |
| RoHS-Status | RoHS Compliant |
MPC860SRVR66D4 357-pbga (25 mm x 25 mm) Pinbelegungsleitfaden
Pinbelegung für MPC860SRVR66D4 (357-pbga (25 mm x 25 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für MPC860SRVR66D4.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
MPC860SRVR66D4 ist geeignet für 6 Anwendungs: ISDN Terminal Adapter, T1/E1 Framer/Multiplexer, Industrial Ethernet Gateway, Legacy Protocol Converter, Set-Top Box / Embedded Router, Avionics Data Concentrator.
ISDN Terminal Adapter
The MPC860SRVR66D4's integrated Communication Processor Module (CPM) provides dedicated SCC, SMC, and serial channel hardware offload engines that handle HDLC framing, transparent bit streams, and UART signaling in parallel with the PowerPC core. For an ISDN terminal adapter, the CPM's two full-duplex SCC channels are configured as 128 kbit/s S/T-interface HDLC links, while the core handles the upper-layer protocol stack. The 66 MHz core sustains PPP/MLPPP packet processing without saturating the host CPU, and the on-chip MAC unit accelerates CRC-32 calculation used in HDLC and frame relay. Compared with a discrete DSP-plus-MCU design, the integrated CPM reduces bill-of-materials by eliminating the coprocessor; compared with later ARM-based SoCs, it trades power efficiency for deterministic real-time serial-channel timing that telecom carriers require in legacy deployments.
Empfohlen
T1/E1 Framer/Multiplexer
The MPC860SRVR66D4 drives T1 (1.544 Mbit/s) or E1 (2.048 Mbit/s) framer boards where the CPM's multi-channel HDLC controller frames bits, manages zero-bit insertion/destruction, and flags line errors to the PowerPC core. At 66 MHz, the core multiplexes up to 24 DS0 channels (T1) or 30 DS0 channels (E1) into a single backplane bus, while the on-chip 4+4 Kbyte caches keep latencies below 1.5 us per channel-context switch. The 3.3 V core with 5 V tolerant bus simplifies retrofitting into legacy 5 V T1/E1 shelves that have already migrated I/O. Engineers should consult NXP application note AN-2125 for CPM buffer-descriptor sizing for full-duplex HDLC links and reserve at least 12 mm of BGA-routing keep-out under the package for thermal-via arrays on backplane cards.
Empfohlen
Industrial Ethernet Gateway
The MPC860SRVR66D4 acts as the protocol-conversion engine in industrial Ethernet gateways that bridge legacy fieldbus (Modbus, Profibus, DeviceNet) to TCP/IP networks. The PowerPC core runs the TCP/IP stack while the CPM's SCC/SMC channels each map to a different fieldbus interface, with the on-chip MMU isolating protocol domains for safe memory partitioning. The 66 MHz clock is sufficient to sustain full-duplex 10 Mbit/s Ethernet switching with 32 simultaneous TCP sessions; for 100 Mbit/s, designers must move to PowerQUICC II (MPC8272) or later. The part's industrial operating temperature (-40C to +95C) supports deployment in factory cabinets without active cooling, and the integrated CPM removes the need for an external UART concentrator ASIC on the gateway mainboard.
Empfohlen
Legacy Protocol Converter
The MPC860SRVR66D4 is well-suited for protocol converters that translate between legacy serial protocols (RS-232/422/485, V.35, X.21) and modern packet-based systems. The on-chip CPM drives up to four SCC channels plus multiple SMC channels, each configurable for different physical interfaces via external transceivers. At 66 MHz, the PowerPC core maintains a real-time operating system (typically VxWorks or ppc-Linux) that runs the protocol-translation logic without needing an external memory bus master. Designers building these bridges often cite the MPC860's deterministic CPM latency as a key advantage when compared with general-purpose ARM Cortex-A microcontrollers that lack a dedicated RISC co-processor; the trade-off is higher unit cost and EOL status due to the part's age.
Empfohlen
Set-Top Box / Embedded Router
The MPC860SRVR66D4 was widely used in early-generation set-top boxes and embedded routers, where its integrated CPM handled MPEG transport-stream demultiplexing or PPPoE session termination while the PowerPC core processed the system kernel, middleware, and user-interface logic. The 4+4 Kbyte on-chip caches keep memory latencies bounded for MPEG-2 transport-stream parsing at 64 Mbit/s, and the on-chip MMU supports ppc-Linux distributions from the era. While modern designs have moved to PowerQUICC II/III or ARM SoCs, a substantial fleet of legacy STB/router designs continues to operate with this part, and the EOL status makes drop-in alternatives (MPC860ENVR66D4) the preferred service-stock path for field repairs.
