MPC860TVR50D4 vs MPC860PCZQ50D4 Vergleich
Detaillierter Direktvergleich von MPC860TVR50D4 von NXP Semiconductors und MPC860PCZQ50D4 von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC860PCZQ50D4 - PowerQUICC MPC860 50MHz MPU | 357-PBGA | NXP
MPC860PCZQ50D4 ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MPC860TVR50D4 | MPC860PCZQ50D4 |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $58,00 | $58,10 |
| Core Architecture | PowerPC 32-bit | PowerPC 603 (32-bit, no FPU) |
| Core Count | 1 | — |
| Maximale Taktfrequenz | 50 MHz | — |
| Operating Supply Voltage (Core) | 3.3 V | — |
| Operating Supply Voltage (I/O) | 3.3 V | — |
| Gehäuse / Bauform | 357-PBGA (25x25 mm) | — |
| Process Technology | 0.32 µm CMOS | 0.32 micron CMOS |
| Instruction Cache | 4 Kbyte | 4 Kbyte |
| Data Cache | 4 Kbyte | 4 Kbyte |
| Integrated Communications Module (CPM) | Yes (SCC, SMC, SPI, I²C, UART) | — |
| PCMCIA Interface | Yes (Type I/II) | — |
| Memory Controller | DRAM, SRAM, EPROM, Flash | — |
| Betriebstemperaturbereich | -40°C to +95°C | -40C to +85C (industrial, 'PC' suffix) |
| Montageart | Surface Mount (BGA) | Surface Mount (BGA) |
| Series | MPC8xx PowerQUICC | — |
| RoHS-Status | [DATA_NEEDED: rohs compliance] | Non-Compliant (contains lead) |
| Lead-Free / Reflow Profile | [DATA_NEEDED: reflow profile] | — |
| Processor Type | — | MPC8xx PowerQUICC 32-Bit MPU |
| Core Frequency | — | 50 MHz |
| Number of Cores | — | 1 (CPU + CPM RISC engine) |
| Operating Voltage - I/O | — | 3.3 V |
| Internal Core Voltage | — | 2.2 V or 1.8 V (selection required) |
| MMU | — | Yes (32-bit virtual addressing) |
| On-chip Ethernet MAC | — | 2x 10/100 Mbps (MII interface) |
| Gehäuse | — | 357-PBGA (25x25 mm) |
| Lead Status | — | Contains Lead |
| Lebenszyklusstatus | — | End of Life |