MPC866TZP133A vs MPC859TVR133A Vergleich
Detaillierter Direktvergleich von MPC866TZP133A von NXP Semiconductors und MPC859TVR133A von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
NXP Semiconductors
MPC866TZP133A - MPC8xx PowerQUICC 133MHz BGA Processor | NXP
MPC866TZP133A ObsoleteNXP Semiconductors
MPC859TVR133A - 133MHz PowerQUICC MPU, 32-Bit | NXP | 357-PBGA
MPC859TVR133A ✗ AbgekündigtSpezifikationsvergleich
| Parameter | MPC866TZP133A | MPC859TVR133A |
|---|---|---|
| Marke | NXP Semiconductors | NXP Semiconductors |
| Kategorie | Microcontrollers | Microcontrollers |
| Lebenszyklusstatus | Obsolete | Ende des Lebenszyklus |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $25,40 | $54,10 |
| Core Processor | MPC8xx Power Architecture (32-bit) | — |
| Core Speed | 133 MHz | — |
| External Bus Speed | 66 MHz | — |
| Number of Cores | 1 Core, 32-Bit | 1 |
| Co-Processors / DSP | Communications Processor Module (CPM) | — |
| Core Supply Voltage | 1.8 V | — |
| I/O Supply Voltage | 3.3 V (5 V TTL tolerant inputs) | — |
| Process Technology | 0.18 µm CMOS | — |
| Gehäuse | 357-PBGA (25x25 mm, 1.0 mm pitch) | — |
| Ethernet MACs | 4 x 10/100 Mbps + 2 x 10 Mbps | — |
| RAM Controllers | DRAM (up to 16 banks), SRAM, EPROM, Flash | — |
| Graphics Acceleration | No | — |
| Betriebstemperatur | 0 °C to +95 °C | 0C to +95C (commercial/industrial grade) |
| Lead Free Status | Contains Lead | — |
| RoHS-Status | Non-Compliant (contains lead - per datasheet) | See manufacturer PCN (legacy status) |
| Part Status | Obsolete | — |
| Packaging | Tray | — |
| Manufacturer | — | NXP Semiconductors (formerly Freescale Semiconductor) |
| Series | — | PowerQUICC, MPC8xx family |
| Core Architecture | — | Power Architecture (32-bit) |
| Core / Series Name | — | MPC8xx |
| Maximale Taktfrequenz | — | 133 MHz |
| Datenbusbreite | — | 32 bit |
| Package Type | — | 357-PBGA (Plastic Ball Grid Array) |
| Package Dimensions | — | 25 x 25 mm |
| On-Chip Cache | — | 8 KB instruction / 8 KB data (per datasheet family) |
| Communication Channels | — | 4 SCC, 2 SMC, 1 FCC (typical MPC859T configuration) |
| Peripheral Interfaces | — | SPI, I2C, PCMCIA, IDMA, UART |
| Montageart | — | Surface Mount (BGA) |
| Lifecycle | — | End-of-Life per NXP product page |