Empfohlen
Avionics Data Concentrator
The MPC860SRVR66D4 finds use in avionics data concentrators that aggregate multiple ARINC 429 channels plus Ethernet and MIL-STD-1553 onto a single backplane. The CPM's SCC channels, configured with external ARINC 429 line-receivers, handle up to 12 ARINC channels without needing additional silicon; the PowerPC core runs the safety-critical routing software. The 66 MHz speed is sufficient for the 12.5 kbit/s and 100 kbit/s ARINC rates, even with full error-injection testing. Designers in this segment should verify lot trace, RoHS, and conflict-mineral conformance for each procurement batch given the part's EOL status and the long in-service life of avionics platforms (typically 20+ years).
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MPC860SRVR66D4 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MPC860ENVR66D4 | MPC860SRZQ66D4 | MPC860DTCZQ66D4 | MPC860DEZQ66D4 | MPC855TVR66D4 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25) | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same | 357-PBGA (25x25) - same |
| Core Clock | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz | 66 MHz |
| Processor Family | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC | MPC8xx PowerQUICC |
| Operating Voltage | 3.3 V (5 V tolerant I/O) | 3.3 V (5 V tolerant I/O) | 3.3 V (5 V tolerant I/O) | 3.3 V (5 V tolerant I/O) | 3.3 V (5 V tolerant I/O) | 3.3 V (5 V tolerant I/O) |
| Temperature Grade | Industrial (per NXP ordering info) | Extended (per NXP ordering info) | Industrial (per NXP ordering info) | Industrial (per NXP ordering info) | Industrial (per NXP ordering info) | Industrial (per NXP ordering info) |
| On-chip Cache (I/D) | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte | 4 Kbyte / 4 Kbyte |
| Communication Module | CPM (FCC/SCC/SMC) | CPM (same family) | CPM (same family) | CPM (same family) | CPM (same family) | CPM (different feature mix) |
Wichtigste Unterscheidungsmerkmale
- Original NXP/Freescale production with full traceability (vs. Rochester Electronics licensed stock)
- Standard industrial temperature grade vs. extended (vs. MPC860ENVR66D4)
- Comprehensive CPM documentation legacy (vs. MPC855TVR66D4)
Designhinweise
The 357-PBGA exposes the silicon die through the center ball grid and thermal pad, requiring a thermal via array (typically 0.3 mm holes on a 1.0-1.2 mm pitch) directly under the package center. Estimated: with 1.5 W typical dissipation and a 25x25 mm PCB footprint, the junction-to-ambient thermal resistance (theta_JA) lands around 18-22 C/W with an 8-layer board and 4-layer PCB it climbs to 32 C/W. Place bulk decoupling within 5 mm of the BGA-substrate edge to avoid supply droop during CPM DMA bursts.
The BGA requires X-ray inspection or 3D solder-paste inspection (SPI) for production-quality solder-joint verification because the solder balls are hidden beneath the package. Use ENIG or immersion-silver PCB finish for the 357 balls; OSP finishes have historically shown poor wetting on legacy BGA pads older than 12 months. Maintain a 0.5 mm BGA-pitch escape route with microvia-in-pad if HDI stack-up is used, otherwise stick to 0.4 mm trace/space on a 4-layer through-hole board.
Do not assume the 66 MHz label equals core-only frequency; the CLKIN pin requires an external oscillator or crystal, and the internal bus multiplier is configured in the SIU module. Out-of-reset the part boots with default PLPRCR settings that may need adjustment for the user's reference frequency. Designers must also handle the HRESET, SRESET, and PORESET sequencing correctly; floating the PORESET pin during board reset is a common cause of boot failure. EOL status means firmware errata should be cross-checked against the latest NXP MPC860 errata documents, not the silicon revision printed on the part.
Compliance-Informationen
RoHS compliance confirmed via DigiKey listing; REACH, halogen-free, and conflict-minerals status not explicitly disclosed on NXP product page or distributor listings as of 2026-10-17. AEC-Q100 not applicable (industrial/telecom MPU, not automotive grade).
